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SE200AB Two-Component Thermal Gel 2.0 W/mK
SE200AB is a flexible two-component silicone-based thermally conductive gap filler developed for small-gap tolerance applications between heat-generating components and heat sinks or housings. After mixing and curing, it forms a soft elastomer that maintains interface thickness, provides reliable shock absorption, and improves thermal contact between mating surfaces.
With thermal conductivity of 2.0 ± 0.2 W/m·K, low interfacial thermal resistance, and stable extrusion performance, SE200AB helps reduce contact thermal resistance and enhances heat dissipation efficiency in electronic assemblies. It is suitable for projects that require controlled dispensing, good flexibility after curing, and reliable insulation performance.
Key Benefits
- Two-component silicone-based thermal gel for controlled curing applications
- Thermal conductivity: 2.0 ± 0.2 W/m·K
- Low thermal resistance for efficient heat transfer
- Soft and elastic after curing, with reliable shock absorption
- Suitable for small-gap tolerance thermal interface designs
- Precise thickness and shape control through automated dispensing equipment
- High electrical insulation and UL94 V-0 flame resistance
- Compliant with RoHS, Halogen-Free, and REACH requirements
Technical Information
Review the key specifications, recommended applications, installation notes, and downloadable files for SE200AB.
Specifications
| Property | SE200AB | Test Method |
|---|---|---|
| Product Type | Two-component Thermal Conductive Gel | / |
| Mix Ratio | 1:1 | / |
| Color Before Mixing | Part A White / Part B Pink | Visual |
| Color After Mixing / Curing | Pink | Visual |
| Density | 2.3 ± 0.2 g/cm³ | / |
| Extrusion Speed | 95 ± 25 g/min | 50cc EFD cartridges, 0.06" orifice, 90 psi |
| Thermal Conductivity (after mixing) | 2.0 ± 0.2 W/m·K | / |
| Thermal Resistance (@50 psi) | ≤ 0.10 ℃·in²/W | / |
| Minimum Interface Thickness | 0.15 mm | / |
| Breakdown Voltage | ≥ 10 kV @ AC | / |
| Volume Resistivity | ≥ 1012 Ω·cm @250V | / |
| Application Temperature | -40 ~ 150℃ | / |
| Tack-Free Time @25℃ | ≥ 60 min | / |
| Full Cure Time @25℃ | ≥ 2 h | / |
| Full Cure Time @100℃ | ≥ 10 min | / |
| Hardness After Curing | Shore 00 45–65 | / |
| Flammability | UL94 V-0 | / |
| RoHS | PASS | / |
| Halogen-Free | PASS | / |
| REACH | PASS | / |
| Shelf Life | 6 months | / |
Applications
Recommended Applications
- Hard disks and mobile phones
- Optical precision equipment
- Laptops
- Mobile and communication equipment
- Automobile engine control equipment
- High-end industrial control electronics
- Medical electronic equipment
Not Recommended For
- Ultra-thin bond line interfaces that require grease-like spreadability
- Large-gap tolerance designs where 1K thermal gel is more suitable
- Applications requiring non-curing interface materials
- Structures that need sheet-format pads instead of dispensed gel
Installation Notes
- SE200AB is suitable for small-gap tolerance thermal interface applications that require controlled curing and elastomeric support after mixing.
- Part A and Part B should be mixed at a 1:1 ratio before application.
- The material can be precisely controlled for thickness and shape using automated dispensing equipment.
- After curing, it forms a soft elastomer that maintains interface thickness and provides reliable shock absorption.
- Store in a dry place at 5–25℃ with the lid tightly sealed and keep away from open flames.
- Extrusion rate and curing time may fluctuate to some extent as storage time increases.
- This product is non-toxic and should be stored and transported as a non-hazardous material.
- Shelf life: 6 months.
Downloads & FAQ
Q1. What is the main function of SE200AB?
SE200AB is designed to fill small gaps between heat-generating components and heat sinks or housings, reducing interfacial thermal resistance while providing reliable electrical insulation and post-cure elastomeric shock absorption.
Q2. What is the difference between SE200AB and the 1K SE thermal gel series?
SE200AB is a two-component thermal gel that requires mixing before application and cures to form a soft elastomer. Compared with the 1K SE series, it is more suitable for applications that require controlled curing, stable interface thickness, and post-cure shock absorption.
Q3. What is the mix ratio of SE200AB?
The recommended mix ratio is 1:1 for Component A and Component B.
Q4. What are the cure conditions of SE200AB?
SE200AB has a tack-free time of at least 60 minutes at 25℃, a full cure time of at least 2 hours at 25℃, and can be fully cured in at least 10 minutes at 100℃.
Q5. What packaging options are available for SE200AB?
SE200AB is available in 50ml A/B cartridges, 400ml A/B cartridges, and 20KG drum packaging.
