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Graphene Thermal Pad GSF90-03
주요 이점
- Ultra-high thermal conductivity for rapid heat removal from chip-level hot spots
- Very low interface thermal resistance for faster and more efficient heat transfer
- High rebound and soft conformability for improved surface contact and gap filling
- Stable performance in harsh environments with low bleeding and aging resistance
- No pump-out during use for better long-term interface reliability
- Suitable for compact, high-heat-flux systems with demanding thermal loads
Graphene Thermal Pad GSF90-03
90 W/m·K Graphene Thermal Pad for Ultra-High Heat Flux, Low Thermal Resistance, and Stable Interface Contact
GSF90-03 is a high-conductivity, low-thermal-resistance graphene thermal pad designed for high-power thermal-management applications. With graphene as the primary thermal filler, vertically oriented alignment and laminated composite processing form efficient through-plane heat-transfer channels, helping remove heat rapidly from compact, high-heat-flux systems.
GSF90-03
0.3 mm Main Model
Thermal Conductivity 90 W/m·K
Thermal Resistance ≤0.10 °C·cm²/W @40 psi
Rebound Rate ≥90%
UL94 V-0
0.3 mm Main Model
Thermal Conductivity 90 W/m·K
Thermal Resistance ≤0.10 °C·cm²/W @40 psi
Rebound Rate ≥90%
UL94 V-0
Series Snapshot
모델
GSF90-03
GSF90-03
색상
Black
Black
두께 범위
0.3–2.0 mm
0.3–2.0 mm
밀도
0.3–0.7 g/cm³
0.3–0.7 g/cm³
기술 정보
Review the product positioning, core parameters, interface behavior, long-term stability, and application fit for GSF90-03 graphene thermal pad.
Q1
What is GSF90-03 designed for?
GSF90-03 is designed for high-power thermal-management applications where very high heat flux, compact structure, and low interface resistance all need to be addressed at the same time. Its vertically oriented graphene alignment is intended to create efficient through-plane heat-transfer channels.
Ultra-High Heat Flux Direction
Built for systems that generate concentrated chip-level hot spots and need rapid heat evacuation.
Through-Plane Heat Path
The product uses vertically oriented alignment and laminated composite processing to strengthen heat flow in the thickness direction.
Soft Conformable Contact
Softness and compressibility help the pad adapt to complex mounting surfaces and improve real contact area.
장기적인 안정성
The datasheet emphasizes dimensional stability, low bleeding, and no pump-out during use.
Q2
What are the core technical data for GSF90-03?
The table below reflects the currently published updated datasheet values for the GSF90-03 graphene thermal pad.
| 속성 | 테스트 방법 | GSF90-03 |
|---|---|---|
| 열 전도성 | ASTM E1461 | 90 W/m·K |
| Thermal Resistance (@40 psi) | ASTM D5470 | ≤0.10 °C·cm²/W |
| 적용 온도 | / | -40 to 150°C |
| Rebound Rate | / | ≥90% |
| Tensile Strength (Oriented Direction) | ASTM D412 | ≥0.05 MPa |
| 색상 | 시각적 | Black |
| 두께 | ASTM D374 | 0.3–2.0 mm |
| 밀도 | ASTM D792 | 0.3–0.7 g/cm³ |
| Oil Bleeding Rate | / | ≤3% |
| 인화성 | UL94 | V-0 |
| Compliance | / | RoHS 2.0 / Halogen-Free / REACH |
Q3
What interface-contact and reliability strengths does GSF90-03 emphasize?
The datasheet positions GSF90-03 as a low-resistance, soft, and stable interface material for harsh environments and long-term high-load operation.
Low Interface Resistance
Extremely low interface resistance helps support fast and efficient heat transfer under compression.
Soft and Conformable Fit
The material adapts to complex mounting surfaces and helps reduce contact thermal resistance.
High Rebound Stability
High rebound supports more stable interface fitting and helps maintain contact under service pressure.
Harsh-Environment Reliability
Low bleeding and aging resistance help maintain performance under long-term full-load operation and thermal cycling.
Q4
How should GSF90-03 be stored and supplied?
The current datasheet provides simple storage and packaging guidance for samples and production preparation.
패키징
Customized packaging is available according to customer requirements.
Storage Conditions
Store in a cool, dry place.
Storage temperature: ≤30°C
Storage humidity: ≤75% RH
유통 기한
12 months from date of manufacture under recommended storage conditions.
Production Note
Users should verify material suitability and process compatibility before production use.
Q5
Which applications fit GSF90-03 best?
The updated datasheet focuses this product on compact, high-heat-flux electronic systems where thermal efficiency and interface stability are both critical.
Artificial Intelligence Chips
Suitable for AI chip thermal interfaces that need fast heat dissipation from concentrated hot spots.
Intelligent Driving Chips / Communication Equipment
A good fit for compact electronics requiring stable contact and efficient heat flow under long-term load.
Optical Modules
Applicable to optical-module assemblies that benefit from low bleeding and stable dimensional behavior.
Aerial Drones / Humanoid Robots / Semiconductor Testing
Suitable for compact, high-performance electronic structures with demanding thermal-management requirements.
다운로드 및 FAQ
Technical Resources
Frequently Asked Questions
Q1. What is the main reason to choose GSF90-03?
The main reason is to combine 90 W/m·K thermal conductivity with very low interface resistance and strong rebound in one soft graphene thermal pad.
Q2. Is GSF90-03 suitable only for AI chips?
No. The updated datasheet also lists intelligent driving chips, optical modules, communication equipment, aerial drones, humanoid robots, and semiconductor testing among the typical applications.
Q3. What long-term reliability characteristics are emphasized?
The datasheet emphasizes low bleeding, no pump-out, aging resistance, and stable performance under long-term full-load operation and thermal cycling.
Q4. What storage conditions are recommended?
Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75% RH.
Q5. What is the shelf life of GSF90-03?
The current datasheet lists a shelf life of 12 months under recommended storage conditions.
