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SE50 Thermal Gel 5.0 W/mK
SE50 is a flexible silicone-based thermally conductive gap filler designed for large gap tolerance applications between heat-generating electronic components and heat sinks or housings. With thermal conductivity of 5.0 W/m·K, low interfacial thermal resistance, and excellent thixotropy, it helps create close contact between surfaces, reduces thermal resistance, and improves heat dissipation efficiency.
As part of SHEEN’s SE Series 1K Thermal Gel family, SE50 combines softness, compressibility, stable dispensing performance, and reliable electrical insulation. It can be applied manually or with dispensing equipment, making it suitable for projects requiring controlled material placement, low assembly stress, and flexible gap filling in complex electronic structures.
Key Benefits
- Thermal conductivity: 5.0 ± 0.5 W/m·K
- Lower thermal resistance for more efficient heat transfer
- Good flexibility and high filling rate for large gap tolerance designs
- Excellent thixotropy and stable dispensing performance
- Suitable for manual application or automated dispensing
- Reliable electrical insulation performance
- Excellent flame retardancy, UL94 V-0
- Available in 30CC / 300CC syringes and drum packaging
- Compliant with RoHS, Halogen, and REACH requirements
Technical Information
Review the key specifications, recommended applications, installation notes, and downloadable files for SE50.
Specifications
| Property | SE50 | Test Method |
|---|---|---|
| Color | Pink | Visual |
| Thermal Conductivity | 5.0 ± 0.5 W/m·K | ASTM D5470 |
| Thermal Resistance (@50 psi) | ≤ 0.065 ℃·in²/W | ASTM D5470 |
| Minimum Interface Thickness | 0.15 mm | / |
| Extrusion Speed | 35 ± 5 g/min | 30cc EFD cartridges, 0.095" orifice, 90 psi |
| Breakdown Voltage (@AC 2 mm) | ≥ 10 kV | ASTM D149 |
| Volume Resistivity (@250V) | ≥ 1012 Ω·cm | ASTM D257 |
| Density | 3.15 ± 0.2 g/cm³ | ASTM D792 |
| Application Temperature | -40 ~ 150℃ | / |
| Flammability | UL94 V-0 | UL94 |
| RoHS | PASS | IEC 62321 |
| Halogen | PASS | EN 14582 |
| REACH | PASS | EN 14372 |
| Optional | Performance type Customize / Low oil leakage / Low volatility | / |
Applications
Recommended Applications
- Hard disks and mobile phones
- Optical precision equipment
- Laptops
- Mobile and communication equipment
- Automobile engine control equipment
- High-end industrial control and medical electronics
Not Recommended For
- Ultra-thin bond line applications that require grease-like spreadability
- Rigid sheet-format interfaces where a pad material is preferred
- Designs requiring structural adhesion rather than gap filling
Installation Notes
- SE50 is suitable for large gap tolerance applications that require soft and conformable interface filling.
- It can be applied manually or with dispensing equipment depending on process requirements.
- Use controlled dispensing to ensure tight contact between components and the heat sink or housing.
- The material features good thixotropy and stable extrusion behavior for precise placement.
- Available in 30CC / 300CC dispensing syringes and drum packaging of 5KG, 10KG, and 20KG.
- Store in a dry place at 5–25℃ with the lid tightly sealed and keep away from open flames.
- The product is non-toxic and should be stored and transported as a non-hazardous material.
- Shelf life: 12 months. The extrusion rate may fluctuate to a certain extent as storage time increases.
Downloads & FAQ
Q1. What is the main function of SE50?
SE50 is designed to fill gaps between heat-generating components and heat sinks or housings, reducing interfacial thermal resistance while maintaining tight contact and reliable heat dissipation.
Q2. What is the difference between SE50 and lower-grade thermal gels?
SE50 provides a higher thermal conductivity grade at 5.0 ± 0.5 W/m·K and lower thermal resistance, making it suitable for projects that require stronger heat transfer performance while maintaining flexible gap filling and stable dispensing behavior.
Q3. Is SE50 suitable for manual application or only automated dispensing?
SE50 can be applied manually or with dispensing equipment, depending on the assembly process and production requirements.
Q4. What kind of applications is SE50 suitable for?
SE50 is suitable for hard disks, mobile phones, optical precision equipment, laptops, mobile and communication equipment, automobile engine control equipment, and high-end industrial control and medical electronics.
Q5. What packaging options are available for SE50?
SE50 is available in 30CC / 300CC dispensing syringes and drum packaging of 5KG, 10KG, and 20KG.
