-
ADD： Building 2, No. 8 Hengzhutang Road, Dongguan
-
Phone： +86 135 4224 3751
SE80 Thermal Gel 8.0 W/mK
SE80 is a flexible silicone-based thermally conductive gap filler designed for large gap tolerance applications between heat-generating electronic components and heat sinks or housings. With thermal conductivity of 8.0 W/m·K, low thermal impedance, and excellent extrusion properties, it helps create close contact between surfaces, reduce interfacial thermal resistance, and improve heat dissipation efficiency.
As part of SHEEN’s SE Series 1K Thermal Gel family, SE80 combines softness, compressibility, stable dispensing performance, and reliable electrical insulation. It is especially suitable for projects that require stronger heat transfer performance, low assembly stress, and flexible gap filling in complex electronic structures.
Key Benefits
- Thermal conductivity: 8.0 W/m·K
- Low thermal impedance for efficient heat transfer
- Good flexibility and high filling rate for large gap tolerance designs
- Excellent extrusion properties and stable dispensing performance
- Suitable for manual application or automated dispensing
- Reliable electrical insulation performance
- Excellent flame resistance, UL94 V-0
- Available in 30cc / 300cc packaging
- Compliant with RoHS, Halogen-Free, and REACH requirements
Technical Information
Review the key specifications, recommended applications, installation notes, and downloadable files for SE80.
Specifications
| Property | SE80 | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Thermal Conductivity | 8.0 W/m·K | ASTM D5470 |
| Thermal Impedance (@30 psi) | 0.05 ℃·in²/W | ASTM D5470 |
| Flow Rate (@30cc, 90 psi) | 30 ± 5 g/min | – |
| Electrical Insulation | Reliable insulation performance | – |
| Flammability | UL94 V-0 | UL94 |
| Dielectric Strength | Up to 8 kV/mm | – |
| RoHS | Compliant | – |
| Halogen-Free | Compliant | – |
| REACH | Compliant | – |
| Packaging | 30cc / 300cc | – |
| Shelf Life | 12 months | – |
Applications
Recommended Applications
- CPUs and GPUs
- Power supply units (PSUs)
- LED modules
- Engine control units (ECUs)
- Gaming consoles and laptops
- Complex gap thickness electronic assemblies
Not Recommended For
- Ultra-thin bond line applications that require grease-like spreadability
- Rigid sheet-format interfaces where a pad material is preferred
- Designs requiring structural adhesion instead of flexible gap filling
Installation Notes
- SE80 is suitable for large gap tolerance applications that require soft and compressible thermal filling.
- It can be precisely controlled for thickness and shape using automated dispensing equipment.
- Use controlled dispensing to ensure tight wet-out contact between components and heat sinks.
- The material provides low assembly stress and is suitable for delicate electronic components.
- Store in a well-ventilated, cool, and dry area away from open flames.
- This product is non-toxic and should be stored and transported as a non-hazardous material.
- Shelf life: 12 months.
Downloads & FAQ
Q1. What is the main function of SE80?
SE80 is designed to fill gaps between heat-generating components and heat sinks, reducing thermal impedance while maintaining reliable contact and heat dissipation.
Q2. What is the difference between SE80 and lower-grade thermal gels?
SE80 provides a higher thermal conductivity grade at 8.0 W/m·K while keeping the SE series benefits of softness, low assembly stress, and stable dispensing behavior.
Q3. Is SE80 suitable for manual application or only automated dispensing?
SE80 supports precise thickness and shape control via automated dispensing, and can also be used in processes that require controlled manual application.
Q4. What applications is SE80 suitable for?
SE80 is suitable for CPUs, GPUs, PSUs, LED modules, ECUs, gaming consoles, laptops, and other assemblies with complex gap thicknesses.
Q5. What packaging options are available for SE80?
SE80 is available in 30cc and 300cc packaging, with a shelf life of 12 months under recommended storage conditions.
