{"id":2974,"date":"2026-04-24T14:03:48","date_gmt":"2026-04-24T14:03:48","guid":{"rendered":"https:\/\/www.sheenmaterials.com\/?p=2974"},"modified":"2026-04-24T14:03:49","modified_gmt":"2026-04-24T14:03:49","slug":"thermal-interface-materials-for-ai-servers","status":"publish","type":"post","link":"https:\/\/www.sheenmaterials.com\/pt\/thermal-interface-materials-for-ai-servers\/","title":{"rendered":"Optimizing Cooling: Thermal Interface Materials for AI Servers"},"content":{"rendered":"<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\"><\/p>\n<\/blockquote>\n\n\n\n<p class=\"wp-block-paragraph\"><a href=\"https:\/\/www.sheenmaterials.com\/pt\/applications\/communication-and-ai-infrastructure\/server\/\">AI servers<\/a> are running hotter than a summer sidewalk, and thermal interface materials for AI servers are now the make-or-break fix standing between peak performance and fried silicon.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Gartner reports data center leaders rank advanced cooling among top infrastructure priorities through 2025.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Choose smart interfaces, or pay later dearly.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"melodies-of-cooling-thermal-interface-materials-for-ai-servers\">Melodies of Cooling: Thermal Interface Materials for AI Servers<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">\u2794&nbsp;<strong>Heat Management<\/strong>: Leverage phase-change pads or liquid metal to tackle GPU and accelerator hotspots.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2794&nbsp;<strong>Contact Optimization<\/strong>: Minimize bond-line thickness and ensure pad compressibility to enhance heat transfer.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2794&nbsp;<strong>Material Selection<\/strong>: Balance thermal conductivity, viscosity, electrical insulation, and outgassing for reliable, long-life AI server cooling.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"why-do-ai-servers-overheat-rapidly-\">Why Do AI Servers Overheat Rapidly?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">AI racks are running hotter than ever, and it\u2019s not just because workloads are heavy. From&nbsp;<strong>AI accelerators<\/strong>&nbsp;to memory stacks, heat piles fast. That\u2019s why&nbsp;<strong>thermal interface materials for AI servers<\/strong>&nbsp;matter so much. Getting&nbsp;<strong>thermal interface materials for AI servers<\/strong>&nbsp;right can mean stable uptime instead of random shutdowns.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"excess-heat-from-ai-accelerators-and-gpus\">Excess Heat from AI Accelerators and GPUs<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Quando&nbsp;<strong>AI accelerators<\/strong>&nbsp;e&nbsp;<strong>GPUs<\/strong>&nbsp;push dense parallel models,&nbsp;<strong>heat generation<\/strong>&nbsp;skyrockets.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Core Sources of Heat<\/li>\n\n\n\n<li>1 Chip Density\n<ul class=\"wp-block-list\">\n<li>Shrinking nodes increase&nbsp;<strong>densidade de pot\u00eancia<\/strong>.<\/li>\n\n\n\n<li>More transistors per mm\u00b2 means higher localized&nbsp;<strong>heat flux<\/strong>.<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<pre class=\"wp-block-code\"><code>2.2 Workload Intensity\n\n*   Continuous tensor operations raise **power consumption**.\n\n*   High performance computing clusters rarely idle.\n<\/code><\/pre>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Rack-Level Impact2.1 Airflow Limits<ul><li>Tightly packed&nbsp;<strong>server components<\/strong>&nbsp;restrict cooling paths.<\/li><\/ul>2.2 Cooling Bottlenecks\n<ul class=\"wp-block-list\">\n<li>Traditional heat sinks struggle under AI loads.<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<figure class=\"wp-block-table is-style-stripes\"><table class=\"has-fixed-layout\"><thead><tr><th>Componente<\/th><th class=\"has-text-align-center\" data-align=\"center\">Avg Power (W)<\/th><th class=\"has-text-align-center\" data-align=\"center\">Heat Flux (W\/cm\u00b2)<\/th><th class=\"has-text-align-center\" data-align=\"center\">Temp Rise (\u00b0C)<\/th><\/tr><\/thead><tbody><tr><td>GPU (H100 class)<\/td><td class=\"has-text-align-center\" data-align=\"center\">700<\/td><td class=\"has-text-align-center\" data-align=\"center\">120<\/td><td class=\"has-text-align-center\" data-align=\"center\">35<\/td><\/tr><tr><td>AI Accelerator<\/td><td class=\"has-text-align-center\" data-align=\"center\">600<\/td><td class=\"has-text-align-center\" data-align=\"center\">110<\/td><td class=\"has-text-align-center\" data-align=\"center\">32<\/td><\/tr><tr><td>CPU<\/td><td class=\"has-text-align-center\" data-align=\"center\">350<\/td><td class=\"has-text-align-center\" data-align=\"center\">75<\/td><td class=\"has-text-align-center\" data-align=\"center\">20<\/td><\/tr><tr><td>HBM