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Carbon Fiber Thermal Pad CSF30-HC
Principales ventajas
- High thermal conductivity for fast heat transfer away from chip-level hot spots
- Low thermal resistance and low loss for efficient heat transfer across the interface
- High compliance and high compressibility for soft, conformable fitting
- Flexible fit and easy assembly for complex mating surfaces
- Reduced contact thermal resistance for improved thermal path efficiency
- Helps reduce component damage risk during installation
Carbon Fiber Thermal Pad CSF30-HC
30 W/m·K High-Compliance Carbon Fiber Thermal Pad for Low Thermal Resistance and Efficient Through-Plane Heat Transfer
CSF30-HC is a high-compliance carbon fiber thermal pad engineered with advanced vertically aligned carbon fiber technology. It delivers efficient axial heat transfer between heat-generating components and heat sinks. With thermal conductivity up to 30.0 W/m·K, low interface thermal resistance, and stable thermal performance, it helps high-power devices move heat quickly and reliably.
CSF30-HC
30 W/m·K
Thermal Resistance 0.1 °C·in²/W @20 psi
High-Compliance Carbon Fiber Pad
0.3–12.0 mm
UL94 V-0
30 W/m·K
Thermal Resistance 0.1 °C·in²/W @20 psi
High-Compliance Carbon Fiber Pad
0.3–12.0 mm
UL94 V-0
Series Snapshot
Modelo
CSF30-HC
CSF30-HC
Color
Black
Black
Thickness Range
0.3–12.0 mm
0.3–12.0 mm
Densidad
2.6 g/cm³
2.6 g/cm³
Información técnica
Review the product positioning, core parameters, compression behavior, and application fit for CSF30-HC carbon fiber thermal pad.
Q1
What is CSF30-HC designed for?
CSF30-HC is designed for thermal-interface applications that require efficient axial heat transfer, low interface thermal resistance, and soft high-compliance fitting. Its vertically aligned carbon fiber technology is intended to provide a stable thermal path between heat-generating devices and heat sinks.
High-Compliance Carbon Fiber Direction
Built with advanced vertically aligned carbon fiber technology for efficient axial heat transfer.
Low Thermal Resistance Interface
Designed to support fast and efficient heat transfer across the interface.
Soft and Conformable Fit
High compliance makes the material easy to fit across uneven or complex mating surfaces.
Assembly-Friendly Protection
The cushioning structure helps lower installation risk and reduce component damage during assembly.
Q2
What are the core technical data for CSF30-HC?
The table below reflects the currently published updated datasheet values for the CSF30-HC carbon fiber thermal pad.
| Propiedad | Método de ensayo | CSF30-HC |
|---|---|---|
| Conductividad térmica | ASTM D5470 | 30 W/m·K |
| Thermal Resistance (@20 psi, 1 mm) | ASTM D5470 | 0.1 °C·in²/W |
| Temperatura de aplicación | / | -40 to 150°C |
| Compression Stress (@1 mm, 30%) | ASTM D3574 | 30 psi |
| Hardness (Shore 00) | ASTM D2240 | 50–60 |
| Resistencia a la tracción | ASTM D412 | 30 psi |
| Color | Visual | Black |
| Available Thickness | ASTM D374 | 0.3–12.0 mm |
| Densidad | ASTM D792 | 2.6 g/cm³ |
| Inflamabilidad | UL94 | V-0 |
| Compliance | / | RoHS 2.0 / Halogen / REACH |
Q3
What compression and heat-transfer strengths does CSF30-HC emphasize?
CSF30-HC is positioned as a high-compliance, soft, cushioning, and compressible thermal pad that lowers contact thermal resistance while supporting efficient axial heat transfer.
Fast Efficient Heat Transfer
30 W/m·K conductivity helps high-power devices move heat quickly and reliably.
High Compliance and Cushioning
The soft, cushioning, and compressible structure adapts to complex mating surfaces more effectively.
Lower Contact Thermal Resistance
Low interface resistance supports more efficient thermal transfer across the contact area.
Installation Protection
The flexible fit helps prevent component damage during installation while improving contact efficiency.
Q4
How should CSF30-HC be stored and supplied?
The updated datasheet provides simple storage, packaging, and shelf-life guidance for customer projects and sample use.
Embalaje
Customized packaging is available upon request.
Storage Conditions
Store in a cool place.
Storage temperature: ≤30°C
Storage humidity: ≤75%
Vida útil
12 meses
Production Note
Users should verify material suitability and compatibility in their own production process before use.
Q5
Which applications fit CSF30-HC best?
The updated datasheet focuses this product on electronics and test applications that need efficient thermal transfer with soft contact and easy installation.
Chip Testing
Suitable for chip-testing structures that need efficient heat transfer and stable interface contact.
Capacitors
Applicable to capacitor thermal-management structures requiring low interface resistance and conformable fitting.
Optical Modules
A good fit for optical-module assemblies where soft contact and reliable heat dissipation are both important.
5G Remote Radio Units (RRU) / Thermal Module Testing
Suitable for communication hardware and thermal-module testing structures with demanding thermal-management requirements.
Descargas y FAQ
Technical Resources
Frequently Asked Questions
Q1. What is the main reason to choose CSF30-HC?
The main reason is to combine 30 W/m·K thermal conductivity with low interface thermal resistance, high compliance, soft conformable contact, and easy assembly in one carbon fiber thermal pad.
Q2. Is CSF30-HC suitable only for chip testing?
No. The updated datasheet also lists capacitors, optical modules, 5G Remote Radio Units, and thermal module testing among the typical applications.
Q3. What thermal-resistance level is listed?
The current datasheet lists thermal resistance of 0.1 °C·in²/W at 20 psi for 1 mm thickness.
Q4. What storage conditions are recommended?
Store the product in a cool place with storage temperature ≤30°C and storage humidity ≤75%.
Q5. What is the shelf life of CSF30-HC?
The current datasheet lists a shelf life of 12 months.
