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Almohadillas térmicas de silicona Conductividad Serie SF
Sheen’s SF series silicone thermal pads are noted for their exceptional flexibility and compressibility, widely used to fill gaps between heating electronic components and cooling modules, effectively eliminating air and efficiently conducting heat. Their soft nature provides shock absorption and is suitable for various rough surfaces. The product’s inherent adhesiveness facilitates easy handling and allows for reuse. The thermal conductivity can reach up to 15.0 W/m·K。
The SHEEN’s SF Series Silicone Thermal Pads Conductivity are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K.
◆ Available in various thicknesses from 0.3 to 10.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K.
◆ Available in various thicknesses from 0.3 to 10.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
【Aplicaciones】
◆ Electric Vehicle Battery Management System
◆ CPU/GPU Chips
◆ Capacitors
◆ Memory/VRAM particles
◆ Control boards
◆ Splitters
◆ Relays
Propiedades
| Propiedades | Unidad | SF600G | Método de ensayo |
|---|---|---|---|
| Color | – | Gris | Visual |
| Conductividad térmica | W/m-K | 6.0 | ASTM D5470 |
| Thermal Impedance (1mm,@30psi) | ℃*in2/W | 0.30 | ASTM D5470 |
| Espesor | mm | 0.5 ~ 5.0 | ASTM D374 |
| Dureza estándar | Orilla 00 | 40/60±5 | ASTM D2240 |
| Customized Hardness | Orilla 00 | 30 ~ 90 | ASTM D2240 |
| Alargamiento | % | 30 | ASTM D412 |
| Resistencia a la tracción | psi | 30 | ASTM D412 |
| Densidad | g/cm3 | 3.1 | ASTM D792 |
| Rigidez dieléctrica (@AC) | kV/mm | > 8 | ASTM D149 |
| Constante dieléctrica (@1MHz) | – | 9.0 | ASTM D150 |
| Resistividad volumétrica | Ω-cm | 1*1013 | ASTM D257 |
| Temp. de funcionamiento. | °C | -50 ~ 200 | – |
| Grado de inflamabilidad | – | V-0 | UL94 |
| RoHS | – | PASE | CEI 62321 |
| Halógeno | – | PASE | EN 14582 |
| REACH | – | PASE | EN 14372 |
