--- title: "SE30 Thermal Gel 3.0 W/mK" id: "2612" type: "product" slug: "se30-thermal-gel-3-w-mk" published_at: "2026-03-24T06:25:15+00:00" modified_at: "2026-03-28T07:52:23+00:00" url: "https://www.sheenmaterials.com/se30-thermal-gel-3-w-mk/" markdown_url: "https://www.sheenmaterials.com/se30-thermal-gel-3-w-mk.md" excerpt: "SE30 is a flexible silicone-based thermally conductive gap filler designed for large gap tolerance applications between heat-generating electronic components and heat sinks or housings. With thermal conductivity of 3.0 W/m·K, low interfacial thermal resistance, and excellent thixotropy, it helps create..." taxonomy_product_cat: - "Thermal interface materials" - "Paste/Liquid" - "Single-Component Thermal Conductive Gel" --- [🔍](#) 1. 2. 3. 4. 5. # SE30 Thermal Gel 3.0 W/mK SE30 is a flexible silicone-based thermally conductive gap filler designed for large gap tolerance applications between heat-generating electronic components and heat sinks or housings. With thermal conductivity of 3.0 W/m·K, low interfacial thermal resistance, and excellent thixotropy, it helps create close contact between surfaces, reduces thermal resistance, and improves heat dissipation efficiency. As part of SHEEN’s SE Series 1K Thermal Gel family, SE30 combines softness, compressibility, stable dispensing performance, and reliable electrical insulation. It can be applied manually or with dispensing equipment, making it suitable for projects requiring controlled material placement, low assembly stress, and flexible gap filling in complex electronic structures. ### Key Benefits - Thermal conductivity: 3.0 ± 0.3 W/m·K - Low thermal resistance for efficient heat transfer - Good flexibility and high filling rate for large gap tolerance designs - Excellent thixotropy and stable dispensing performance - Suitable for manual application or automated dispensing - Reliable electrical insulation performance - Excellent flame retardancy, UL94 V-0 - Available in 30CC / 300CC syringes and drum packaging - Compliant with RoHS, Halogen, and REACH requirements Categories: [Thermal interface materials](https://www.sheenmaterials.com/tim/) , [Paste/Liquid](https://www.sheenmaterials.com/paste-liquid/) , [Single-Component Thermal Conductive Gel](https://www.sheenmaterials.com/single-component-thermal-conductive-gel/) Share your love[https://www.facebook.com/sharer/sharer.php?u=https%3A%2F%2Fwww.sheenmaterials.com%2Fse30-thermal-gel-3-w-mk%2F](https://www.facebook.com/sharer/sharer.php?u=https%3A%2F%2Fwww.sheenmaterials.com%2Fse30-thermal-gel-3-w-mk%2F) [https://twitter.com/intent/tweet?url=https%3A%2F%2Fwww.sheenmaterials.com%2Fse30-thermal-gel-3-w-mk%2F&text=SE30%20Thermal%20Gel%203.0%20W%2FmK](https://twitter.com/intent/tweet?url=https%3A%2F%2Fwww.sheenmaterials.com%2Fse30-thermal-gel-3-w-mk%2F&text=SE30%20Thermal%20Gel%203.0%20W%2FmK) [#](#) [https://www.linkedin.com/shareArticle?url=https%3A%2F%2Fwww.sheenmaterials.com%2Fse30-thermal-gel-3-w-mk%2F&title=SE30%20Thermal%20Gel%203.0%20W%2FmK](https://www.linkedin.com/shareArticle?url=https%3A%2F%2Fwww.sheenmaterials.com%2Fse30-thermal-gel-3-w-mk%2F&title=SE30%20Thermal%20Gel%203.0%20W%2FmK) - [描述](#tab-description) ## Technical Information Review the key specifications, recommended applications, installation notes, and downloadable files for SE30. [Specifications](#sp-specs) [Applications](#sp-apps) [Installation Notes](#sp-install) [Downloads & FAQ](#sp-faq) ### Specifications | Property | SE30 | Test Method | | --- | --- | --- | | Color | Pink | Visual | | Thermal Conductivity | 3.0 ± 0.3 W/m·K | ASTM D5470 | | Thermal Resistance (@50 psi) | ≤ 0.08 ℃·in²/W | ASTM D5470 | | Minimum Interface Thickness | 0.1 mm | / | | Extrusion Speed | 50 ± 5 g/min | 30cc EFD cartridges, 0.095" orifice, 90 psi | | Breakdown Voltage (@AC 2 mm) | ≥ 10 kV | ASTM D149 | | Volume Resistivity (@250V) | ≥ 1012 Ω·cm | ASTM D257 | | Density | 3.0 ± 0.2 g/cm³ | ASTM D792 | | Application Temperature | -40 ~ 150℃ | / | | Flammability | UL94 V-0 | UL94 | | RoHS | PASS | IEC 62321 | | Halogen | PASS | EN 14582 | | REACH | PASS | EN 14372 | | Optional | Customized / Low oil leakage / Low volatility | / | ### Applications #### Recommended Applications - Hard disks and mobile phones - Optical precision equipment - Laptops - Mobile and communication equipment - Automobile engine control equipment - High-end industrial control electronics - Medical electronic equipment #### Not Recommended For - Ultra-thin