SP205A-30 相変化サーマルパッド 3.0W/mK
SP205A-30 3.0 W/m·K Phase Change Thermal Pads are solid at room temperature and feature self-adhesive properties for easy handling. When the temperature reaches the phase change range of 45–55℃, the pads soften and transition to a liquid state.
Delivering wet-out performance comparable to thermal paste, they effectively fill gaps between heat sinks and electronic components. Custom die-cut into any shape per customer requirements, these pads offer convenience, high reliability, and straightforward application
仕様
| プロパティ | SP205A-30 | 試験方法 |
|---|---|---|
| カラー | グレー | ビジュアル |
| 熱伝導率 | 3.0 W/m·K | ASTM D5470 |
| Thermal Impedance (@50 psi) | 0.05 ℃·in²/W | ASTM D5470 |
| 厚さ | 0.20 mm | ASTM D751 |
| Customized Thickness | 0.13 ~ 0.5 mm | - |
| Thickness Tolerance | ±20% | - |
| 密度 | 2.85 g/cm³ | ASTM D792 |
| Phase Change Temp. | 45 ~ 55℃ | - |
| Operating Temp. | -40 ~ 125℃ | - |
| 誘電率 (@1MHz) | 3.0 | ASTM D150 |
| 体積抵抗率 | 2.0 × 10¹⁰ Ω·m | ASTM D257 |
| RoHS | パス | IEC 62321 |
| ハロゲン | パス | EN 14582 |
| リーチ | パス | EN 14372 |
アプリケーション
推奨用途
- High-frequency microprocessors
- Laptops & desktop computers
- Computer servers
- Memory modules
- Integrated chips (IC)
- LED lighting products
- CPU/GPU chips
- Control boards
お勧めできない人
- Large gap-filling applications
- Interfaces requiring thick compressible gap fillers
- Highly uneven interfaces without sufficient clamping pressure
インストレーション・ノート
- Solid at room temperature for easier handling and assembly.
- Softens within 45–55℃ to improve interface wet-out during operation.
- No preheating required.
- Suitable for sheet form and customized die-cut form.
- Store in a cool, dry, and well-ventilated place away from open flame.
- 賞味期限：12ヶ月.
ダウンロードとFAQ
Q1. Is SP205A-30 solid or liquid during assembly?
It remains solid at room temperature and softens when the interface temperature reaches 45–55℃.
Q2. What thickness options are available?
Standard thickness is 0.20 mm, with custom thickness from 0.13 to 0.5 mm.
Q3. Can it be die-cut into custom shapes?
Yes, sheet size and die-cut format can be customized.
Q4. What applications is it suitable for?
It is suitable for microprocessors, servers, memory modules, ICs, LED lighting, and similar electronic interfaces.
