--- title: "Carbon Fiber Thermal Pad CSF45" id: "3562" type: "product" slug: "carbon-fiber-thermal-pad-csf45" published_at: "2026-06-25T08:58:50+00:00" modified_at: "2026-06-25T08:58:50+00:00" url: "https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf45/" markdown_url: "https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf45.md" excerpt: "Key Benefits High thermal conductivity for fast heat transfer away from chip-level hot spots Low interface resistance and low loss for efficient thermal dissipation High compressibility for soft, conformable fitting on uneven contact surfaces Fast, low-resistance heat dissipation helps improve..." taxonomy_product_brand: - "Sheen" taxonomy_product_cat: - "Carbon Fiber Thermal Pads" --- [🔍](#) # Carbon Fiber Thermal Pad CSF45 ### Ключевые преимущества - High thermal conductivity for fast heat transfer away from chip-level hot spots - Low interface resistance and low loss for efficient thermal dissipation - High compressibility for soft, conformable fitting on uneven contact surfaces - Fast, low-resistance heat dissipation helps improve device efficiency and operating stability - Flexible fit and easy assembly help lower contact thermal resistance and reduce assembly damage risk - Suitable for demanding electronics, communication modules, and testing applications Артикул: CSF45Категория: [Термопрокладки из углеродного волокна](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads/) Бренд: [Шин](https://www.sheenmaterials.com/ru/%D0%B1%D1%80%D0%B5%D0%BD%D0%B4/sheen/) Поделитесь с друзьями[https://www.facebook.com/sharer/sharer.php?u=https%3A%2F%2Fwww.sheenmaterials.com%2Fru%2Fcarbon-fiber-thermal-pad-csf45%2F](https://www.facebook.com/sharer/sharer.php?u=https%3A%2F%2Fwww.sheenmaterials.com%2Fru%2Fcarbon-fiber-thermal-pad-csf45%2F) [https://twitter.com/intent/tweet?url=https%3A%2F%2Fwww.sheenmaterials.com%2Fru%2Fcarbon-fiber-thermal-pad-csf45%2F&text=Carbon%20Fiber%20Thermal%20Pad%20CSF45](https://twitter.com/intent/tweet?url=https%3A%2F%2Fwww.sheenmaterials.com%2Fru%2Fcarbon-fiber-thermal-pad-csf45%2F&text=Carbon%20Fiber%20Thermal%20Pad%20CSF45) [#](#) [https://www.linkedin.com/shareArticle?url=https%3A%2F%2Fwww.sheenmaterials.com%2Fru%2Fcarbon-fiber-thermal-pad-csf45%2F&title=Carbon%20Fiber%20Thermal%20Pad%20CSF45](https://www.linkedin.com/shareArticle?url=https%3A%2F%2Fwww.sheenmaterials.com%2Fru%2Fcarbon-fiber-thermal-pad-csf45%2F&title=Carbon%20Fiber%20Thermal%20Pad%20CSF45) - [Описание](#tab-description) ## Carbon Fiber Thermal Pad CSF45 45 W/m·K High-Rebound Carbon Fiber Thermal Pad for Low Thermal Resistance and Efficient Through-Plane Heat Transfer CSF45 is a high-rebound carbon fiber thermal pad built with advanced vertically aligned carbon-fiber architecture for excellent through-plane heat transfer. With thermal conductivity up to 45.0 W/m·K, low thermal resistance, and stable thermal performance, it provides an efficient thermal path between heat-generating components and heat sinks or cooling modules. CSF45 45 W/m·K Thermal Resistance 0.07 °C·in²/W @20 psi High-Rebound Carbon Fiber Pad 0.3–12.0 mm UL94 V-0 Series Snapshot Модель CSF45 Цвет Black Thickness Range 0.3–12.0 mm Плотность 2.6 ± 0.2 g/cm³ ### Техническая информация Review the product positioning, core parameters, compression behavior, and application fit for CSF45 carbon fiber thermal pad. [Q1 Product Positioning](#csf45-q1) [Q2 Core Data](#csf45-q2) [Q3 Compression & Heat Transfer](#csf45-q3) [Q4 Handling & Storage](#csf45-q4) [Q5 Applications](#csf45-q5) [Загрузки и часто задаваемые вопросы](#csf45-downloads) Q1### What is CSF45 designed for? CSF45 is designed for thermal-interface applications that need strong through-plane heat transfer, low interface thermal resistance, and soft conformable contact. Its vertically aligned carbon-fiber architecture is intended to provide an efficient thermal path between heat-generating components and heat sinks or cooling modules. **Vertically Aligned Carbon-Fiber Direction**Built with advanced vertically aligned carbon-fiber architecture for efficient through-plane heat conduction. **Low Thermal Resistance Interface**Designed to reduce interface resistance and support faster, more efficient heat transfer. **Soft and Conformable Fit**High compressibility helps the material fit uneven contact surfaces more effectively. **Assembly-Friendly Protection**Flexible fit helps protect components from assembly damage while lowering contact thermal resistance. Q2### What are the core technical data for CSF45? The table below reflects the currently published updated datasheet values for the CSF45 carbon fiber thermal pad. | Недвижимость | Метод испытания | CSF45 | | --- | --- | --- | | Теплопроводность | ASTM D5470 | 45 W/m·K | | Thermal Resistance (@20 psi) | ASTM D5470 | 0.07 °C·in²/W | | Температура применения | / | -40 to 150°C | | Hardness (Shore 00) | ASTM D2240 | 60–70 | | Прочность на разрыв | ASTM D412 | 30 psi | | Цвет | Визуальный | Black | | Available Thickness | ASTM D374 | 0.3–12.0 mm | | Плотность | ASTM D792 | 2.6 ± 0.2 g/cm³ | | Воспламеняемость | UL94 | V-0 | | Compliance | / | RoHS 2.0 / Halogen-Free / REACH | Q3### What compression and heat-transfer strengths does CSF45 emphasize? CSF45 is positioned as a soft, cushioning, and compressible thermal pad that lowers contact thermal resistance while supporting efficient through-plane heat transfer. **Fast Low-Resistance Heat Dissipation**45 W/m·K oriented conduction helps draw heat away from chip-level hot spots for better device efficiency and operating stability. **Soft Cushioning Contact**Soft, cushioning, and compressible construction helps the pad adapt to complex mounting surfaces. **Lower Contact Thermal Resistance**The product is intended to reduce interface resistance and support faster, more efficient heat transfer. **Assembly-Friendly Fit**The material installs cleanly and helps protect components from assembly damage. Q4### How should CSF45 be stored and supplied? The updated datasheet provides simple storage, packaging, and shelf-life guidance for customer projects and sample use. **Упаковка**Customized packaging is available according to customer requirements. **Storage Conditions**Store in a cool, dry place. Storage temperature: ≤30°C Storage humidity: ≤75% RH **Срок годности**12 months from the date of manufacture when stored under recommended conditions. **Production Note**Users should verify material suitability and process compatibility before use in production. Q5### Which applications fit CSF45 best? The updated datasheet focuses this product on electronics and test applications that need efficient thermal transfer with soft contact and easy installation. #### Chip Testing Suitable for chip-testing structures that need efficient heat transfer and stable interface contact. #### Capacitors Applicable to capacitor thermal-management structures requiring low interface resistance and conformable fitting. #### Optical Modules A good fit for optical-module assemblies where soft contact and reliable heat dissipation are both important. #### 5G Base-Station RRU / Thermal-Module Testing Suitable for communication hardware and thermal-module testing structures with demanding thermal-management requirements. ### Загрузки и часто задаваемые вопросы Technical Resources [Download CSF45 Datasheet](https://www.sheenmaterials.com/wp-content/uploads/2026/06/CSF45-Datasheet-EN-20260609-update.pdf) [View Datasheet Center](https://www.sheenmaterials.com/ru/resource/datasheet-download/) [Contact Sales for Sample Support](/cdn-cgi/l/email-protection#eb988a878e98d8ab9ec698838e8e85c5888486) Frequently Asked Questions Q1. What is the main reason to choose CSF45?The main reason is to combine 45 W/m·K thermal conductivity with low interface thermal resistance, soft conformable contact, and easy assembly in one carbon fiber thermal pad. Q2. Is CSF45 suitable only for chip testing?No. The updated datasheet also lists capacitors, optical modules, 5G base-station RRU, and thermal-module testing among the typical applications. Q3. What thermal-resistance level is listed?The current datasheet lists thermal resistance of 0.07 °C·in²/W at 20 psi. Q4. What storage conditions are recommended?Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75% RH. Q5. What is the shelf life of CSF45?The current datasheet lists a shelf life of 12 months under recommended storage conditions. ## Похожие товары - [https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads-csf-15w/](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads-csf-15w/) ## [Carbon Fiber Thermal Pads CSF15](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads-csf-15w/) [Подробнее](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads-csf-15w/) - [Термопрокладки из углеродного волокна](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads/) - [https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf30/](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf30/) ## [Carbon Fiber Thermal Pad CSF30](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf30/) [Подробнее](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf30/) - [Термопрокладки из углеродного волокна](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads/) - [https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf40/](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf40/) ## [Carbon Fiber Thermal Pad CSF40](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf40/) [Подробнее](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pad-csf40/) - [Термопрокладки из углеродного волокна](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads/) - [https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads-csf-10/](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads-csf-10/) ## [Carbon Fiber Thermal Pads CSF10](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads-csf-10/) [Подробнее](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads-csf-10/) - [Термопрокладки из углеродного волокна](https://www.sheenmaterials.com/ru/carbon-fiber-thermal-pads/)