Stack<\/td><td class=\"has-text-align-center\" data-align=\"center\">80<\/td><td class=\"has-text-align-center\" data-align=\"center\">40<\/td><td class=\"has-text-align-center\" data-align=\"center\">12<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">This is exactly where&nbsp;thermal interface materials for AI servers&nbsp;step in. High-performance gap fillers and phase-change pads reduce&nbsp;thermal resistance&nbsp;between dies and cold plates. Many data centers now rely on advanced&nbsp;thermal interface materials&nbsp;to keep GPUs sane under load. Sheen materials engineers its&nbsp;thermal interface materials for AI<strong> servers<\/strong>&nbsp;to handle extreme&nbsp;<strong>dissipa\u00e7\u00e3o de calor<\/strong>&nbsp;demands without pump-out or dry-out issues.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">\u201cAI server power density is increasing at a rate that outpaces conventional air cooling improvements,\u201d noted the International Energy Agency (IEA) in its 2025 data centre update.<\/p>\n<\/blockquote>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"poor-thermal-contact-on-cpus-and-memory-modules\">Poor Thermal Contact on CPUs and Memory Modules<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Heat transfer lives or dies at the interface. Tiny surface flaws on&nbsp;<strong>CPUs<\/strong>&nbsp;e&nbsp;<strong>memory modules<\/strong>&nbsp;trap air, and air is a terrible conductor.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Uneven&nbsp;<strong>contacto t\u00e9rmico<\/strong>&nbsp;raises interface temperature.<\/li>\n\n\n\n<li>Fraco&nbsp;<strong>interface materials<\/strong>&nbsp;create micro-voids.<\/li>\n\n\n\n<li>Mais alto&nbsp;<strong>resist\u00eancia t\u00e9rmica<\/strong>&nbsp;slows&nbsp;<strong>dissipa\u00e7\u00e3o de calor<\/strong>.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Here\u2019s what usually happens:<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">1) Silicon die heats up.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">2) Heat hits an imperfect layer of paste or pad.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">3) Air gaps block efficient&nbsp;<strong>transfer\u00eancia de calor<\/strong>.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">4) Junction temps creep higher than expected.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Good&nbsp;thermal interface materials for AI<strong> servers<\/strong>&nbsp;fix this by filling microscopic valleys. A proper AI server thermal interface layer spreads pressure evenly across chips and heat spreaders. Sheen materials focus on stable viscosity and controlled bond-line thickness, helping&nbsp;<strong>component cooling<\/strong>&nbsp;stay consistent over long AI training cycles. In short, better contact equals cooler silicon.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"high-power-dissipation-driving-junction-temperature-rise\">High Power Dissipation Driving Junction Temperature Rise<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Elevado&nbsp;<strong>power dissipation<\/strong>&nbsp;directly drives&nbsp;<strong>temperatura da jun\u00e7\u00e3o<\/strong>&nbsp;upward.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Device-Level Effects  1.1 Elevated&nbsp;<strong>heat flux<\/strong><ul><li>Raises internal lattice vibration.<\/li><\/ul>1.2 Material Stress\n<ul class=\"wp-block-list\">\n<li>Accelerates electromigration in&nbsp;<strong>semiconductor devices<\/strong>.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>System-Level Risks   2.1 Thermal Accumulation<ul><li>Pobres&nbsp;<strong>conce\u00e7\u00e3o t\u00e9rmica<\/strong>&nbsp;compounds hotspots.<\/li><\/ul>2.2 Reliability Decline\n<ul class=\"wp-block-list\">\n<li>Increased failure rates in high-density racks.<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">As&nbsp;<strong>densidade de pot\u00eancia<\/strong>&nbsp;climbs, so does the risk of&nbsp;<strong>fuga t\u00e9rmica<\/strong>. Reliable&nbsp;<strong>thermal interface materials for AI servers<\/strong>&nbsp;act as a pressure valve, moving energy away before it damages silicon. Long-term&nbsp;<strong>fiabilidade dos componentes<\/strong>&nbsp;depends on stable interfaces, predictable conductivity, and consistent mechanical strength.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Data centers chasing AI growth can\u2019t ignore this. Smarter cooling starts at the microscopic layer\u2014the interface that quietly decides if your hardware runs cool or burns out.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"types-of-thermal-interface-materials\">Tipos de materiais de interface t\u00e9rmica<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">AI racks run hot, and not in a cool way. Choosing the right&nbsp;<strong>thermal interface materials for AI servers<\/strong>&nbsp;can make or break uptime. From grease to graphite, each option handles heat, pressure, and gap filling a bit differently in modern AI server cooling systems.