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Carbon Fiber Thermal Pad CSF30
주요 이점
- High thermal conductivity for fast heat transfer away from chip-level hot spots
- Low thermal resistance and low thermal loss for efficient interface heat transfer
- High compressibility for soft, conformable fitting on uneven contact surfaces
- Efficient heat dissipation helps improve device operating efficiency and stability
- Flexible fit and easy assembly help lower contact thermal resistance
- Helps reduce component damage risk during installation
Carbon Fiber Thermal Pad CSF30
30 W/m·K High-Rebound Carbon Fiber Thermal Pad for Low Thermal Resistance and Efficient Through-Plane Heat Transfer
CSF30 is a high-rebound carbon fiber thermal pad designed with advanced vertically aligned carbon fiber technology. It provides efficient through-plane heat transfer for chip-level thermal management. With thermal conductivity up to 30.0 W/m·K, low thermal resistance, and stable thermal performance, it helps move heat efficiently from heat-generating components to heat sinks or thermal modules.
CSF30
30 W/m·K
Thermal Resistance 0.1 °C·in²/W @20 psi
High-Rebound Carbon Fiber Pad
0.3–12.0 mm
UL94 V-0
30 W/m·K
Thermal Resistance 0.1 °C·in²/W @20 psi
High-Rebound Carbon Fiber Pad
0.3–12.0 mm
UL94 V-0
Series Snapshot
모델
CSF30
CSF30
색상
Black
Black
두께 범위
0.3–12.0 mm
0.3–12.0 mm
밀도
2.6 ± 0.2 g/cm³
2.6 ± 0.2 g/cm³
기술 정보
Review the product positioning, core parameters, compression behavior, and application fit for CSF30 carbon fiber thermal pad.
Q1
What is CSF30 designed for?
CSF30 is designed for thermal-interface applications that require efficient through-plane heat transfer, low interface thermal resistance, and soft conformable fitting. Its vertically aligned carbon fiber technology is intended to create a stable thermal path between heat-generating devices and heat sinks or thermal modules.
Vertically Aligned Carbon Fiber Direction
Built with advanced vertically aligned carbon fiber technology for efficient through-plane heat transfer.
Low Thermal Resistance Interface
Designed to support fast and efficient heat transfer across the interface.
Soft and Conformable Fit
High compressibility makes the material easier to fit across uneven or complex mating surfaces.
Assembly-Friendly Protection
The cushioning structure helps lower installation risk and reduce component damage during assembly.
Q2
What are the core technical data for CSF30?
The table below reflects the currently published updated datasheet values for the CSF30 carbon fiber thermal pad.
| 속성 | 테스트 방법 | CSF30 |
|---|---|---|
| 열 전도성 | ASTM D5470 | 30 W/m·K |
| Thermal Resistance (@20 psi, 1 mm) | ASTM D5470 | 0.1 °C·in²/W |
| 적용 온도 | / | -40 to 150°C |
| Hardness (Shore 00) | ASTM D2240 | 60–70 |
| 인장 강도 | ASTM D412 | 30 psi |
| 색상 | 시각적 | Black |
| Available Thickness | ASTM D374 | 0.3–12.0 mm |
| 밀도 | ASTM D792 | 2.6 ± 0.2 g/cm³ |
| 인화성 | UL94 | V-0 |
| Compliance | / | RoHS 2.0 / Halogen-Free / REACH |
Q3
What compression and heat-transfer strengths does CSF30 emphasize?
CSF30 is positioned as a soft, cushioning, and compressible thermal pad that lowers contact thermal resistance while supporting efficient through-plane heat transfer.
Fast Efficient Heat Transfer
30 W/m·K conductivity helps move heat away from chip hot spots and improve device stability.
Soft Cushioning Contact
The soft, cushioning, and compressible structure adapts well to complex mating surfaces.
Lower Contact Thermal Resistance
Low interface resistance supports faster and more efficient heat transfer across the contact area.
Installation Protection
The flexible fit helps prevent component damage during installation while improving contact efficiency.
Q4
How should CSF30 be stored and supplied?
The updated datasheet provides simple storage, packaging, and shelf-life guidance for customer projects and sample use.
패키징
Customized packaging available upon request.
Storage Conditions
Store in a cool, dry place.
Storage temperature: ≤30°C
Storage humidity: ≤75%
유통 기한
12 months under the recommended storage conditions.
Production Note
Users should verify material suitability and compatibility in their own production process before use.
Q5
Which applications fit CSF30 best?
The updated datasheet focuses this product on electronics and test applications that need efficient thermal transfer with soft contact and easy installation.
Chip Testing
Suitable for chip-testing structures that need efficient heat transfer and stable interface contact.
Capacitors
Applicable to capacitor thermal-management structures requiring low interface resistance and conformable fitting.
Optical Modules
A good fit for optical-module assemblies where soft contact and reliable heat dissipation are both important.
5G Base Station Radio Remote Units (RRUs) / Thermal Module Testing
Suitable for communication hardware and thermal-module testing structures with demanding thermal-management requirements.
다운로드 및 FAQ
Technical Resources
Frequently Asked Questions
Q1. What is the main reason to choose CSF30?
The main reason is to combine 30 W/m·K thermal conductivity with low thermal resistance, soft conformable contact, and easy assembly in one carbon fiber thermal pad.
Q2. Is CSF30 suitable only for chip testing?
No. The updated datasheet also lists capacitors, optical modules, 5G base station radio remote units, and thermal module testing among the typical applications.
Q3. What thermal-resistance level is listed?
The current datasheet lists thermal resistance of 0.1 °C·in²/W at 20 psi for 1 mm thickness.
Q4. What storage conditions are recommended?
Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75%.
Q5. What is the shelf life of CSF30?
The current datasheet lists a shelf life of 12 months under the recommended storage conditions.
