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SP205A-30 Pad termico a cambiamento di fase 3,0W/mK
SP205A-30 3.0 W/m·K Phase Change Thermal Pads are solid at room temperature and feature self-adhesive properties for easy handling. When the temperature reaches the phase change range of 45–55℃, the pads soften and transition to a liquid state.
Delivering wet-out performance comparable to thermal paste, they effectively fill gaps between heat sinks and electronic components. Custom die-cut into any shape per customer requirements, these pads offer convenience, high reliability, and straightforward application
Informazioni tecniche
Specifiche tecniche
| Proprietà | SP205A-30 | Metodo di prova |
|---|---|---|
| Colore | Grigio | Visivo |
| Conduttività termica | 3.0 W/m·K | ASTM D5470 |
| Thermal Impedance (@50 psi) | 0,05 ℃-in²/W | ASTM D5470 |
| Spessore | 0.20 mm | ASTM D751 |
| Customized Thickness | 0.13 ~ 0.5 mm | - |
| Thickness Tolerance | ±20% | - |
| Densità | 2.85 g/cm³ | ASTM D792 |
| Phase Change Temp. | 45 ~ 55℃ | - |
| Temperatura di esercizio. | -40 ~ 125℃ | - |
| Costante dielettrica (@1MHz) | 3.0 | ASTM D150 |
| Resistività di volume | 2.0 × 10¹⁰ Ω·m | ASTM D257 |
| RoHS | PASSO | IEC 62321 |
| Alogeno | PASSO | EN 14582 |
| RAGGIUNGERE | PASSO | EN 14372 |
Applicazioni
Applicazioni consigliate
- High-frequency microprocessors
- Laptops & desktop computers
- Computer servers
- Memory modules
- Integrated chips (IC)
- LED lighting products
- CPU/GPU chips
- Control boards
Non consigliato per
- Large gap-filling applications
- Interfaces requiring thick compressible gap fillers
- Highly uneven interfaces without sufficient clamping pressure
Note sull'installazione
- Solid at room temperature for easier handling and assembly.
- Softens within 45–55℃ to improve interface wet-out during operation.
- No preheating required.
- Suitable for sheet form and customized die-cut form.
- Store in a cool, dry, and well-ventilated place away from open flame.
- Durata di conservazione: 12 mesi.
Download e FAQ
Q1. Is SP205A-30 solid or liquid during assembly?
It remains solid at room temperature and softens when the interface temperature reaches 45–55℃.
Q2. What thickness options are available?
Standard thickness is 0.20 mm, with custom thickness from 0.13 to 0.5 mm.
Q3. Can it be die-cut into custom shapes?
Yes, sheet size and die-cut format can be customized.
Q4. What applications is it suitable for?
It is suitable for microprocessors, servers, memory modules, ICs, LED lighting, and similar electronic interfaces.