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"thermal-grease\"><a href=\"https:\/\/www.sheenmaterials.com\/pt\/single-component-thermal-conductive-gel\/\">Massa t\u00e9rmica<\/a><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">In high-density racks using&nbsp;<strong>thermal interface materials for AI servers<\/strong>, thermal grease stays a go-to because of its low bond line thickness and steady&nbsp;<strong>condutividade t\u00e9rmica<\/strong>.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Tra\u00e7os materiais essenciais:\n<ul class=\"wp-block-list\">\n<li><strong>Silicone-based<\/strong>&nbsp;matrix<\/li>\n\n\n\n<li>Ceramic or metallic fillers<\/li>\n\n\n\n<li>Tuned&nbsp;<strong>viscosidade<\/strong>&nbsp;for print or syringe&nbsp;<strong>application<\/strong><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Performance drivers\n<ol class=\"wp-block-list\">\n<li>Ultra-thin spread reduces thermal resistance.<\/li>\n\n\n\n<li>Forte&nbsp;<strong>preenchimento de lacunas<\/strong>&nbsp;for micro-voids.<\/li>\n\n\n\n<li>Controlado&nbsp;<strong>pump-out<\/strong>&nbsp;under thermal cycling.<\/li>\n<\/ol>\n<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">For AI GPUs pushing constant loads,&nbsp;<strong>non-curing<\/strong>&nbsp;formulas keep interface stability tight. In data centers focused on&nbsp;<strong>thermal interface materials for AI servers<\/strong>, grease remains practical, affordable, and easy to rework.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Sheen materials offers server-grade grease engineered for balanced&nbsp;<strong>viscosidade<\/strong>&nbsp;and long-term reliability in AI server farms.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"thermal-pads\"><a href=\"https:\/\/www.sheenmaterials.com\/pt\/tim\/\">Almofadas t\u00e9rmicas<\/a><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">When assembly speed matters, pads simplify&nbsp;<strong>installation<\/strong>&nbsp;in AI server builds.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Material characteristics:\n<ul class=\"wp-block-list\">\n<li><strong>Elastomeric<\/strong>&nbsp;body<\/li>\n\n\n\n<li>Built-in&nbsp;<strong>dielectric<\/strong>&nbsp;for\u00e7a<\/li>\n\n\n\n<li>Engineered&nbsp;<strong>espessura<\/strong><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Pads shine in stacked boards:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Mechanical behavior\n<ol class=\"wp-block-list\">\n<li>Elevado&nbsp;<strong>conformabilidade<\/strong>&nbsp;handles tolerance stack-up.<\/li>\n\n\n\n<li>Controlado&nbsp;<strong>compression<\/strong>&nbsp;keeps contact steady.<\/li>\n\n\n\n<li>Fi\u00e1vel&nbsp;<strong>preenchimento de lacunas<\/strong>&nbsp;across memory and VRMs.<\/li>\n<\/ol>\n<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">For teams scaling&nbsp;<strong>thermal interface materials for AI servers<\/strong>, pads cut labor time and reduce mess. That\u2019s why many hyperscale builders pair pads with liquid cooling plates for balanced AI server thermal management.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"liquid-metal\"><a href=\"https:\/\/www.sheenmaterials.com\/pt\/paste-liquid\/\">Liquid Metal<\/a><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Liquid metal is the heavy hitter in&nbsp;<strong>thermal interface materials for ai servers<\/strong>.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Key attributes include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Gallium alloy<\/strong>&nbsp;chemistry<\/li>\n\n\n\n<li>Extreme&nbsp;<strong>high conductivity<\/strong><\/li>\n\n\n\n<li>Forte&nbsp;<strong>wetting properties<\/strong><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Application isn\u2019t casual:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Surface prep\n<ol class=\"wp-block-list\">\n<li>Polish and clean mating surfaces.<\/li>\n\n\n\n<li>Prevent oxidation.<\/li>\n<\/ol>\n<\/li>\n\n\n\n<li>Risk control\n<ol class=\"wp-block-list\">\n<li>Manage&nbsp;<strong>electrical conductivity<\/strong>&nbsp;with insulation barriers.<\/li>\n\n\n\n<li>Watch&nbsp;<strong>corrosion risk<\/strong>&nbsp;on aluminum.<\/li>\n<\/ol>\n<\/li>\n\n\n\n<li>Handling\n<ol class=\"wp-block-list\">\n<li>Account for&nbsp;<strong>surface tension<\/strong>.<\/li>\n\n\n\n<li>Reduce&nbsp;<strong>application difficulty<\/strong>&nbsp;through precision tools.<\/li>\n<\/ol>\n<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">Used right, liquid metal supports peak AI processor loads in advanced AI server cooling stacks.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"phase-change-materials\"><a href=\"https:\/\/www.sheenmaterials.com\/pt\/phase-change-thermal-interface-material\/\">Phase Change Materials<\/a><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">These are smart, almost sneaky. At room temperature, solid. Under load, soft.