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Game Console
In game consoles, thermal interface materials (TIMs) build low-thermal-resistance heat paths to handle sustained gaming loads. Sheen’s thermal pads (gap fillers), gels/greases, phase change materials, and heat spreaders transfer heat from the APU/CPU/GPU and VRMs to heat sinks, vapor chambers, or the chassis.
These solutions reduce hotspots, help prevent throttling and frame drops, improve long-term reliability under thermal cycling, and lower surface temperature rise for a better user experience.
Overview
Game Console (TIMs) Solutions
Game consoles generate concentrated heat at the APU/CPU/GPU, VRMs, and memory during long gaming sessions. Poor thermal contact can lead to throttling, higher noise, and reduced reliability.
Sheen TIMs help lower thermal resistance, suppress hotspots, and keep performance stable for long-session gameplay.
Benefits
Thermal Materials for Stable Console Performance
Lower Hotspots, Prevent Throttling
Improve heat transfer from the APU/CPU/GPU and VRMs—reducing throttling and keeping frame rates stable.
Reliable Contact in Tight Stack-Ups
Conformable pads and gels bridge tolerance gaps and uneven surfaces—maintaining low thermal resistance in compact builds.
Quieter Cooling, Better User Comfort
Lower interface resistance helps reduce fan ramp and surface temperature rise—supporting quieter, more comfortable gameplay.
Fast Sampling + Scalable Production
Custom thickness/hardness/size with die-cut parts and quick sampling—speeding design-in and mass production.
Related Products
Discover product categories commonly used in this application. You can replace these cards with your own thermal materials, TIMs, foams, tapes, or soldering-related products.
Thermal Pads
Soft, conformable thermal pads for gap filling and reliable heat transfer in electronics.
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Thermal Grease
High-efficiency thermal grease solutions for CPUs, power modules, and industrial assemblies.
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Silicone Foam
Foam materials for sealing, cushioning, insulation, and fire-barrier applications.
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Thermal Tape
PSA laminated thermal tapes for fast assembly and consistent thermal interface bonding.
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Graphite Sheet
High in-plane conductivity graphite materials for heat spreading in compact devices.
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EMI Absorbers
EMI absorbing materials to reduce interference and improve signal integrity in electronics.
Browse ›Related Applications
Cell Phone
Ultra-thin thermal interfaces reduce hotspots and surface temperature rise in high-density designs.
Related Markets for High-Performance Consumer Electronics
Explore related markets where TIMs help control hotspots and maintain stable performance in compact, high-load devices.
