Non-Silicone Thermal Management for EV Battery Systems

As the “bridge” in an electronic thermal management system, thermal interface materials directly affect the service life and stability of key components such as chips and batteries. Compared with conventional silicone-based materials, non-silicone thermal products are designed for cleaner and more reliable operation in silicone-sensitive applications.

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Why Non-Silicone Thermal Pads Matter

Non-Silicone Thermal Management for EV Battery Systems and Sensitive Electronics

Non-silicone thermal pads are engineered for applications where heat transfer, cleanliness, and long-term reliability must be balanced. They are especially suitable for EV battery systems, automotive electronics, optical communication modules, SSD storage, monitoring devices, and other assemblies where silicone migration or volatile residue may create performance risk.

Developed for Silicone-Sensitive Thermal Interfaces

Traditional silicone-based thermal interface materials are widely used for gap filling and heat dissipation.

However, in contamination-sensitive assemblies such as BDU, BMS, cameras, optical modules, and storage devices, silicone oil bleed or volatile siloxanes may affect long-term system reliability.

Non-silicone thermal pads use silicone-free polymer systems to help reduce contamination risk while maintaining stable thermal transfer in compact electronic structures.

Long-Term Thermal Stability

Lower migration risk helps support more stable thermal performance during extended service and aging.

Optical Fogging Risk

Reduced volatile residue helps protect optical surfaces such as lenses, sensors, and transmitter windows.

Electrical Contact Cleanliness

Cleaner interfaces may help reduce contamination risk around relay contacts, terminals, and PCB assemblies.

Dust Attraction in Storage Devices

Less bleeding residue helps lower the chance of dust adhesion in SSD and other precision electronic assemblies.

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Key Benefits of Non-Silicone Thermal Pads

Sheen AF Series non-silicone thermal pads are designed to support cleaner thermal interfaces in automotive, optical, and precision electronics. The material system combines low bleed behavior, practical thermal conductivity options, and reliable mechanical performance for long-term use.

No Silicone Oil Bleed

Helps avoid silicone oil migration and supports cleaner thermal interfaces in contamination-sensitive assemblies.

Low Volatile Contamination Risk

Suitable for applications where fogging, surface residue, or silicone-sensitive components are a concern.

III

1.5–10 W/m·K Thermal Conductivity

Multiple conductivity grades help match different heat loads, gap conditions, and product designs.

Reliable Heat Aging Performance

Designed for long-term thermal management with good heat aging resistance and stable physical performance.

Balanced Toughness and Strength

Good toughness, tensile strength, and compression behavior help improve handling and assembly reliability.

Natural Tack for Easier Assembly

Surface tack helps simplify pad placement during installation and supports convenient manual or automated assembly.

Feature Image Image Position 01

Non-silicone thermal pad material features and structure

Figure F01. Non-silicone thermal pad feature overview Representative image showing the core characteristics of Sheen non-silicone thermal pad materials.

Feature Image Image Position 02

Sheen non-silicone thermal pad product feature display

Figure F02. Material performance and handling display Visual summary of performance and application characteristics for non-silicone thermal pads.

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AF Series Non-Silicone Thermal Pad Specifications

The AF Series covers a practical range of thermal conductivity, hardness, compression, and thickness options for EV battery systems, automotive electronics, optical modules, and other precision electronic assemblies. The table below summarizes the typical thermal and physical parameters.

Model	Thermal Conductivity W/m·K	Thermal Resistance ℃·in²/W @ 50 psi, 1 mm	Thickness mm	Typical Hardness Shore 00	Compression @ 30 psi, 1 mm	Elongation	Working Temperature ℃
AF100	1.5	1.10	0.5–5.0	55 / 70	35%	100%	-40 ~ 125
AF300	2.0	0.80	0.5–5.0	55 / 70	30%	70%	-40 ~ 125
AF500	3.0	0.60	0.5–5.0	55 / 70	30%	70%	-40 ~ 125
AF600D	4.0	0.40	0.5–5.0	55 / 70	30%	50%	-40 ~ 120
AF600	5.0	0.30	0.5–5.0	70	20%	40%	-40 ~ 120
AF600G	6.0	0.25	0.5–5.0	70	20%	40%	-40 ~ 120
AF800	8.0	0.20	1.0–5.0	70	20%	30%	-40 ~ 120
AF1000	10.0	0.18	1.0–5.0	70	20%	30%	-40 ~ 120

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Low Bleed Performance and Aging Reliability

Oil Bleed Comparison and Reliability Validation

For silicone-sensitive applications, low bleed behavior is one of the main reasons to select a non-silicone thermal interface material. The comparison below highlights the difference in bleed behavior, while the aging test results show the stability of AF500 after prolonged heat exposure.