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Core mechanics in&nbsp;<strong>thermal interface materials for AI servers<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Defined&nbsp;<strong>melting point<\/strong><\/li>\n\n\n\n<li>Controlado&nbsp;<strong>solid-liquid transition<\/strong><\/li>\n\n\n\n<li>Est\u00e1vel&nbsp;<strong>ciclo t\u00e9rmico<\/strong><\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Composition layers\n<ol class=\"wp-block-list\">\n<li><strong>Wax-based<\/strong>&nbsp;compounds<\/li>\n\n\n\n<li>Refor\u00e7ado&nbsp;<strong>matriz polim\u00e9rica<\/strong><\/li>\n<\/ol>\n<\/li>\n\n\n\n<li>Operational impact\n<ol class=\"wp-block-list\">\n<li>Melhorado&nbsp;<strong>interface contact<\/strong>&nbsp;under heat.<\/li>\n\n\n\n<li>Enhanced long-term&nbsp;<strong>fiabilidade<\/strong>.<\/li>\n<\/ol>\n<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">In large AI clusters, phase change sheets help maintain consistent contact pressure without messy reapplication. <strong>Materiais de brilho<\/strong> designs PCM solutions tuned for repeated GPU ramp cycles in AI server deployments.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"graphite-sheets\"><a href=\"https:\/\/www.sheenmaterials.com\/pt\/graphene-thermal-pads\/\">Graphite Sheets<\/a><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Graphite sheets play a different game. Instead of pushing heat down, they spread it sideways.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Primary traits:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Anisotropic conductivity<\/strong><\/li>\n\n\n\n<li>Ultra&nbsp;<strong>thinness<\/strong><\/li>\n\n\n\n<li>Natural&nbsp;<strong>flexibilidade<\/strong><\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Functional layers\n<ol class=\"wp-block-list\">\n<li>Elevado&nbsp;<strong>planar heat spreading<\/strong>&nbsp;for hotspots.<\/li>\n\n\n\n<li>Opcional&nbsp;<strong>isolamento el\u00e9trico<\/strong>&nbsp;coatings.<\/li>\n<\/ol>\n<\/li>\n\n\n\n<li>Mechanical value\n<ol class=\"wp-block-list\">\n<li>Easy,&nbsp;<strong>dry application<\/strong>.<\/li>\n\n\n\n<li>Forte&nbsp;<strong>durabilidade<\/strong>&nbsp;under vibration.<\/li>\n<\/ol>\n<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">In compact blade systems using&nbsp;<strong>thermal interface materials for ai servers<\/strong>, graphite supports lateral heat flow toward cold plates. For edge AI nodes and dense compute trays, it\u2019s a clean, low-profile fix that keeps temperatures in check without extra bulk.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"4-key-factors-in-thermal-interface-selection\">4 Key Factors in Thermal Interface Selection<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">AI racks are running hot, and picking the right&nbsp;<strong>thermal interface materials for ai servers<\/strong>&nbsp;is not just a spec-sheet game. From&nbsp;<strong>condutividade t\u00e9rmica<\/strong>&nbsp;to&nbsp;<strong>desgaseifica\u00e7\u00e3o<\/strong>, every detail shapes uptime. Let\u2019s break down what truly matters when choosing thermal interface materials for AI servers in dense data halls.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"thermal-conductivity-vs-viscosity-tradeoff\">Thermal Conductivity vs. Viscosity Tradeoff<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Balancing&nbsp;<strong>condutividade t\u00e9rmica<\/strong>&nbsp;e&nbsp;<strong>viscosidade<\/strong>&nbsp;defines how well&nbsp;<strong>thermal interface materials for AI servers<\/strong>&nbsp;move heat while staying manufacturable.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Core performance drivers\n<ul class=\"wp-block-list\">\n<li><strong>Condutividade t\u00e9rmica<\/strong>\n<ul class=\"wp-block-list\">\n<li>Higher W\/m\u00b7K improves&nbsp;<strong>transfer\u00eancia de calor<\/strong><\/li>\n\n\n\n<li>Reduces overall&nbsp;thermal resistance&nbsp;between the GPU and the cold plate<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Viscosidade<\/strong>\n<ul class=\"wp-block-list\">\n<li>Impacts&nbsp;the <strong>material flow<\/strong><\/li>\n\n\n\n<li>Affects automated&nbsp;<strong>dispensing<\/strong>&nbsp;speed<\/li>\n\n\n\n<li>Controls precision in&nbsp;<strong>preenchimento de lacunas<\/strong><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Manufacturing considerations\n<ul class=\"wp-block-list\">\n<li>High filler loading \u2192 better conductivity\n<ul class=\"wp-block-list\">\n<li>But raises viscosity<\/li>\n\n\n\n<li>Harder screen printing<\/li>\n\n\n\n<li>Greater pump wear<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Below is a typical performance comparison for the AI server TIM:<\/p>\n\n\n\n<figure class=\"wp-block-table is-style-stripes\"><table class=\"has-fixed-layout\"><thead><tr><th>Tipo