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SE500AB Two-Component Thermal Gel 5.0 W/mK
SE500AB is a flexible two-component silicone resin-based thermally conductive gap filler developed for small-gap tolerance applications between heat-generating components and heat sinks or housings. After mixing and curing, it forms a soft elastomer that maintains interface thickness, provides reliable shock absorption, and improves thermal contact between mating surfaces. :contentReference[oaicite:0]{index=0}
With thermal conductivity of 5.0 W/m·K, low thermal impedance, and superior extrusion properties, SE500AB helps reduce contact thermal resistance and enhances heat dissipation efficiency in electronic assemblies. It is suitable for projects that require controlled dispensing, good flexibility after curing, and reliable insulation performance. :contentReference[oaicite:1]{index=1}
Key Benefits
- Two-component silicone resin-based thermal gel for controlled curing applications
- Thermal conductivity: 5.0 W/m·K
- Low thermal impedance for efficient heat transfer
- Soft and elastic after curing, with reliable shock absorption
- Suitable for small-gap tolerance thermal interface designs
- Precise thickness and shape control through automated dispensing equipment
- High electrical insulation, with dielectric strength up to 8 kV/mm
- Excellent flame resistance, UL94 V-0
- Compliant with RoHS, Halogen-Free, and REACH requirements
Technical Information
Review the key specifications, recommended applications, installation notes, and downloadable files for SE500AB.
Specifications
| Property | SE500AB | Test Method |
|---|---|---|
| Product Type | Two-part Thermal Gel / Thermal Putty | / |
| Thermal Conductivity | 5.0 W/m·K | ASTM D5470 |
| Flow Rate (@50cc, 90 psi) | 15 ± 5 g/min | / |
| Mix Ratio | 1:1 | / |
| Color Before Curing | Part A: White / Part B: Pink / Mixing: Pink | Visual |
| Density | 3.1 ± 0.2 g/cc | Helium Pycnometry |
| Color After Curing | Pink | Visual |
| Hardness After Curing | Shore 00 45 ~ 65 | ASTM D2240 |
| Tack-Free Time (@25℃) | ≥ 60 min | / |
| Full Cure Time (@25℃) | 1 h | / |
| Full Cure Time (@100℃) | ≥ 10 min | / |
| Minimum Interface Thickness | 0.15 mm | / |
| Operating Temperature | -40 ~ 150℃ | / |
| Dielectric Strength (@AC) | ≥ 10 kV/mm | ASTM D149 |
| Dielectric Constant (@1MHz) | 7.5 | ASTM D150 |
| Volume Resistivity | >1012 Ω·cm | ASTM D257 |
| Coefficient of Thermal Expansion | 175 ppm/K | ASTM E831 |
| Flame Rating | V-0 | UL94 |
| RoHS | PASS | IEC 62321 |
| Halogen | PASS | EN 14582 |
| REACH | PASS | EN 14372 |
| Shelf Life (@25℃) | 6 months | / |
Applications
Recommended Applications
- CPUs and GPUs
- Power Supply Units (PSUs)
- LED Modules
- Engine Control Units (ECUs)
- Gaming Consoles and Laptops
- Electronic assemblies with small-gap tolerances
Not Recommended For
- Ultra-thin bond line interfaces that require grease-like spreadability
- Large-gap tolerance designs where 1K thermal gel is more suitable
- Applications requiring non-curing interface materials
- Structures that need sheet-format pads instead of dispensed gel
Installation Notes
- SE500AB is suitable for small-gap tolerance thermal interface applications that require controlled curing and elastomeric support after mixing.
- Part A and Part B should be mixed at a 1:1 ratio before application.
- The material can be precisely controlled for thickness and shape using automated dispensing equipment.
- After curing, it forms a soft elastomer that maintains interface thickness and provides reliable shock absorption.
- Store in a well-ventilated, cool, and dry area away from open flames.
- This product is non-toxic and should be stored and transported as a non-hazardous material.
- Available packaging includes 50cc and 400cc cartridges.
- Shelf life: 6 months.
Downloads & FAQ
Q1. What is the main function of SE500AB?
SE500AB is designed to fill small gaps between heat-generating components and heat sinks or housings, reducing interfacial thermal resistance while providing reliable electrical insulation and post-cure elastomeric shock absorption.
Q2. What is the difference between SE500AB and the 1K SE thermal gel series?
SE500AB is a two-component thermal gel that requires mixing before application and cures to form a soft elastomer. Compared with the 1K SE series, it is more suitable for applications that require controlled curing, stable interface thickness, and post-cure shock absorption.
Q3. What is the mix ratio of SE500AB?
The recommended mix ratio is 1:1 for Component A and Component B.
Q4. What applications is SE500AB suitable for?
SE500AB is suitable for CPUs, GPUs, PSUs, LED modules, ECUs, gaming consoles, laptops, and other electronic assemblies with small-gap tolerances.
Q5. What packaging options are available for SE500AB?
SE500AB is available in 50cc and 400cc packaging, with a shelf life of 6 months under recommended storage conditions.
