SE20 Thermal Gel 2.0 W/mK

SE20 is a flexible silicone-based thermally conductive gap filler designed for large gap tolerance applications between heat-generating electronic components and heat sinks or housings. With thermal conductivity of 2.0 W/m·K, low interfacial thermal resistance, and excellent thixotropy, it helps create close contact between surfaces, reduces thermal resistance, and improves heat dissipation efficiency.

As part of SHEEN’s SE Series 1K Thermal Gel family, SE20 combines softness, compressibility, stable dispensing performance, and reliable electrical insulation. It can be applied manually or with dispensing equipment, making it suitable for projects requiring controlled material placement, low assembly stress, and flexible gap filling in complex electronic structures.

Key Benefits

  • Thermal conductivity: 2.0 W/m·K
  • Low thermal resistance for efficient heat transfer
  • Good flexibility and high filling rate for large gap tolerance designs
  • Excellent thixotropy and stable dispensing performance
  • Suitable for manual application or automated dispensing
  • Reliable electrical insulation performance
  • Excellent flame retardancy, UL94 V-0
  • Available in 30CC / 300CC syringes and drum packaging
  • Compliant with RoHS, Halogen, and REACH requirements
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Technical Information

Review the key specifications, recommended applications, installation notes, and downloadable files for SE20.

Specifications

PropertySE20Test Method
ColorPinkVisual
Thermal Conductivity2.0 ± 0.2 W/m·KASTM D5470
Thermal Resistance (@50 psi)≤ 0.08 ℃·in²/WASTM D5470
Minimum Interface Thickness0.1 mm/
Extrusion Speed80 ± 15 g/min30cc EFD cartridges, 0.06" orifice, 90 psi
Breakdown Voltage (@AC 2 mm)≥ 10 kVASTM D149
Volume Resistivity (@250V)≥ 1012 Ω·cmASTM D257
Density2.9 ± 0.2 g/cm³ASTM D792
Application Temperature-40 ~ 150℃/
FlammabilityUL94 V-0UL94
RoHSPASSIEC 62321
HalogenPASSEN 14582
REACHPASSEN 14372
OptionalCustomized / Low oil leakage / Low volatility/

Applications

Recommended Applications

  • Hard disks and mobile phones
  • Optical precision equipment
  • Laptops and gaming consoles
  • Mobile and communication equipment
  • LED modules and lighting assemblies
  • Automobile engine control equipment
  • High-end industrial control electronics
  • Medical electronic equipment

Not Recommended For

  • Ultra-thin bond line applications that require grease-like spreadability
  • Rigid sheet-format interfaces where a pad material is preferred
  • Designs requiring structural adhesion rather than gap filling

Installation Notes

  • SE20 is suitable for large gap tolerance applications that require soft and conformable interface filling.
  • It can be applied manually or with dispensing equipment depending on process requirements.
  • Use controlled dispensing to ensure tight contact between components and the heat sink or housing.
  • The material features good thixotropy and stable extrusion behavior for precise placement.
  • Available in 30CC / 300CC dispensing syringes and 5KG / 10KG / 20KG drum packaging.
  • Store in a dry place at 5–25℃ with the lid tightly sealed and keep away from open flames.
  • Shelf life: 12 months. Extrusion rate may fluctuate to a certain extent as storage time increases.

Downloads & FAQ

Q1. What is the main function of SE20?

SE20 is designed to fill gaps between heat-generating components and heat sinks or housings, reducing interfacial thermal resistance while maintaining tight contact and reliable heat dissipation.

Q2. Is SE20 suitable for manual application or only automated dispensing?

SE20 can be applied manually or with dispensing equipment, depending on the assembly process and production requirements.

Q3. What kind of applications is SE20 suitable for?

SE20 is suitable for hard disks, mobile phones, optical precision equipment, laptops, mobile and communication equipment, automobile engine control equipment, industrial control electronics, and medical electronics.

Q4. What packaging options are available for SE20?

SE20 is available in 30CC / 300CC dispensing syringes and drum packaging of 5KG, 10KG, and 20KG.

Q5. What are the key advantages of SE20 compared with conventional gap fillers?

SE20 combines good flexibility, high filling rate, low thermal resistance, reliable flame retardancy, and stable dispensing characteristics, making it suitable for large gap tolerance thermal interface applications.