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Carbon Fiber Thermal Pad CSF35
Principais benefícios
- High thermal conductivity for fast heat transfer away from chip-level hot spots
- Low interface thermal resistance and low loss for efficient heat dissipation
- High compressibility for soft, conformable fitting on uneven contact surfaces
- Fast, low-resistance heat dissipation helps improve device efficiency and operating stability
- Flexible fit and easy assembly help lower contact thermal resistance and reduce assembly damage risk
- Suitable for demanding electronics, communication modules, and testing applications
Carbon Fiber Thermal Pad CSF35
35 W/m·K High-Rebound Carbon Fiber Thermal Pad for Low Thermal Resistance and Efficient Through-Plane Heat Transfer
CSF35 is a high-rebound carbon fiber thermal pad engineered with advanced vertically aligned carbon-fiber architecture for excellent through-plane heat transfer. With thermal conductivity up to 35.0 W/m·K, low thermal resistance, and stable thermal performance, it efficiently transfers heat between heat-generating components and heat sinks or cooling modules.
CSF35
35 W/m·K
Thermal Resistance 0.09 °C·in²/W @20 psi
High-Rebound Carbon Fiber Pad
0.3–12.0 mm
UL94 V-0
35 W/m·K
Thermal Resistance 0.09 °C·in²/W @20 psi
High-Rebound Carbon Fiber Pad
0.3–12.0 mm
UL94 V-0
Series Snapshot
Modelo
CSF35
CSF35
Cor
Black
Black
Thickness Range
0.3–12.0 mm
0.3–12.0 mm
Densidade
2.6 ± 0.2 g/cm³
2.6 ± 0.2 g/cm³
Informações técnicas
Review the product positioning, core parameters, compression behavior, and application fit for CSF35 carbon fiber thermal pad.
Q1
What is CSF35 designed for?
CSF35 is designed for thermal-interface applications that need strong through-plane heat transfer, low interface thermal resistance, and soft conformable contact. Its vertically aligned carbon-fiber architecture is intended to provide an efficient thermal path between heat-generating components and heat sinks or cooling modules.
Vertically Aligned Carbon-Fiber Direction
Built with advanced vertically aligned carbon-fiber architecture for efficient through-plane heat conduction.
Low Thermal Resistance Interface
Designed to reduce interface resistance and support faster, more efficient heat transfer.
Soft and Conformable Fit
High compressibility helps the material fit uneven contact surfaces more effectively.
Assembly-Friendly Protection
Flexible fit helps protect components from assembly damage while lowering contact thermal resistance.
Q2
What are the core technical data for CSF35?
The table below reflects the currently published updated datasheet values for the CSF35 carbon fiber thermal pad.
| Imóveis | Método de ensaio | CSF35 |
|---|---|---|
| Condutividade térmica | ASTM D5470 | 35 W/m·K |
| Thermal Resistance (@20 psi) | ASTM D5470 | 0.09 °C·in²/W |
| Temperatura de aplicação | / | -40 to 150°C |
| Hardness (Shore 00) | ASTM D2240 | 60–70 |
| Resistência à tração | ASTM D412 | 30 psi |
| Cor | Visual | Black |
| Available Thickness | ASTM D374 | 0.3–12.0 mm |
| Densidade | ASTM D792 | 2.6 ± 0.2 g/cm³ |
| Inflamabilidade | UL94 | V-0 |
| Compliance | / | RoHS 2.0 / Halogen-Free / REACH |
Q3
What compression and heat-transfer strengths does CSF35 emphasize?
CSF35 is positioned as a soft, cushioning, and compressible thermal pad that lowers contact thermal resistance while supporting efficient through-plane heat transfer.
Fast Low-Resistance Heat Dissipation
35 W/m·K oriented conduction helps move heat away from chip-level hot spots for better device efficiency and operating stability.
Soft Cushioning Contact
Soft, cushioning, and compressible construction helps the pad adapt to complex mounting surfaces.
Lower Contact Thermal Resistance
The product is intended to reduce interface resistance and support faster, more efficient heat transfer.
Assembly-Friendly Fit
The material installs cleanly and helps protect components from assembly damage.
Q4
How should CSF35 be stored and supplied?
The updated datasheet provides simple storage, packaging, and shelf-life guidance for customer projects and sample use.
Embalagem
Customized packaging is available according to customer requirements.
Storage Conditions
Store in a cool, dry place.
Storage temperature: ≤30°C
Storage humidity: ≤75% RH
Prazo de validade
12 months from the date of manufacture when stored under recommended conditions.
Production Note
Users should verify material suitability and process compatibility before use in production.
Q5
Which applications fit CSF35 best?
The updated datasheet focuses this product on electronics and test applications that need efficient thermal transfer with soft contact and easy installation.
Chip Testing
Suitable for chip-testing structures that need efficient heat transfer and stable interface contact.
Capacitors
Applicable to capacitor thermal-management structures requiring low interface resistance and conformable fitting.
Optical Modules
A good fit for optical-module assemblies where soft contact and reliable heat dissipation are both important.
5G Base-Station RRU / Thermal-Module Testing
Suitable for communication hardware and thermal-module testing structures with demanding thermal-management requirements.
Transferências e FAQ
Technical Resources
Frequently Asked Questions
Q1. What is the main reason to choose CSF35?
The main reason is to combine 35 W/m·K thermal conductivity with low interface thermal resistance, soft conformable contact, and easy assembly in one carbon fiber thermal pad.
Q2. Is CSF35 suitable only for chip testing?
No. The updated datasheet also lists capacitors, optical modules, 5G base-station RRU, and thermal-module testing among the typical applications.
Q3. What thermal-resistance level is listed?
The current datasheet lists thermal resistance of 0.09 °C·in²/W at 20 psi.
Q4. What storage conditions are recommended?
Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75% RH.
Q5. What is the shelf life of CSF35?
The current datasheet lists a shelf life of 12 months under recommended storage conditions.
