{"id":3562,"date":"2026-06-25T08:58:50","date_gmt":"2026-06-25T08:58:50","guid":{"rendered":"https:\/\/www.sheenmaterials.com\/?post_type=product&p=3562"},"modified":"2026-06-25T08:58:50","modified_gmt":"2026-06-25T08:58:50","slug":"carbon-fiber-thermal-pad-csf45","status":"publish","type":"product","link":"https:\/\/www.sheenmaterials.com\/ru\/carbon-fiber-thermal-pad-csf45\/","title":{"rendered":"Carbon Fiber Thermal Pad CSF45"},"content":{"rendered":"
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Carbon Fiber Thermal Pad CSF45<\/h2>\n
45 W\/m\u00b7K High-Rebound Carbon Fiber Thermal Pad for Low Thermal Resistance and Efficient Through-Plane Heat Transfer<\/div>\n<\/p><\/div>\n<\/p><\/div>\n

\n CSF45 is a high-rebound carbon fiber thermal pad built with advanced vertically aligned carbon-fiber architecture for excellent through-plane heat transfer. With thermal conductivity up to 45.0 W\/m\u00b7K, low thermal resistance, and stable thermal performance, it provides an efficient thermal path between heat-generating components and heat sinks or cooling modules.\n <\/p>\n

\n CSF45<\/span>
\n 45 W\/m\u00b7K<\/span>
\n Thermal Resistance 0.07 \u00b0C\u00b7in\u00b2\/W @20 psi<\/span>
\n High-Rebound Carbon Fiber Pad<\/span>
\n 0.3\u201312.0 mm<\/span>
\n UL94 V-0<\/span>\n <\/div>\n<\/p><\/div>\n
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Series Snapshot<\/div>\n
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\n \u041c\u043e\u0434\u0435\u043b\u044c<\/span>
\n CSF45<\/span>\n <\/div>\n
\n \u0426\u0432\u0435\u0442<\/span>
\n Black<\/span>\n <\/div>\n
\n Thickness Range<\/span>
\n 0.3\u201312.0 mm<\/span>\n <\/div>\n
\n \u041f\u043b\u043e\u0442\u043d\u043e\u0441\u0442\u044c<\/span>
\n 2.6 \u00b1 0.2 g\/cm\u00b3<\/span>\n <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n<\/section>\n

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\u0422\u0435\u0445\u043d\u0438\u0447\u0435\u0441\u043a\u0430\u044f \u0438\u043d\u0444\u043e\u0440\u043c\u0430\u0446\u0438\u044f<\/h3>\n<\/div><\/div>\n
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Review the product positioning, core parameters, compression behavior, and application fit for CSF45 carbon fiber thermal pad.<\/p>\n

\n Q1 Product Positioning<\/a>
\n Q2 Core Data<\/a>
\n Q3 Compression & Heat Transfer<\/a>
\n Q4 Handling & Storage<\/a>
\n Q5 Applications<\/a>
\n \u0417\u0430\u0433\u0440\u0443\u0437\u043a\u0438 \u0438 \u0447\u0430\u0441\u0442\u043e \u0437\u0430\u0434\u0430\u0432\u0430\u0435\u043c\u044b\u0435 \u0432\u043e\u043f\u0440\u043e\u0441\u044b<\/a>\n <\/div>\n<\/p><\/div>\n<\/section>\n

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\n Q1<\/span><\/p>\n
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What is CSF45 designed for?<\/h3>\n

CSF45 is designed for thermal-interface applications that need strong through-plane heat transfer, low interface thermal resistance, and soft conformable contact. Its vertically aligned carbon-fiber architecture is intended to provide an efficient thermal path between heat-generating components and heat sinks or cooling modules.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n

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\n Vertically Aligned Carbon-Fiber Direction<\/strong><\/p>\n

Built with advanced vertically aligned carbon-fiber architecture for efficient through-plane heat conduction.<\/p>\n<\/p><\/div>\n

\n Low Thermal Resistance Interface<\/strong><\/p>\n

Designed to reduce interface resistance and support faster, more efficient heat transfer.<\/p>\n<\/p><\/div>\n

\n Soft and Conformable Fit<\/strong><\/p>\n

High compressibility helps the material fit uneven contact surfaces more effectively.<\/p>\n<\/p><\/div>\n

\n Assembly-Friendly Protection<\/strong><\/p>\n

Flexible fit helps protect components from assembly damage while lowering contact thermal resistance.<\/p>\n<\/p><\/div>\n<\/div>\n<\/section>\n

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\n Q2<\/span><\/p>\n
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What are the core technical data for CSF45?<\/h3>\n

The table below reflects the currently published updated datasheet values for the CSF45 carbon fiber thermal pad.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n

