Single-Component Thermal Conductive Gel

  • AE Series Silicone-Free Single-Part Thermal Gel (Thermal Putty) offers thermal conductivity of 1.0 to 3.0 W/m·K, ensuring low thermal resistance and high flexibility.
  • This one-component, non-curing thermal gel provides excellent wet-out, compressibility, and extrusion properties.
  • Ideal for filling gaps between heat-generating components and heat sinks, it eliminates risks of silicone oil bleed and siloxane volatility.
  • Perfect for applications with complex gap thicknesses, it allows precise control of thickness and shape using automated dispensing equipment.
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