Carbon Fiber Thermal Pads CSF15
CSF15 combines low density with good durability and uses anisotropic carbon fiber as the main thermally conductive material. Its silicone base is soft and highly compressible, allowing the pad to fill contact gaps, expel interfacial air, and improve heat-transfer efficiency between the heat source and the heat sink.
主なメリット
- High thermal conductivity up to 15.0 W/m·K for efficient heat transfer
- Good flexibility and high compression ratio for better gap filling
- Low-density carbon-fiber structure with good durability
- Excellent flame retardancy with UL94 V-0 rating
- Suitable for lightweight, high-performance thermal-interface design
- Available with optional single-sided or double-sided adhesive
Carbon Fiber Thermal Pads CSF15
15 W/m·K Carbon Fiber Thermal Pad for Lightweight Thermal Interface Control, High Compression Conformability, and Flame-Retardant Heat Transfer
CSF15
15.0 W/m·K
0.3~12 mm
低密度
High Compression Ratio
UL94 V-0
15.0 W/m·K
0.3~12 mm
低密度
High Compression Ratio
UL94 V-0
Series Snapshot
モデル
CSF15
CSF15
カラー
Black
Black
Thickness Range
0.3~12 mm
0.3~12 mm
密度
2.7 ± 0.2 g/cm³
2.7 ± 0.2 g/cm³
技術情報
Review the product positioning, specification data, thermal-interface behavior, conversion options, and application fit for CSF15.
Q1
What is CSF15 designed for?
CSF15 is designed for thermal-interface structures that need high conductivity, lightweight construction, and better conformity to uneven interfaces through soft silicone compression.
Carbon-Fiber TIM Direction
Suitable for designers who need a high-performance thermal pad with a carbon-fiber-filled structure.
Gap Filling Through Compression
The soft silicone sheet compresses well, helping discharge interfacial air and improve contact efficiency.
Lightweight Thermal Management
The product is positioned around low density and good durability for compact electronic assemblies.
Engineer-Oriented Material Choice
A fit for projects balancing conductivity, flexibility, flame retardancy, and customizable thickness.
Q2
What are the core technical data for CSF15?
The current datasheet provides the following values for thermal, electrical, and mechanical screening.
| プロパティ | Test Standard | CSF15 |
|---|---|---|
| カラー | ビジュアル | Black |
| 厚さ | ASTM D374 | 0.3~12 mm |
| Substrate | / | Liquid Silicone Rubber |
| Filling | / | Carbon Fiber, Aluminum Oxide (Al2O3) |
| 密度 | ASTM D792 | 2.7 ± 0.2 g/cm³ |
| 熱伝導率 | ASTM D5470 | 15.0 W/(m·K) |
| Dielectric Breakdown Voltage (AC) | ASTM D149 | 100 V/mm |
| Hardness Range (Shore00) | ASTM D2240 | 40~90 |
| Standard Hardness (Shore00) | ASTM D2240 | 40 / 60 ± 5 |
| 伸び | ASTM D412 | 40% |
| 引張強度 | ASTM D412 | 30 psi |
| Thermal Resistance (1 mm, @20 psi) | ASTM D5470 | 0.28 ℃·in²/W |
| Flame Retardancy | UL94 | V-0 |
| Optimal Compression Ratio | / | 10 ± 5% |
| Applicable Temperature | ASTM D1329 | -50~160℃ |
| Compliance | IEC 62321 / EN 14582 / EN 14372 | RoHS PASS / Halogen PASS / REACH PASS |
Q3
What thermal-interface strengths does CSF15 emphasize?
CSF15 emphasizes high conductivity, interface air removal through compression, and flame-retardant flexibility for more efficient thermal-path control.
高い熱伝導性
The datasheet states conductivity can reach 15.0 W/m·K for stronger heat-transfer efficiency.
Air Discharge at Interface
Compression of the soft silicone body helps discharge interfacial air and improve effective contact.
Reference Thermal Resistance
A published reference value of 0.28 ℃·in²/W is provided for 1 mm thickness at 20 psi.
Flexible Yet Flame Retardant
The pad combines flexibility, compression capability, and UL94 V-0 flame performance in one structure.
Q4
How can CSF15 be configured and handled?
The datasheet supports multiple adhesive options, customization of color / thickness / hardness, and standard dry-place storage as a non-hazardous material.
Adhesive Options
-A1 indicates single-sided adhesive; -A2 indicates double-sided adhesive.
Customization Range
Color, thickness, and hardness can be customized according to customer requirements.
Tolerance & Storage
Thickness tolerance is ±10%; hardness tolerance is ±5%. Store in a cool, dry, ventilated place away from open flames.
賞味期限
24 months, with customized packaging method available.
Q5
Which applications fit CSF15 best?
The current datasheet highlights semiconductor, communication, graphics, LED, and display-related thermal-management applications.
Semiconductor Heat Sink
Suitable for semiconductor heat-sink interfaces that need efficient contact heat transfer.
Communication & Power Equipment
Applicable to communication and power modules that need reliable thermal-interface control.
Graphics Card / Memory Module
A good fit for graphics-card and memory-module heat-transfer interfaces.
LED / LCD / Plasma TV / Vehicle Navigator
Suitable for lighting, display, and automotive navigation assemblies requiring flame-retardant flexible TIM structures.
ダウンロードとFAQ
Technical Resources
Frequently Asked Questions
Q1. What is the main reason to choose CSF15?
The main reason is its combination of 15 W/m·K thermal conductivity, good flexibility, high compression ratio, and flame-retardant performance in one carbon-fiber-based TIM structure.
Q2. Is the published thermal-resistance value a guaranteed in-application value?
No. The datasheet explicitly states the ASTM D5470 interfacial thermal-resistance values are for reference only, and actual performance depends on surface roughness, flatness, and applied pressure.
Q3. Can CSF15 be supplied with adhesive?
Yes. -A1 indicates single-sided adhesive, and -A2 indicates double-sided adhesive.
Q4. Can color, thickness, and hardness be customized?
Yes. The datasheet states that color, thickness, and hardness can all be customized according to customer requirements.
Q5. What is the shelf life of CSF15?
The published shelf life is 24 months.
