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Non-Silicone Thermal Conductive Pads Series
- Free of siloxane, helping eliminate the risk of silicone oil bleed
- Suitable for contamination-sensitive thermal interface applications
- Helps reduce risks such as optical lens fogging and electrical malfunction
- Current public AF Series covers 1.0 to 8.0 W/m·K
- Excelente desempenho de isolamento elétrico
- UL94 V-0 flame resistance
- Self-adhesive design for easier installation and rework
- Available in standard sheets and customized die-cut parts
Série de almofadas térmicas sem silicone
SHEEN AF Series Silicone-Free Thermal Pads are designed for silicone-sensitive thermal interface assemblies where thermal transfer, electrical insulation, and contamination control must be reviewed together. The updated series content now includes AF1000, a higher-conductivity non-silicone thermal pad grade for data center, optical communication, server, storage, and other high-density electronic structures.
Silicone-Free / Non-Silicone
Low Oil Bleeding Direction
1.0–10.0 W/m·K Selection Window
AF1000 Available
UL94 V-0
Sheet or Die-Cut
Low Oil Bleeding Direction
1.0–10.0 W/m·K Selection Window
AF1000 Available
UL94 V-0
Sheet or Die-Cut
AF1000 Snapshot
AF1000 is positioned as the high-conductivity model in the non-silicone thermal pad family for projects that need stronger heat transfer while keeping a silicone-free material direction.
10±1
W/m·K thermal conductivity
W/m·K thermal conductivity
≤0.13
℃·in²/W thermal resistance @50 psi
℃·in²/W thermal resistance @50 psi
1–2 mm
standard AF1000 thickness range
standard AF1000 thickness range
-40~150℃
application temperature range
application temperature range
Q1. Will it reduce contamination risk in silicone-sensitive assemblies?
For optical, sensing, precision electronics, data center, medical, and automotive electronics programs, material selection often starts with contamination risk before comparing thermal conductivity. The AF Series is structured for silicone-sensitive thermal interface assemblies where low oil bleeding, insulation, handling stability, and thermal transfer must be considered together.
Silicone-Free Material Direction
Designed for assemblies where silicone oil migration, lens fogging, contact contamination, or electrical malfunction risk must be reduced.
Low Oil Bleeding Direction
Useful for optical modules, sensors, cameras, and precision electronic structures where interface cleanliness is part of qualification.
Optional Low Volatility Direction
For stricter projects, low oil leakage or low volatility requirements should be confirmed during sampling and qualification.
Why this matters
- Silicone-sensitive projects usually screen contamination risk before conductivity ranking.
- Oil bleed or volatile residue can affect optics, sensors, camera windows, connectors, and nearby electrical contacts.
- AF Series helps engineers evaluate thermal transfer and cleanliness direction in the same material family.
What to confirm during sampling
- Whether the project is silicone-sensitive, contamination-sensitive, or both.
- Whether low oil leakage or low volatility should be specified from the beginning.
- Whether the target structure requires both electrical insulation and high thermal conductivity.
Q2. Does conductivity translate into real thermal performance in the actual structure?
Model comparison should not rely on W/m·K alone. For gap-filling thermal pads, conductivity, thermal resistance, thickness, hardness, compression, contact quality, and actual heat path should be reviewed together.
Conductivity Range
Updated AF Series content now extends the selection window up to AF1000 at 10 W/m·K class.
Thermal Resistance Matters
Lower thermal resistance can be more meaningful than conductivity alone when comparing pads at the same thickness and pressure condition.
Test Pressure Matters
AF1000 thermal resistance is listed at 50 psi, while several lower AF grades are commonly compared at 30 psi. Keep test condition differences visible.