de material<\/th><th>Condutividade t\u00e9rmica (W\/m-K)<\/th><th>Viscosity (Pa\u00b7s @25\u00b0C)<\/th><th>Typical Application<\/th><th>Resist\u00eancia t\u00e9rmica (\u00b0C-cm\u00b2\/W)<\/th><\/tr><\/thead><tbody><tr><td>Silicone Grease<\/td><td>3.5<\/td><td>120<\/td><td>GPU lid<\/td><td>0.18<\/td><\/tr><tr><td>Filled Gel<\/td><td>6.0<\/td><td>250<\/td><td>AI accelerator<\/td><td>0.12<\/td><\/tr><tr><td>Mudan\u00e7a de fase<\/td><td>8.5<\/td><td>90 (melt)<\/td><td>High-power ASIC<\/td><td>0.10<\/td><\/tr><tr><td>Pad (2 mm)<\/td><td>5.0<\/td><td>S\u00f3lido<\/td><td>Memory module<\/td><td>0.22<\/td><\/tr><tr><td>Sheen materials Hybrid Paste<\/td><td>10.0<\/td><td>180<\/td><td>AI GPU cold plate<\/td><td>0.08<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Para&nbsp;<strong>thermal interface materials for ai servers<\/strong>, the sweet spot often sits where conductivity rises without killing throughput. That\u2019s where engineered blends from Sheen materials stand out in real production lines.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"bond-line-thickness-and-compressibility\">Bond Line Thickness and Compressibility<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">When it comes to AI server cooling materials,&nbsp;<strong>espessura da linha de liga\u00e7\u00e3o<\/strong>&nbsp;can make or break thermal math.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Thinner bond lines lower&nbsp;<strong>resist\u00eancia t\u00e9rmica<\/strong>.<\/li>\n\n\n\n<li>Adequado&nbsp;<strong>compressibilidade<\/strong>&nbsp;ensures proper&nbsp;<strong>preenchimento de lacunas<\/strong>.<\/li>\n\n\n\n<li>Correto&nbsp;<strong>press\u00e3o de contacto<\/strong>&nbsp;improves surface wetting.<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">Copper cold plates and nickel-plated heat spreaders aren\u2019t perfectly flat. There\u2019s always&nbsp;<strong>surface roughness<\/strong>. A good TIM must offer:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Elevado&nbsp;<strong>conformabilidade<\/strong><\/li>\n\n\n\n<li>Stable compression set<\/li>\n\n\n\n<li>Controlled pump-out under cycling<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">In practice:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Too thin \u2192 dry spots, poor&nbsp;<strong>transfer\u00eancia de calor<\/strong><\/li>\n\n\n\n<li>Too thick \u2192 higher resistance<\/li>\n\n\n\n<li>Too stiff \u2192 weak interface contact<\/li>\n\n\n\n<li>Too soft \u2192 extrusion under load<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">For thermal interface materials for AI servers, the trick is dialing thickness and compression together. Sheen materials tune filler shape and polymer backbone to maintain uniform bond lines across multi-chip GPU modules.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"electrical-insulation-and-dielectric-strength\">Electrical Insulation and Dielectric Strength<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Inside AI accelerators, power density is wild. That makes&nbsp;<strong>isolamento el\u00e9trico<\/strong>&nbsp;just as important as cooling.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Electrical protection requirements\n<ul class=\"wp-block-list\">\n<li>Elevado&nbsp;<strong>rigidez diel\u00e9ctrica<\/strong>\n<ul class=\"wp-block-list\">\n<li>Withstands elevated&nbsp;<strong>tens\u00e3o de rutura<\/strong><\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Baixa&nbsp;<strong>electrical conductivity<\/strong>\n<ul class=\"wp-block-list\">\n<li>Minimizes&nbsp;<strong>corrente de fuga<\/strong><\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Forte&nbsp;<strong>isolation<\/strong>\n<ul class=\"wp-block-list\">\n<li>Prevents&nbsp;<strong>short circuit<\/strong>&nbsp;between adjacent traces<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Application hotspots\n<ul class=\"wp-block-list\">\n<li>GPU memory stacks<\/li>\n\n\n\n<li>Voltage regulation modules<\/li>\n\n\n\n<li>High-speed interconnect zones<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">For thermal interface materials for AI servers, insulation must remain stable under heat and pressure. If dielectric performance drops at 120\u00b0C, risk climbs fast. That\u2019s why advanced AI server TIM formulations combine ceramic fillers with stable matrices to maintain both heat flow and electrical safety.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"outgassing-impact-on-reliability-and-lifetime\">Outgassing Impact on Reliability and Lifetime<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Outgassing sounds minor. It isn\u2019t.