{"id":3335,"date":"2026-06-04T07:18:30","date_gmt":"2026-06-04T07:18:30","guid":{"rendered":"https:\/\/www.sheenmaterials.com\/?page_id=3335"},"modified":"2026-08-14T00:49:40","modified_gmt":"2026-08-14T00:49:40","slug":"camera-fpga-thermal-dissipation-and-optical-cleanliness-solution","status":"publish","type":"page","link":"https:\/\/www.sheenmaterials.com\/ru\/applications\/camera-fpga-thermal-dissipation-and-optical-cleanliness-solution\/","title":{"rendered":"Camera FPGA Thermal Dissipation and Optical Cleanliness Solution"},"content":{"rendered":"
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Camera FPGA Thermal Dissipation and Optical Cleanliness Solution<\/h1>\n\n\n\n

This page addresses a camera assembly in which an FPGA operates at 55\u201370\u00b0C while the optical window remains sensitive to volatile residue from conventional silicone-based thermal interface materials.<\/br>\n\nThe design objective is to maintain a stable thermal path from the FPGA to the heat sink or housing, while reducing the risk of silicone-related deposition on optical surfaces over long operating periods.<\/br><\/p>\n<\/div>\n\n\n\n

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