| Modelo | Cor | Condutividade térmica | Resistência térmica | Espessura | Dureza | Selection Note |
|---|---|---|---|---|---|---|
| AF100 | White / project dependent | 1.0 W/m·K | 1.1 ℃·in²/W @30 psi | 0.25–5.0 mm | 50 / 70 ± 5 Shore 00 | Entry-grade option for low thermal loading and silicone-sensitive assemblies. |
| AF300 | White / project dependent | 2,0 W/m-K | 0.8 ℃·in²/W @30 psi | 0.25–5.0 mm | 50 / 70 ± 5 Shore 00 | Moderate step-up for insulated gap-filling applications. |
| AF500 | White / project dependent | 3,0 W/m-K | 0.6 ℃·in²/W @30 psi | 0.25–5.0 mm | 50 / 70 ± 5 Shore 00 | Balanced choice for industrial, storage, and communication equipment. |
| AF600 | White / project dependent | 5,0 W/m-K | 0.3 ℃·in²/W @30 psi | 0.5–5.0 mm | 50 / 70 ± 5 Shore 00 | Higher-performance option for tighter thermal targets with insulation requirements. |
| AF600G | White / project dependent | 6,0 W/m-K | 0.25 ℃·in²/W @30 psi | 0.5–5.0 mm | 50 / 70 ± 5 Shore 00 | High-performance grade for communication, AI, and compact electronics hardware. |
| AF800 | White / project dependent | 8.0 W/m·K | 0.2 ℃·in²/W @30 psi | 0.5–5.0 mm | 50 / 70 ± 5 Shore 00 | Advanced thermal interface option for stronger heat-transfer requirements. |
| AF1000 | Cinzento | 10±1 W/m·K | ≤0.13 ℃·in²/W @50 psi | 1–2 mm | 50–65 Shore 00 | High-conductivity non-silicone grade for data center, network equipment, optical modules, servers, hard drives, and SSDs. |
Selection logic: compare model, thickness, thermal resistance, assembly pressure, compression condition, and real interface gap together. AF1000 uses a different thermal-resistance pressure condition, so do not compare it against lower grades by resistance value alone.
Almofada térmica sem silicone AF1000
AF1000 is the high-conductivity model added to this page for applications where a silicone-free thermal pad must handle stronger localized heat transfer. It is naturally tacky, can be die-cut into customized shapes, and is designed to fill contact interfaces while helping exclude air from the thermal path.
Condutividade térmica
10±1 W/m·K
10±1 W/m·K
Resistência térmica
≤0.13 ℃·in²/W @50 psi
≤0.13 ℃·in²/W @50 psi
Espessura
1–2 mm
1–2 mm
Dureza
50–65 Shore 00
50–65 Shore 00
Tensão de rutura
≥4 kV AC
≥4 kV AC
Resistividade de volume
≥10¹² Ω·cm
≥10¹² Ω·cm
Inflamabilidade
UL94 V-0
UL94 V-0
Temperatura de aplicação
-40~150℃
-40~150℃
AF1000 is a better fit when:
- The structure needs higher heat-transfer capacity than AF600G or AF800 class materials.
- The assembly is silicone-sensitive or contamination-sensitive.
- The interface gap is within the AF1000 1–2 mm thickness window.
- The design requires insulation, flame resistance, and customized die-cut integration.
Engineering checks before approval:
- Confirm actual gap and tolerance stack-up before specifying AF1000 thickness.
- Validate compression force against component stress limits.
- Check thermal result under the real heat source, enclosure, heat sink, or chassis condition.
- Confirm low oil leakage or low volatility requirements during qualification.
Q3. Will softness and thickness work with the assembly instead of increasing stress?
A thermal pad does not work only because it has a high conductivity rating. It must match the actual gap, compression range, surface flatness, and allowable clamping force. This is especially important for optical modules, SSDs, routers, servers, sensors, BMS boards, and compact electronic modules.
Thickness Fit
Lower AF grades provide broader gap-filling options, while AF1000 should be used where the 1–2 mm gap window matches the real structure.
Soft Contact
Appropriate softness helps the pad conform to uneven surfaces and reduce trapped air in the contact interface.
Compression Review
Thermal validation should include compression force, component stress, screw torque, housing tolerance, and heat-sink contact pressure.
Suggested selection sequence
- Measure the actual interface gap and tolerance stack-up.
- Confirm whether silicone-free or low-volatility material direction is required.
- Choose the thickness range that can fill the gap without over-compression.
- Compare thermal resistance and conductivity among candidate AF grades.
- Run thermal and mechanical validation under the real assembly condition.
AF1000 thickness note
AF1000 should not be selected only because it is the highest-conductivity model. It is strongest when the thermal demand is high and the interface design matches the 1–2 mm AF1000 thickness window.
Q4. Is it suitable for long-term use and production integration?
Before moving from samples to qualification, buyers should confirm handling, supply form, cutting format, packaging, shelf life by model, compliance statements, storage condition, and the final assembly method.
Sheet Supply
Standard sheet products can support engineering sampling and early-stage process evaluation.