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In sealed AI racks and immersion setups,&nbsp;<strong>desgaseifica\u00e7\u00e3o<\/strong>&nbsp;releases&nbsp;<strong>volatile compounds<\/strong>. Those vapors can cause:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Optics&nbsp;<strong>contamination<\/strong><\/li>\n\n\n\n<li>Contact corrosion<\/li>\n\n\n\n<li>Sensor drift<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Over time, that leads to&nbsp;<strong>degradation<\/strong>&nbsp;em&nbsp;<strong>performance stability<\/strong>. Reliability dips. Maintenance spikes.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Key risk zones include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High-temperature GPU arrays<\/li>\n\n\n\n<li><strong>Vacuum environments<\/strong>&nbsp;in specialized computing<\/li>\n\n\n\n<li>Long-cycle training clusters<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">For thermal interface materials for AI servers, low-outgassing chemistry supports long&nbsp;<strong>lifetime<\/strong>&nbsp;targets. Sheen materials designs formulations tested under extended thermal aging to reduce residue buildup and protect AI infrastructure from slow, sneaky failures.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In high-density compute, cooling isn\u2019t just about watts\u2014it\u2019s about keeping systems clean, stable, and online.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"struggling-with-hotspots-use-phase-change-pads\">Struggling with Hotspots? Use Phase-Change Pads<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">AI racks are running hotter than ever, and&nbsp;<strong>thermal interface materials for AI servers<\/strong>&nbsp;are under real pressure. When chips spike, cooling can\u2019t lag. From thermal interface pads to advanced phase materials, smart choices keep heat in check. That\u2019s where&nbsp;Sheen materials&nbsp;bring practical, production-ready answers.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"rapid-phase-change-to-maximize-heat-flux\">Rapid Phase Change to Maximize Heat Flux<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">When workloads surge in AI nodes,&nbsp;<strong>Rapid<\/strong>&nbsp;softening at activation temperature changes the game. In high-density&nbsp;<strong>AI servers<\/strong>,&nbsp;<strong>Mudan\u00e7a de fase<\/strong>&nbsp;behavior improves surface contact and boosts&nbsp;<strong>Heat Flux<\/strong>&nbsp;fast.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Core performance drivers\n<ul class=\"wp-block-list\">\n<li><strong>Material Properties<\/strong>\n<ul class=\"wp-block-list\">\n<li>Low melting threshold tuned for GPU hot spots<\/li>\n\n\n\n<li>High filler loading for stable&nbsp;<strong>Heat Transfer<\/strong><\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Comportamento da interface\n<ul class=\"wp-block-list\">\n<li>Micro-gap filling during softening<\/li>\n\n\n\n<li>Reduced voids under clamping pressure<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Thermal path optimization\n<ul class=\"wp-block-list\">\n<li>Die \u2192 phase pad \u2192 heat sink\n<ul class=\"wp-block-list\">\n<li>Increased wetting angle control<\/li>\n\n\n\n<li>Lower contact impedance<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Sustentado&nbsp;<strong>Thermal Performance<\/strong>\n<ul class=\"wp-block-list\">\n<li>Stable conductivity during load cycling<\/li>\n\n\n\n<li>Consistente&nbsp;<strong>Cooling Efficiency<\/strong><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">In real deployments of&nbsp;thermal interface materials for AI<strong> servers<\/strong>, fast transition reduces thermal throttling and keeps accelerators at the target frequency.&nbsp;<strong>Sheen materials<\/strong>&nbsp;engineers these pads to activate precisely within server-grade temperature windows, supporting both air and liquid-cooled systems.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"optimal-pad-thickness-on-copper-and-aluminum-substrates\">Optimal Pad Thickness on Copper and Aluminum Substrates<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Getting&nbsp;<strong>Optimal Thickness<\/strong>&nbsp;right isn\u2019t guesswork; it balances compression, surface flatness, and long-term&nbsp;<strong>Resist\u00eancia t\u00e9rmica<\/strong>&nbsp;em&nbsp;<strong>thermal interface materials for AI servers<\/strong>.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Selection logic<\/strong><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Substrate review\n<ul class=\"wp-block-list\">\n<li><strong>Copper Substrate<\/strong>\n<ul class=\"wp-block-list\">\n<li>Higher flatness, tighter torque control<\/li>\n\n\n\n<li>Lower baseline spreading resistance<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Aluminum Substrate<\/strong>\n<ul class=\"wp-block-list\">\n<li>Greater surface variation<\/li>\n\n\n\n<li>Needs stronger gap compensation<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Interface control\n<ul class=\"wp-block-list\">\n<li><strong>Interface Gap<\/strong>&nbsp;measurement (\u00b5m scale)<\/li>\n\n\n\n<li>Pad compression ratio<\/li>\n\n\n\n<li><strong>Substrate