シリコーン熱伝導パッド SFシリーズ
Sheen’s SF series silicone thermal pads are noted for their exceptional flexibility and compressibility, widely used to fill gaps between heating electronic components and cooling modules, effectively eliminating air and efficiently conducting heat. Their soft nature provides shock absorption and is suitable for various rough surfaces. The product’s inherent adhesiveness facilitates easy handling and allows for reuse. The thermal conductivity can reach up to 15.0 W/m·K。
The SHEEN’s SF Series Silicone Thermal Pads Conductivity are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K.
◆ Available in various thicknesses from 0.3 to 10.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K.
◆ Available in various thicknesses from 0.3 to 10.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
アプリケーション
◆ Electric Vehicle Battery Management System
◆ CPU/GPU Chips
◆ Capacitors
◆ Memory/VRAM particles
◆ Control boards
◆ Splitters
◆ Relays
プロパティ
| プロパティ | 単位 | SF600G | 試験方法 |
|---|---|---|---|
| カラー | – | グレー | ビジュアル |
| 熱伝導率 | W/m-K | 6.0 | ASTM D5470 |
| Thermal Impedance (1mm,@30psi) | ℃*in2/W | 0.30 | ASTM D5470 |
| 厚さ | mm | 0.5 ~ 5.0 | ASTM D374 |
| 標準硬度 | ショア00 | 40/60±5 | ASTM D2240 |
| Customized Hardness | ショア00 | 30 ~ 90 | ASTM D2240 |
| 伸び | % | 30 | ASTM D412 |
| 引張強度 | psi | 30 | ASTM D412 |
| 密度 | g/cm3 | 3.1 | ASTM D792 |
| 絶縁耐力 (@AC) | kV/mm | > 8 | ASTM D149 |
| 誘電率 (@1MHz) | – | 9.0 | ASTM D150 |
| 体積抵抗率 | Ω・cm | 1*1013 | ASTM D257 |
| Operating Temp. | °C | -50 ~ 200 | – |
| 炎の評価 | – | V-0 | UL94 |
| RoHS | – | パス | IEC 62321 |
| ハロゲン | – | パス | EN 14582 |
| リーチ | – | パス | EN 14372 |