Oil Bleed Comparison: Silicone vs. Non-Silicone Pads

Oil bleed comparison test result for silicone thermal pad

Oil bleed comparison test result for non-silicone thermal pad

Oil bleed ring sample for silicone thermal pad

Oil bleed ring sample for non-silicone thermal pad

At the same thermal conductivity level, the oil bleed ring diameter of a silicone thermal pad can be several times or even dozens of times larger than that of a non-silicone thermal pad.

AF500 Heat Aging Reliability Test

AF500 non-silicone thermal pad heat aging test report

AF500 thermal conductivity retention after aging

After aging at 110°C for 1008 hours, AF500 maintained acceptable thermal conductivity and hardness, with no visible appearance change.

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Application Cases

Application Cases for EV Battery Systems, Automotive Electronics, and Precision Devices

Non-silicone thermal pads are most valuable in contamination-sensitive thermal interfaces. Typical applications include EV battery packs, BDU, BMS, cameras, ADAS, LiDAR, optical transceivers, SSD storage, and other precision electronic modules that require clean and stable heat transfer.

EV Battery Systems

Typical application points include battery packs, BDU, and BMS assemblies.

Automotive Electronics

Used in vehicle cameras, ADAS, LiDAR, LED modules, and related electronics.

Optical Communication

Suitable for optical transceivers, transmitter modules, and high-speed communication hardware.

Precision Electronics

Applicable to SSD, monitoring devices, industrial cameras, and other silicone-sensitive electronics.

Application Image EV Battery / BDU

BDU thermal management solution in EV battery system

Figure A01. BDU thermal management in new energy vehicles Typical non-silicone thermal pad application in a battery disconnect unit for cleaner long-term heat transfer.

Application Image EV Battery / BMS

BMS thermal management application in EV battery system

Figure A02. BMS thermal management in EV battery systems Application example showing silicone-free thermal materials used in battery management and localized heat control areas.

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EV Battery Systems / BDU

Application 01

BDU Thermal Management in EV Battery Packs

Non-silicone thermal pads are widely used in EV battery systems where electrical contacts, localized hot spots, and contamination-sensitive assemblies require cleaner long-term thermal management. In the BDU, typical thermal interface positions include power contactors, high-voltage connection bars, and other concentrated heat sources.

Battery disconnect unit structure in EV battery pack

Figure 01. Battery disconnect unit structure Internal BDU assembly showing the main components inside an EV battery system.

Thermal pad placement inside EV battery disconnect unit

Figure 02. Typical thermal pad placement in BDU Representative thermal interface locations for heat transfer and contamination control inside the BDU.

BDU (Battery Disconnect Unit) is one of the core assemblies inside the battery pack. It integrates relays, fuses, current sensing elements, external high-voltage copper bars, signal terminals, and motion connectors. In long-term service, conventional silicone thermal pads may release low-molecular siloxanes that can migrate onto relay contacts or PCB surfaces. Non-silicone thermal pads help reduce that risk while supporting stable heat transfer. Typical application points: power contactors, high-voltage connection bars, and nearby hot spots.

EV Battery Systems / BMS

Application 02

BMS Thermal Management for Control Boards and Chips

Non-silicone thermal materials are widely used in battery management systems (BMS), where control boards, local power devices, and compact chips require stable heat transfer in a contamination-sensitive environment. Typical thermal points include BMS chips, control modules, and nearby heat-generating components.

Overview of EV battery management system architecture

Figure 03. Battery management system overview Typical battery system architecture showing the broader BMS structure inside a new energy vehicle battery pack.

BMS control module thermal management detail

Figure 04. BMS control module detail Example of compact thermal control layout in a BMS module where stable heat transfer is required.

BMS board and chip thermal interface detail

Figure 05. BMS chip thermal interface detail Typical non-silicone thermal material application near BMS chips and adjacent localized heat sources.