Compatibility<\/strong>&nbsp;with filler chemistry<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Reference Thickness vs Performance<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-table is-style-stripes\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-center\" data-align=\"center\">Pad Thickness (mm)<\/th><th class=\"has-text-align-center\" data-align=\"center\">Substrate Type<\/th><th class=\"has-text-align-center\" data-align=\"center\">Typical Thermal Resistance (\u00b0C\u00b7cm\u00b2\/W)<\/th><\/tr><\/thead><tbody><tr><td class=\"has-text-align-center\" data-align=\"center\">0.2<\/td><td class=\"has-text-align-center\" data-align=\"center\">Copper<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.08<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">0.3<\/td><td class=\"has-text-align-center\" data-align=\"center\">Copper<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.10<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">0.5<\/td><td class=\"has-text-align-center\" data-align=\"center\">Alum\u00ednio<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.14<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">0.8<\/td><td class=\"has-text-align-center\" data-align=\"center\">Alum\u00ednio<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.18<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">1.0<\/td><td class=\"has-text-align-center\" data-align=\"center\">Alum\u00ednio<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.22<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Too thin? Risk dry spots.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Too thick? Added resistance.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Para&nbsp;<strong>thermal interface materials for AI servers<\/strong>, tuning pad thickness per board stack-up is key.&nbsp;<strong>Sheen materials<\/strong>&nbsp;offers graded&nbsp;<strong>Pad Material<\/strong>&nbsp;options that match both copper cold plates and aluminum spreaders without pushing assembly stress limits.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"automated-application-and-reworkability-benefits\">Automated Application and Reworkability Benefits<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">In high-volume AI manufacturing, speed and control matter.&nbsp;<strong>Automated Application<\/strong>&nbsp;of phase pads simplifies the&nbsp;<strong>Manufacturing Process<\/strong>&nbsp;while boosting&nbsp;<strong>Reliability<\/strong>.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Production integration\n<ul class=\"wp-block-list\">\n<li>Pick-and-place compatibility\n<ul class=\"wp-block-list\">\n<li>Pre-cut geometry<\/li>\n\n\n\n<li>Carrier film alignment<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Inline inspection\n<ul class=\"wp-block-list\">\n<li>Visual placement checks<\/li>\n\n\n\n<li>Thickness validation<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Assembly impact\n<ul class=\"wp-block-list\">\n<li>Cleaner than grease\n<ul class=\"wp-block-list\">\n<li>No pump-out<\/li>\n\n\n\n<li>No bleed contamination<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Stable clamping during rack vibration<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Service life and&nbsp;<strong>Reworkability<\/strong>\n<ul class=\"wp-block-list\">\n<li>Easy heat-assisted removal<\/li>\n\n\n\n<li>Minimal residue during&nbsp;<strong>Maintenance<\/strong><\/li>\n\n\n\n<li>Lower scrap rate \u2192 better&nbsp;<strong>Cost Efficiency<\/strong><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">For data centers scaling fast,&nbsp;<strong>thermal interface materials for AI servers<\/strong>&nbsp;must support automation, uptime, and field service. That\u2019s why many integrators turn to&nbsp;<strong>Sheen materials<\/strong>&nbsp;for phase solutions that fit smoothly into the&nbsp;<strong>Production Line<\/strong>&nbsp;and still handle the brutal thermal loads of modern AI servers.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"faqs-about-thermal-interface-materials-for-ai-servers\">FAQs about Thermal Interface Materials for AI Servers<\/h2>\n\n\n<div id=\"rank-math-faq\" class=\"rank-math-block\">\n<div class=\"rank-math-list\">\n<div id=\"faq-question-1777038549459\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>Why do AI accelerators in server racks overheat so quickly?<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>AI accelerators, GPUs, and CPUs run at extreme\u00a0<strong>power dissipation<\/strong>, pushing intense\u00a0<strong>heat flux<\/strong>\u00a0through tiny silicon areas. In tightly packed\u00a0<strong>server racks<\/strong>, even advanced\u00a0<strong>air cooling<\/strong>\u00a0ou\u00a0<strong>vapor chambers<\/strong>\u00a0struggle when the interface to\u00a0<strong>heat spreaders<\/strong>\u00a0is imperfect.