\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\u041d\u0435\u0434\u0432\u0438\u0436\u0438\u043c\u043e\u0441\u0442\u044c<\/th>\n\u041c\u0435\u0442\u043e\u0434 \u0438\u0441\u043f\u044b\u0442\u0430\u043d\u0438\u044f<\/th>\nCSF45<\/th>\n<\/tr>\n<\/thead>\n
\u0422\u0435\u043f\u043b\u043e\u043f\u0440\u043e\u0432\u043e\u0434\u043d\u043e\u0441\u0442\u044c<\/td>\nASTM D5470<\/td>\n45 W\/m\u00b7K<\/td>\n<\/tr>\n
Thermal Resistance (@20 psi)<\/td>\nASTM D5470<\/td>\n0.07 \u00b0C\u00b7in\u00b2\/W<\/td>\n<\/tr>\n
\u0422\u0435\u043c\u043f\u0435\u0440\u0430\u0442\u0443\u0440\u0430 \u043f\u0440\u0438\u043c\u0435\u043d\u0435\u043d\u0438\u044f<\/td>\n\/<\/td>\n-40 to 150\u00b0C<\/td>\n<\/tr>\n
Hardness (Shore 00)<\/td>\nASTM D2240<\/td>\n60\u201370<\/td>\n<\/tr>\n
\u041f\u0440\u043e\u0447\u043d\u043e\u0441\u0442\u044c \u043d\u0430 \u0440\u0430\u0437\u0440\u044b\u0432<\/td>\nASTM D412<\/td>\n30 psi<\/td>\n<\/tr>\n
\u0426\u0432\u0435\u0442<\/td>\n\u0412\u0438\u0437\u0443\u0430\u043b\u044c\u043d\u044b\u0439<\/td>\nBlack<\/td>\n<\/tr>\n
Available Thickness<\/td>\nASTM D374<\/td>\n0.3\u201312.0 mm<\/td>\n<\/tr>\n
\u041f\u043b\u043e\u0442\u043d\u043e\u0441\u0442\u044c<\/td>\nASTM D792<\/td>\n2.6 \u00b1 0.2 g\/cm\u00b3<\/td>\n<\/tr>\n
\u0412\u043e\u0441\u043f\u043b\u0430\u043c\u0435\u043d\u044f\u0435\u043c\u043e\u0441\u0442\u044c<\/td>\nUL94<\/td>\nV-0<\/td>\n<\/tr>\n
Compliance<\/td>\n\/<\/td>\nRoHS 2.0 \/ Halogen-Free \/ REACH<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/section>\n

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\n Q3<\/span><\/p>\n
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What compression and heat-transfer strengths does CSF45 emphasize?<\/h3>\n

CSF45 is positioned as a soft, cushioning, and compressible thermal pad that lowers contact thermal resistance while supporting efficient through-plane heat transfer.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n

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\n Fast Low-Resistance Heat Dissipation<\/strong><\/p>\n

45 W\/m\u00b7K oriented conduction helps draw heat away from chip-level hot spots for better device efficiency and operating stability.<\/p>\n<\/p><\/div>\n

\n Soft Cushioning Contact<\/strong><\/p>\n

Soft, cushioning, and compressible construction helps the pad adapt to complex mounting surfaces.<\/p>\n<\/p><\/div>\n

\n Lower Contact Thermal Resistance<\/strong><\/p>\n

The product is intended to reduce interface resistance and support faster, more efficient heat transfer.<\/p>\n<\/p><\/div>\n

\n Assembly-Friendly Fit<\/strong><\/p>\n

The material installs cleanly and helps protect components from assembly damage.<\/p>\n<\/p><\/div>\n<\/div>\n<\/section>\n

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\n Q4<\/span><\/p>\n
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How should CSF45 be stored and supplied?<\/h3>\n

The updated datasheet provides simple storage, packaging, and shelf-life guidance for customer projects and sample use.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n

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\n \u0423\u043f\u0430\u043a\u043e\u0432\u043a\u0430<\/strong><\/p>\n

Customized packaging is available according to customer requirements.<\/p>\n<\/p><\/div>\n

\n Storage Conditions<\/strong><\/p>\n

Store in a cool, dry place.
Storage temperature: \u226430\u00b0C
Storage humidity: \u226475% RH<\/p>\n<\/p><\/div>\n

\n \u0421\u0440\u043e\u043a \u0433\u043e\u0434\u043d\u043e\u0441\u0442\u0438<\/strong><\/p>\n

12 months from the date of manufacture when stored under recommended conditions.<\/p>\n<\/p><\/div>\n

\n Production Note<\/strong><\/p>\n

Users should verify material suitability and process compatibility before use in production.<\/p>\n<\/p><\/div>\n<\/div>\n<\/section>\n