BMS (Battery Management System) is responsible for battery monitoring, protection, balancing, and maintenance. In compact electrical structures, reliable thermal management is essential to long-term stability. Compared with conventional silicone-based materials, non-silicone thermal pads help reduce contamination risk in silicone-sensitive battery control assemblies. Typical application points: BMS chips, control boards, and nearby localized heat sources.

EV Battery Systems / BMS Chip-Level Design

Application 02B

BMS Chip and Localized Hot Spot Thermal Management

This case further illustrates how non-silicone thermal materials are used around BMS chip-level thermal interfaces. In compact battery control assemblies, local chips and control circuits require clean and stable thermal transfer to support safe, efficient, and reliable battery operation.

Figure 06. Pack-level battery management system overview Representative battery pack structure showing the broader BMS-related assembly.

BMS chip non-silicone thermal pad application detail

Figure 07. BMS chip thermal application detail Typical application point highlighting non-silicone thermal material placement around the BMS chip area.

BMS (Battery Management System) is used for intelligent monitoring, management, and maintenance of battery units. In chip-level thermal interfaces, non-silicone thermal pads help provide cleaner heat transfer while reducing the contamination risk associated with silicone-sensitive control assemblies. Typical application point: BMS chips and adjacent localized hot spots.

Automotive Electronics

Application 03

Non-Silicone Thermal Pads for Cameras, ADAS, LiDAR, and LED Modules

Non-silicone thermal materials are widely used in automotive electronics, especially in contamination-sensitive modules such as vehicle cameras, ADAS sensors, LiDAR, and LED lamp assemblies. Compared with conventional silicone-based materials, they help provide cleaner heat transfer and improved long-term reliability in optical and electronic vehicle systems.

Automotive electronics thermal management application overview

Figure 08. Automotive electronics application overview Representative application showing non-silicone thermal materials used in vehicle electronic modules.

Automotive optics and sensing module thermal interface detail

Figure 09. Optical and sensing module detail Typical thermal interface application in vehicle camera, ADAS, LiDAR, or related optical electronic hardware.

Automotive electronics include vehicle cameras, ADAS sensors, LiDAR, audio and video systems, and LED lamps. These modules require efficient heat transfer and lower contamination risk to help preserve optical clarity and electrical reliability. Typical application points: camera modules, ADAS / LiDAR sensing areas, optical regions, and nearby thermal interface positions.

Optical Communication

Application 04

Non-Silicone Thermal Management for Optical Modules and Transceivers

Non-silicone thermal materials are widely used in optical communication equipment, especially in high-speed transceivers and optical modules where low contamination risk and stable heat transfer are both critical. In optical module transmitter and IC chip positions, silicone-free thermal pads help support cleaner and more reliable thermal management.

10 W per mK non-silicone thermal pad for optical module transmitters and IC chips

Figure 10. 10 W/m·K non-silicone thermal pad for optical transmitters and IC chips Typical thermal interface application in optical module transmitter and IC chip areas.

800G and 1.6T high speed OSFP transceiver thermal management example

Figure 11. 800G / 1.6T high-speed OSFP transceiver Representative high-speed optical communication module requiring efficient, clean, and stable heat dissipation.

Optical communication applications: optical transmission equipment, optical transceivers, transmitters, and related high-speed communication modules.

Monitoring Devices / SSD Storage

Application 05

Monitoring Devices, Camera Systems, and SSD Storage

Non-silicone thermal materials are suitable for monitoring devices, camera equipment, SSD storage systems, and other precision electronics where optical cleanliness and dust control are important to long-term performance.

Monitoring device and camera non-silicone thermal management example

SSD storage non-silicone thermal management example

Monitoring and camera equipment: volatile residue generated during heating may condense on optical surfaces, contaminate lenses, and reduce image clarity.

SSD storage devices: bleeding silicone oil may attract dust and contaminate critical components, increasing the risk of read/write instability and storage failure.

Target Markets

Target Markets for Non-Silicone Thermal Management

Sheen non-silicone thermal pads are suitable for industries where both thermal performance and cleanliness matter. The strongest opportunities are in EV battery systems, automotive electronics, optical communication, and precision electronic devices that are sensitive to contamination.

Market 01