Custom Die-Cut
Die-cut parts help align the pad with chip, module, heat sink, chassis, or housing geometry.
Self-Adhesive Handling
Natural tack helps positioning and assembly during prototype and production use.
Compliance Direction
AF1000 lists RoHS, Halogen, and REACH pass statements, with UL94 V-0 flame resistance.
Production approval checklist
- Target model, thickness, and part drawing.
- Assembly pressure, compression condition, and allowable component stress.
- Electrical insulation requirements, creepage and clearance considerations.
- Cleanliness requirement: silicone-free, low oil bleeding, low oil leakage, or low volatility.
- Packaging format, release liner direction, and installation workflow.
- Shelf life and storage condition based on the selected model’s datasheet.
Recommended Application Fit
The AF Series is suitable for silicone-sensitive thermal interface structures. AF1000 should be highlighted for high-density equipment where non-silicone material direction and stronger thermal performance are required together.
Data Center
Network Equipment
AF1000 is aligned with thermal interfaces in switches, routers, and optical modules where higher power density and contamination control must be considered together.
Switches
Routers
Optical Modules
Routers
Optical Modules
Computing
Servers & AI Hardware
Use AF Series when insulated gap filling is needed around server boards, accelerator-adjacent structures, heat sinks, housings, or localized thermal paths.
Servers
AI Devices
Thermal Interfaces
AI Devices
Thermal Interfaces
Storage
Hard Drives & SSDs
AF1000 is useful when compact storage equipment needs improved heat transfer while avoiding silicone-sensitive contamination concerns.
Hard Drives
SSDs
Compact Modules
SSDs
Compact Modules
Optical
Optical Communication
Non-silicone thermal pads are a strong material direction where optical windows, lenses, fiber optic assemblies, or precision optical paths are sensitive to residue.
Optical Modules
Fiber Systems
Low Contamination
Fiber Systems
Low Contamination
Automotive
BDU / BMS Thermal Points
AF Series can be used for localized thermal control around battery disconnect units, BMS boards, control modules, contactors, and other silicone-sensitive automotive electronics.
BDU
BMS
Automotive Sensors
BMS
Automotive Sensors
Precision Electronics
Sensors, Cameras & Medical Devices
For contamination-sensitive precision equipment, AF Series helps engineers evaluate thermal transfer and silicone-free material direction in the same selection path.
Sensors
Security Cameras
Dispositivos médicos
Security Cameras
Dispositivos médicos
Transferências e FAQ
Download the available AF Series datasheets or contact SHEEN for model-specific thickness, die-cut, low oil leakage, low volatility, and qualification requirements.
AF100 Datasheet
AF300 Datasheet
AF500 Datasheet
AF600 Datasheet
AF600G Datasheet
AF1000 Datasheet
View All Datasheets
Apoio técnico
AF300 Datasheet
AF500 Datasheet
AF600 Datasheet
AF600G Datasheet
AF1000 Datasheet
View All Datasheets
Apoio técnico
Q1. Why should this page include AF1000?
Because AF1000 extends the non-silicone thermal pad family into a higher-conductivity class. It gives engineers a clearer option when AF600G or AF800 class materials are not enough for the target thermal path.
Q2. Is AF1000 always the best model?
No. AF1000 should be selected when the thermal demand, interface gap, compression condition, and 1–2 mm thickness window match the structure. For broader gaps, softer assembly requirements, or lower heat loads, other AF models may be more suitable.
Q3. Why does AF1000 use a different pressure condition in the thermal resistance value?
AF1000 thermal resistance is listed at 50 psi. Several lower AF models are commonly compared at 30 psi. Engineers should avoid direct comparison by thermal resistance alone unless the test condition is aligned.
Q4. Which applications should mention AF1000 most clearly?
AF1000 should be emphasized for data center network equipment, switches, routers, optical modules, servers, hard drives, SSDs, and other compact electronics where stronger heat transfer and non-silicone material direction are both needed.
Q5. What should buyers confirm before requesting AF1000 samples?
Buyers should confirm target thickness, actual gap, compression force, operating temperature, insulation requirement, die-cut drawing, packaging format, and whether low oil leakage or low volatility needs to be specified.
Q6. What should be updated in the page summary after adding AF1000?
Update the summary range from “1.0–8.0 W/m·K” to a range that includes AF1000, such as “1.0–10.0 W/m·K selection window,” and add AF1000 to the model table, AF1000 details section, application section, and download area.