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\n Q5<\/span><\/p>\n
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Which applications fit CSF45 best?<\/h3>\n

The updated datasheet focuses this product on electronics and test applications that need efficient thermal transfer with soft contact and easy installation.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n

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Chip Testing<\/h4>\n

Suitable for chip-testing structures that need efficient heat transfer and stable interface contact.<\/p>\n<\/p><\/div>\n

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Capacitors<\/h4>\n

Applicable to capacitor thermal-management structures requiring low interface resistance and conformable fitting.<\/p>\n<\/p><\/div>\n

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Optical Modules<\/h4>\n

A good fit for optical-module assemblies where soft contact and reliable heat dissipation are both important.<\/p>\n<\/p><\/div>\n

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5G Base-Station RRU \/ Thermal-Module Testing<\/h4>\n

Suitable for communication hardware and thermal-module testing structures with demanding thermal-management requirements.<\/p>\n<\/p><\/div>\n<\/div>\n<\/section>\n

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\u0417\u0430\u0433\u0440\u0443\u0437\u043a\u0438 \u0438 \u0447\u0430\u0441\u0442\u043e \u0437\u0430\u0434\u0430\u0432\u0430\u0435\u043c\u044b\u0435 \u0432\u043e\u043f\u0440\u043e\u0441\u044b<\/h3>\n<\/div><\/div>\n
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Technical Resources<\/div>\n
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\n <\/span>Download CSF45 Datasheet
\n <\/a>
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\n <\/span>View Datasheet Center
\n <\/a>
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\n <\/span>Contact Sales for Sample Support
\n <\/a>\n <\/div>\n<\/div>\n
Frequently Asked Questions<\/div>\n
\nQ1. What is the main reason to choose CSF45?<\/summary>\n
\n The main reason is to combine 45 W\/m\u00b7K thermal conductivity with low interface thermal resistance, soft conformable contact, and easy assembly in one carbon fiber thermal pad.\n <\/div>\n<\/details>\n
\nQ2. Is CSF45 suitable only for chip testing?<\/summary>\n
\n No. The updated datasheet also lists capacitors, optical modules, 5G base-station RRU, and thermal-module testing among the typical applications.\n <\/div>\n<\/details>\n
\nQ3. What thermal-resistance level is listed?<\/summary>\n
\n The current datasheet lists thermal resistance of 0.07 \u00b0C\u00b7in\u00b2\/W at 20 psi.\n <\/div>\n<\/details>\n
\nQ4. What storage conditions are recommended?<\/summary>\n
\n Store the product in a cool, dry place with storage temperature \u226430\u00b0C and storage humidity \u226475% RH.\n <\/div>\n<\/details>\n
\nQ5. What is the shelf life of CSF45?<\/summary>\n
\n The current datasheet lists a shelf life of 12 months under recommended storage conditions.\n <\/div>\n<\/details>\n<\/section>\n<\/div>","protected":false},"excerpt":{"rendered":"

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\u041a\u043b\u044e\u0447\u0435\u0432\u044b\u0435 \u043f\u0440\u0435\u0438\u043c\u0443\u0449\u0435\u0441\u0442\u0432\u0430<\/h3>\n<\/div><\/div>\n
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  • High thermal conductivity for fast heat transfer away from chip-level hot spots<\/li>\n
  • Low interface resistance and low loss for efficient thermal dissipation<\/li>\n
  • High compressibility for soft, conformable fitting on uneven contact surfaces<\/li>\n
  • Fast, low-resistance heat dissipation helps improve device efficiency and operating stability<\/li>\n
  • Flexible fit and easy assembly help lower contact thermal resistance and reduce assembly damage risk<\/li>\n
  • Suitable for demanding electronics, communication modules, and testing applications<\/li>\n<\/ul>\n<\/section>","protected":false},"featured_media":555,"template":"","meta":{"_gspb_post_css":"","_llm_markdown_disabled":false},"product_brand":[53],"product_cat":[32],"product_tag":[],"class_list":["post-3562","product","type-product","status-publish","has-post-thumbnail","product_brand-sheen","product_cat-carbon-fiber-thermal-pads","first","instock","shipping-taxable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/www.sheenmaterials.com\/ru\/wp-json\/wp\/v2\/product\/3562","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sheenmaterials.com\/ru\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.sheenmaterials.com\/ru\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ru\/wp-json\/wp\/v2\/media\/555"}],"wp:attachment":[{"href":"https:\/\/www.sheenmaterials.com\/ru\/wp-json\/wp\/v2\/media?parent=3562"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ru\/wp-json\/wp\/v2\/product_brand?post=3562"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ru\/wp-json\/wp\/v2\/product_cat?post=3562"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ru\/wp-json\/wp\/v2\/product_tag?post=3562"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}