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Cuscinetti termici in fibra di carbonio

Carbon Fiber Thermal Pad CSF40

Vantaggi principali

  • High thermal conductivity for fast heat transfer away from chip-level hot spots
  • Low interface thermal resistance and low loss for efficient heat dissipation
  • High compressibility for soft, conformable fitting on uneven contact surfaces
  • Fast, low-resistance heat dissipation helps improve device efficiency and operating stability
  • Flexible fit and easy assembly help lower contact thermal resistance and reduce assembly damage risk
  • Suitable for demanding electronics, communication modules, and testing applications
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COD: CSF40 Categoria: Marchio:
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Carbon Fiber Thermal Pad CSF40

40 W/m·K High-Rebound Carbon Fiber Thermal Pad for Low Thermal Resistance and Efficient Through-Plane Heat Transfer

CSF40 is a high-rebound carbon fiber thermal pad engineered with advanced vertically aligned carbon-fiber architecture for excellent through-plane heat transfer. With thermal conductivity up to 40.0 W/m·K, low thermal resistance, and stable thermal performance, it efficiently conducts heat between heat-generating components and heat sinks or cooling modules.

CSF40
40 W/m·K
Thermal Resistance 0.08 °C·in²/W @20 psi
High-Rebound Carbon Fiber Pad
0.3–12.0 mm
UL94 V-0

Series Snapshot
Modello
CSF40
Colore
Black
Thickness Range
0.3–12.0 mm
Densità
2.6 ± 0.2 g/cm³

Informazioni tecniche

Review the product positioning, core parameters, compression behavior, and application fit for CSF40 carbon fiber thermal pad.

Q1

What is CSF40 designed for?

CSF40 is designed for thermal-interface applications that need strong through-plane heat transfer, low interface thermal resistance, and soft conformable contact. Its vertically aligned carbon-fiber architecture is intended to provide an efficient thermal path between heat-generating components and heat sinks or cooling modules.

Vertically Aligned Carbon-Fiber Direction

Built with advanced vertically aligned carbon-fiber architecture for efficient through-plane heat conduction.

Low Thermal Resistance Interface

Designed to reduce interface resistance and support faster, more efficient heat transfer.

Soft and Conformable Fit

High compressibility helps the material fit uneven contact surfaces more effectively.

Assembly-Friendly Protection

Flexible fit helps protect components from assembly damage while lowering contact thermal resistance.

Q2

What are the core technical data for CSF40?

The table below reflects the currently published updated datasheet values for the CSF40 carbon fiber thermal pad.

ProprietàMetodo di provaCSF40
Conduttività termicaASTM D547040 W/m·K
Thermal Resistance (@20 psi)ASTM D54700.08 °C·in²/W
Temperatura di applicazione/-40 to 150°C
Hardness (Shore 00)ASTM D224060–70
Resistenza alla trazioneASTM D41230 psi
ColoreVisivoBlack
Available ThicknessASTM D3740.3–12.0 mm
DensitàASTM D7922.6 ± 0.2 g/cm³
InfiammabilitàUL94V-0
Compliance/RoHS 2.0 / Halogen-Free / REACH

Q3

What compression and heat-transfer strengths does CSF40 emphasize?

CSF40 is positioned as a soft, cushioning, and compressible thermal pad that lowers contact thermal resistance while supporting efficient through-plane heat transfer.

Fast Low-Resistance Heat Dissipation

40 W/m·K oriented conduction helps move heat away from chip-level hot spots for better device efficiency and operating stability.

Soft Cushioning Contact

Soft, cushioning, and compressible construction helps the pad adapt to complex mounting surfaces.

Lower Contact Thermal Resistance

The product is intended to reduce interface resistance and support faster, more efficient heat transfer.

Assembly-Friendly Fit

The material installs cleanly and helps protect components from assembly damage.

Q4

How should CSF40 be stored and supplied?

The updated datasheet provides simple storage, packaging, and shelf-life guidance for customer projects and sample use.

Imballaggio

Customized packaging is available according to customer requirements.

Storage Conditions

Store in a cool, dry place.
Storage temperature: ≤30°C
Storage humidity: ≤75% RH

Durata di conservazione

12 months from the date of manufacture when stored under recommended conditions.

Production Note

Users should verify material suitability and process compatibility before use in production.

Q5

Which applications fit CSF40 best?

The updated datasheet focuses this product on electronics and test applications that need efficient thermal transfer with soft contact and easy installation.

Chip Testing

Suitable for chip-testing structures that need efficient heat transfer and stable interface contact.

Capacitors

Applicable to capacitor thermal-management structures requiring low interface resistance and conformable fitting.

Optical Modules

A good fit for optical-module assemblies where soft contact and reliable heat dissipation are both important.

5G Base-Station RRU / Thermal-Module Testing

Suitable for communication hardware and thermal-module testing structures with demanding thermal-management requirements.

Download e FAQ

Frequently Asked Questions
Q1. What is the main reason to choose CSF40?
The main reason is to combine 40 W/m·K thermal conductivity with low interface thermal resistance, soft conformable contact, and easy assembly in one carbon fiber thermal pad.
Q2. Is CSF40 suitable only for chip testing?
No. The updated datasheet also lists capacitors, optical modules, 5G base-station RRU, and thermal-module testing among the typical applications.
Q3. What thermal-resistance level is listed?
The current datasheet lists thermal resistance of 0.08 °C·in²/W at 20 psi.
Q4. What storage conditions are recommended?
Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75% RH.
Q5. What is the shelf life of CSF40?
The current datasheet lists a shelf life of 12 months under recommended storage conditions.

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