bond line applications that require grease-like spreadability - Rigid sheet-format interfaces where a pad material is preferred - Designs requiring structural adhesion rather than gap filling ### Installation Notes - SE30 is suitable for large gap tolerance applications that require soft and conformable interface filling. - It can be applied manually or with dispensing equipment depending on process requirements. - Use controlled dispensing to ensure tight contact between components and the heat sink or housing. - The material features good thixotropy and stable extrusion behavior for precise placement. - Available in 30CC / 300CC dispensing syringes and drum packaging of 5KG, 10KG, and 20KG. - Store in a dry place at 5–25℃ with the lid tightly sealed and keep away from open flames. - The product is non-toxic and should be stored and transported as a non-hazardous material. - Shelf life: 12 months. The extrusion rate may fluctuate to a certain extent as storage time increases. ### Downloads & FAQ [↓ Download Technical Datasheet](%5BDATASHEET%20LINK%5D) **Q1. What is the main function of SE30?**SE30 is designed to fill gaps between heat-generating components and heat sinks or housings, reducing interfacial thermal resistance while maintaining tight contact and reliable heat dissipation. **Q2. What is the difference between SE30 and lower-grade thermal gels?**SE30 provides a higher thermal conductivity grade at 3.0 ± 0.3 W/m·K while maintaining good flexibility, high filling rate, and stable dispensing characteristics for large gap tolerance applications. **Q3. Is SE30 suitable for manual application or only automated dispensing?**SE30 can be applied manually or with dispensing equipment, depending on the assembly process and production requirements. **Q4. What kind of applications is SE30 suitable for?**SE30 is suitable for hard disks, mobile phones, optical precision equipment, laptops, mobile and communication equipment, automobile engine control equipment, industrial control electronics, and medical electronics. **Q5. What packaging options are available for SE30?**SE30 is available in 30CC / 300CC dispensing syringes and drum packaging of 5KG, 10KG, and 20KG. ## Related products - [https://www.sheenmaterials.com/single-component-thermal-conductive-gel/](https://www.sheenmaterials.com/single-component-thermal-conductive-gel/) ## [Single-Component Thermal Conductive Gel](https://www.sheenmaterials.com/single-component-thermal-conductive-gel/) [Read more](https://www.sheenmaterials.com/single-component-thermal-conductive-gel/) - [Thermal interface materials](https://www.sheenmaterials.com/tim/) , [Paste/Liquid](https://www.sheenmaterials.com/paste-liquid/) , [Single-Component Thermal Conductive Gel](https://www.sheenmaterials.com/single-component-thermal-conductive-gel/) - [https://www.sheenmaterials.com/se600ab-thermal-gel-6-0w-mk/](https://www.sheenmaterials.com/se600ab-thermal-gel-6-0w-mk/) ## [SE600AB Thermal Gel 6.0W/mK](https://www.sheenmaterials.com/se600ab-thermal-gel-6-0w-mk/) [Read more](https://www.sheenmaterials.com/se600ab-thermal-gel-6-0w-mk/) - [Thermal interface materials](https://www.sheenmaterials.com/tim/) , [Paste/Liquid](https://www.sheenmaterials.com/paste-liquid/) , [Thermal Conductive Gel](https://www.sheenmaterials.com/thermal-conductive-gel/) - [https://www.sheenmaterials.com/se800ab-two-component-thermal-gel-8-w-mk/](https://www.sheenmaterials.com/se800ab-two-component-thermal-gel-8-w-mk/) ## [SE800AB Two-Component Thermal Gel 8.0 W/mK](https://www.sheenmaterials.com/se800ab-two-component-thermal-gel-8-w-mk/) [Read more](https://www.sheenmaterials.com/se800ab-two-component-thermal-gel-8-w-mk/) - [Thermal interface materials](https://www.sheenmaterials.com/tim/) , [Paste/Liquid](https://www.sheenmaterials.com/paste-liquid/) , [Two-Component Thermal Conductive Gel](https://www.sheenmaterials.com/two-component-thermal-conductive-gel/) - [https://www.sheenmaterials.com/thermally-conductive-potting/](https://www.sheenmaterials.com/thermally-conductive-potting/) ## [Thermally Conductive Potting](https://www.sheenmaterials.com/thermally-conductive-potting/) [Read more](https://www.sheenmaterials.com/thermally-conductive-potting/) - [Thermal interface materials](https://www.sheenmaterials.com/tim/) , [Paste/Liquid](https://www.sheenmaterials.com/paste-liquid/) , [Thermally conductive potting compound](https://www.sheenmaterials.com/thermally-conductive-potting-compound/)