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SE100 Thermal Gel 10.0 W/mK
SE100 is a flexible silicone-based thermally conductive gap filler designed for large gap tolerance applications between heat-generating electronic components and heat sinks or housings. With thermal conductivity of 10.0 W/m·K, low thermal impedance, and excellent extrusion properties, it helps create close contact between surfaces, reduce interfacial thermal resistance, and improve heat dissipation efficiency in high-demand thermal management systems.
As part of SHEEN’s SE Series 1K Thermal Gel family, SE100 combines softness, compressibility, stable dispensing performance, and reliable electrical insulation. It is especially suitable for advanced applications requiring stronger heat transfer performance, low assembly stress, and flexible gap filling in complex electronic structures.
Key Benefits
- Thermal conductivity: 10.0 W/m·K
- Low thermal impedance for high-efficiency heat transfer
- Good flexibility and high filling rate for large gap tolerance designs
- Excellent extrusion properties for controlled dispensing
- Suitable for manual application or automated dispensing
- Reliable electrical insulation performance
- Excellent flame resistance, UL94 V-0
- Available in 30cc / 300cc packaging
- Compliant with RoHS, Halogen-Free, and REACH requirements
Technical Information
Review the key specifications, recommended applications, installation notes, and downloadable files for SE100.
Specifications
| Property | SE100 | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Thermal Conductivity | 10.0 W/m·K | ASTM D5470 |
| Thermal Impedance (@30 psi) | 0.045 ℃·in²/W | ASTM D5470 |
| Flow Rate (@30cc, 90 psi) | 10 ± 5 g/min | – |
| Electrical Insulation | Reliable insulation performance | – |
| Flammability | UL94 V-0 | UL94 |
| Dielectric Strength | Up to 8 kV/mm | – |
| RoHS | Compliant | – |
| Halogen-Free | Compliant | – |
| REACH | Compliant | – |
| Packaging | 30cc / 300cc | – |
| Shelf Life | 12 months | – |
Applications
Recommended Applications
- CPUs and GPUs
- Power supply units (PSUs)
- LED modules
- Engine control units (ECUs)
- Gaming consoles and laptops
- Advanced electronic assemblies with complex gap thicknesses
Not Recommended For
- Ultra-thin bond line applications that require grease-like spreadability
- Rigid sheet-format interfaces where a pad material is preferred
- Designs requiring structural adhesion instead of flexible gap filling
Installation Notes
- SE100 is suitable for large gap tolerance applications that require stronger heat transfer performance with flexible thermal filling.
- It can be precisely controlled for thickness and shape using automated dispensing equipment.
- Use controlled dispensing to ensure tight wet-out contact between components and heat sinks.
- The material provides low assembly stress and is suitable for delicate and sensitive electronic components.
- Store in a well-ventilated, cool, and dry area away from open flames.
- This product is non-toxic and should be stored and transported as a non-hazardous material.
- Shelf life: 12 months.
Downloads & FAQ
SE100 is designed to fill gaps between heat-generating components and heat sinks, reducing thermal impedance while maintaining reliable contact and heat dissipation in high-demand applications.
SE100 provides the highest thermal conductivity grade shown in the SE series overview at 10.0 W/m·K, together with low thermal impedance, while keeping the series advantages of softness, low assembly stress, and precise dispensing control.
SE100 is optimized for precise thickness and shape control via automated dispensing, and can also be used where controlled manual application is required.
SE100 is suitable for CPUs, GPUs, PSUs, LED modules, ECUs, gaming consoles, laptops, and other advanced electronic assemblies with complex gap thicknesses.
SE100 is available in 30cc and 300cc packaging, with a shelf life of 12 months under recommended storage conditions.