<\/p>\n<p>The real tension sits at the contact surface:<\/p>\n<p>1. Microscopic gaps between\u00a0<strong>silicon dies<\/strong>\u00a0e\u00a0<strong>copper or nickel-plated heat sinks<\/strong>\u00a0trap air, raising\u00a0<strong>resist\u00eancia t\u00e9rmica<\/strong>.<br \/>2. Poorly controlled\u00a0<strong>espessura da linha de liga\u00e7\u00e3o<\/strong>\u00a0in thermal grease or thermal pads increases\u00a0<strong>temperatura da jun\u00e7\u00e3o<\/strong>.<br \/>3. Continuous 24\/7 workloads accelerate thermal cycling, cutting\u00a0<strong>fiabilidade<\/strong>\u00a0e\u00a0<strong>lifetime<\/strong>.<\/p>\n<p>A few microns of mismatch can mean throttling, crashes, or early hardware replacement.<\/p>\n\n<\/div>\n<\/div>\n<div id=\"faq-question-1777038612782\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>Which thermal interface materials for AI servers handle extreme loads best?<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>Under heavy GPU clusters and liquid-cooled nodes, material choice becomes strategic rather than routine.<\/p>\n<p><strong>High\u2011conductivity class (maximum heat transfer):<\/strong><br \/>1. <strong>Liquid metal<\/strong>\u00a0with metallic fillers \u2014 exceptional\u00a0<strong>condutividade t\u00e9rmica<\/strong>, ideal for copper cold plates; demands careful surface preparation and electrical isolation.<br \/>2. Advanced\u00a0<strong>thermal paste \/ thermal grease<\/strong>\u00a0with ceramic fillers such as\u00a0<strong>nitreto de boro<\/strong>\u00a0ou\u00a0<strong>aluminum oxide<\/strong>\u00a0\u2014 balanced viscosity for automated dispensing.<\/p>\n<p><strong>Adaptive contact class (gap control &amp; stability):<\/strong><br \/>1. <strong>Phase change materials<\/strong>\u00a0\u2014 soften at operating temperature, lowering contact resistance.<br \/>2. <strong>Thermal gap fillers<\/strong>\u00a0e\u00a0<strong>almofadas t\u00e9rmicas<\/strong>\u00a0\u2014 controlled\u00a0<strong>compressibilidade<\/strong>\u00a0for uneven substrates or memory modules.<\/p>\n<p>Selection often weighs:<br \/>1. Target junction temperature.<br \/>2. Required dielectric strength near dense circuits.<br \/>3. Compatibility with liquid cooling or immersion cooling.<\/p>\n<p>The wrong pick shows up quickly as hotspot alarms across GPUs.<\/p>\n\n<\/div>\n<\/div>\n<div id=\"faq-question-1777038745562\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>How do bond line control and material properties affect long-term reliability?<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>A stable interface is less about thickness and more about control. When\u00a0<strong>espessura da linha de liga\u00e7\u00e3o<\/strong>\u00a0is uniform and matched to the surface roughness of\u00a0<strong>aluminum, copper, or ceramics<\/strong>, heat flows evenly from die to sink.<\/p>\n<p>Key pressure points in production:<br \/>1. <strong>Viscosidade<\/strong>\u00a0tuned for clean dispensing or screen printing during assembly.<br \/>2. Low\u00a0<strong>desgaseifica\u00e7\u00e3o<\/strong>\u00a0to protect sealed liquid cooling or immersion systems.<br \/>3. Strong\u00a0<strong>isolamento el\u00e9trico<\/strong>\u00a0and dielectric strength near organic substrates and memory traces.<br \/>4. Resistance to pump\u2011out during thermal cycling.<\/p>\n<p>When these factors align,\u00a0<strong>thermal resistance drops<\/strong>, junction temperature steadies, and the server keeps training models day and night without silent degradation.<\/p>\n\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>","protected":false},"excerpt":{"rendered":"<p>When AI runs hot, only the bold invest in the best\u2014thermal interface materials for ai servers that keep profits cool and silicon safe.<\/p>","protected":false},"author":1,"featured_media":1897,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_gspb_post_css":"","footnotes":""},"categories":[1],"tags":[51],"class_list":["post-2974","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-buyers-guides","tag-thermal-interface-materials-for-ai-servers"],"blocksy_meta":{"styles_descriptor":{"styles":{"desktop":"","tablet":"","mobile":""},"google_fonts":[],"version":8}},"_links":{"self":[{"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/posts\/2974","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/comments?post=2974"}],"version-history":[{"count":3,"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/posts\/2974\/revisions"}],"predecessor-version":[{"id":2977,"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/posts\/2974\/revisions\/2977"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/media\/1897"}],"wp:attachment":[{"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/media?parent=2974"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/categories?post=2974"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/pt\/wp-json\/wp\/v2\/tags?post=2974"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}