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Graphene Thermal Pad GSF75-03

Graphene Thermal Pad GSF75-03

주요 이점

  • Ultra-high thermal conductivity for fast heat removal from chip-level hot spots
  • Low interface thermal resistance for efficient heat transfer under compression
  • High rebound and soft conformity for improved surface contact and fit
  • Stable weather-resistant reliability for long-term full-load operation and thermal cycling
  • No pump-out during use for more stable long-term interface performance
  • Well suited to compact, high-power, high-heat-flux electronic systems
제품 문의
SKU: GSF75-03 카테고리: 브랜드:
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Graphene Thermal Pad GSF75-03

75 W/m·K Graphene Thermal Pad for High Heat Flux, Low Thermal Resistance, and Stable Interface Contact

GSF75-03 is a high-conductivity, low-thermal-resistance graphene thermal pad engineered for demanding thermal-management applications. Using graphene as the primary heat-conductive filler, vertically oriented alignment and laminated composite construction create efficient through-plane thermal pathways. The material helps move heat quickly in high-power systems such as base stations, automotive domain controllers, and compute chips, while maintaining strong rebound, good conformity, and dimensional stability.

GSF75-03
0.3 mm Main Model
Thermal Conductivity 75 W/m·K
Thermal Resistance ≤0.12 °C·cm²/W @40 psi
Rebound Rate ≥90%
UL94 V-0

Series Snapshot
모델
GSF75-03
색상
Black
두께 범위
0.3–2.0 mm
밀도
0.3–0.7 g/cm³

기술 정보

Review the product positioning, core parameters, interface behavior, long-term stability, and application fit for GSF75-03 graphene thermal pad.

Q1

What is GSF75-03 designed for?

GSF75-03 is designed for demanding thermal-management applications where fast heat transfer, compact structure, and stable long-term interface contact are all important. Its vertically oriented graphene alignment and laminated composite construction are intended to create efficient through-plane thermal pathways.

High-Conductivity Graphene Direction

Built around graphene as the primary heat-conductive filler to support rapid heat removal from high-power systems.

Through-Plane Heat Path

Vertically oriented alignment and laminated composite construction help strengthen heat flow through the thickness direction.

Soft Conformable Contact

The material provides strong rebound, good conformity, and stable dimensional behavior for better interface fitting.

장기적인 안정성

The datasheet emphasizes weather resistance, low outgassing, aging resistance, and no pump-out under use.

Q2

What are the core technical data for GSF75-03?

The table below reflects the currently published updated datasheet values for the GSF75-03 graphene thermal pad.

속성테스트 방법GSF75-03
열 전도성ASTM E146175 W/m·K
Thermal Resistance (@40 psi)ASTM D5470≤0.12 °C·cm²/W
적용 온도/-40 to 150°C
Rebound Rate/≥90%
Tensile Strength (Oriented Direction)ASTM D412≥0.03 MPa
색상시각적Black
두께ASTM D3740.3–2.0 mm
밀도ASTM D7920.3–0.7 g/cm³
Oil Bleeding Rate/≤3%
Compliance/RoHS 2.0 / Halogen-Free / REACH
인화성UL94V-0

Q3

What interface-contact and reliability strengths does GSF75-03 emphasize?

The datasheet positions GSF75-03 as a low-resistance, soft, and stable interface material for harsh environments and long-term high-load operation.

Low Interface Resistance

Low interface resistance helps support fast and efficient heat transfer under assembly pressure.

Soft and Conformable Fit

The material provides excellent surface contact and fit to reduce contact thermal resistance.

High Rebound Stability

High rebound supports more stable interface fitting and helps maintain compression contact during service.

Weather-Resistant Reliability

Low outgassing, aging resistance, and no pump-out help maintain performance under long-term full-load operation and thermal cycling.

Q4

How should GSF75-03 be stored and supplied?

The current datasheet provides simple storage and packaging guidance for samples and production preparation.

패키징

Customized packaging is available according to customer requirements.

Storage Conditions

Store in a cool, dry place.
Storage temperature: ≤30°C
Storage humidity: ≤75% RH

유통 기한

12 months from date of manufacture under recommended storage conditions.

Production Note

Users should verify material suitability and process compatibility before production use.

Q5

Which applications fit GSF75-03 best?

The updated datasheet focuses this product on high-power electronic systems where fast heat removal and interface stability are both required.

Semiconductor Testing

Suitable for semiconductor test structures that need stable heat transfer and reliable interface contact.

AI Chips / Compute Chips

A good fit for AI and compute-chip thermal interfaces that need rapid heat dissipation from chip-level hot spots.

Intelligent Driving Chips / Optical Modules

Applicable to compact electronic assemblies where surface conformity and stable thermal contact are important.

Communication Equipment / Aerial Drones / Humanoid Robots

Suitable for compact, high-performance electronic systems operating under demanding thermal loads.

다운로드 및 FAQ

Frequently Asked Questions
Q1. What is the main reason to choose GSF75-03?
The main reason is to combine 75 W/m·K thermal conductivity with low interface resistance, high rebound, and stable long-term fit in one soft graphene thermal pad.
Q2. Is GSF75-03 suitable only for base stations or power equipment?
No. The updated datasheet also lists semiconductor testing, AI chips, intelligent driving chips, optical modules, communication equipment, aerial drones, and humanoid robots among the typical applications.
Q3. What long-term reliability characteristics are emphasized?
The datasheet emphasizes weather resistance, low outgassing, aging resistance, and no pump-out during use.
Q4. What storage conditions are recommended?
Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75% RH.
Q5. What is the shelf life of GSF75-03?
The current datasheet lists a shelf life of 12 months under recommended storage conditions.

연관 상품