---
title: "SE80 Thermal Gel 8.0 W/mK"
id: "2633"
type: "product"
slug: "se80-thermal-gel-8-w-mk"
published_at: "2026-03-25T03:36:36+00:00"
modified_at: "2026-03-28T08:02:31+00:00"
url: "https://www.sheenmaterials.com/pt/se80-thermal-gel-8-w-mk/"
markdown_url: "https://www.sheenmaterials.com/pt/se80-thermal-gel-8-w-mk.md"
excerpt: "SE80 is a flexible silicone-based thermally conductive gap filler designed for large gap tolerance applications between heat-generating electronic components and heat sinks or housings. With thermal conductivity of 8.0 W/m·K, low thermal impedance, and excellent extrusion properties, it helps create..."
taxonomy_product_cat:
  - "Thermal interface materials"
  - "Paste/Liquid"
  - "Single-Component Thermal Conductive Gel"
---

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# Gel térmico SE80 8,0 W/mK

SE80 is a flexible silicone-based thermally conductive gap filler designed for large gap tolerance applications between heat-generating electronic components and heat sinks or housings. With thermal conductivity of 8.0 W/m·K, low thermal impedance, and excellent extrusion properties, it helps create close contact between surfaces, reduce interfacial thermal resistance, and improve heat dissipation efficiency.

As part of SHEEN’s SE Series 1K Thermal Gel family, SE80 combines softness, compressibility, stable dispensing performance, and reliable electrical insulation. It is especially suitable for projects that require stronger heat transfer performance, low assembly stress, and flexible gap filling in complex electronic structures.

### Principais benefícios

- Thermal conductivity: 8.0 W/m·K
- Baixa impedância térmica para uma transferência de calor eficiente
- Boa flexibilidade e elevada taxa de enchimento para projectos com grande tolerância de folga
- Excellent extrusion properties and stable dispensing performance
- Adequado para aplicação manual ou distribuição automática
- Desempenho fiável do isolamento elétrico
- Excelente resistência à chama, UL94 V-0
- Disponível em embalagens de 30cc / 300cc
- Em conformidade com os requisitos RoHS, sem halogéneos e REACH

Categorias: [Materiais de interface térmica](https://www.sheenmaterials.com/pt/tim/)
, [Pasta/Líquido](https://www.sheenmaterials.com/pt/paste-liquid/)
, [Gel condutor térmico monocomponente](https://www.sheenmaterials.com/pt/single-component-thermal-conductive-gel/)

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- [Descrição](#tab-description)

## Informações técnicas

Review the key specifications, recommended applications, installation notes, and downloadable files for SE80.

[Especificações](#sp-specs)
  
[Aplicações](#sp-apps)
  
[Notas de instalação](#sp-install)
  
[Transferências e FAQ](#sp-faq)

### Especificações

| Imóveis | SE80 | Método de ensaio |
| --- | --- | --- |
| Cor | Cinzento | Visual |
| Condutividade térmica | 8.0 W/m·K | ASTM D5470 |
| Impedância térmica (@30 psi) | 0,05 ℃-in²/W | ASTM D5470 |
| Caudal (@30cc, 90 psi) | 30 ± 5 g/min | - |
| Isolamento elétrico | Desempenho fiável do isolamento | - |
| Inflamabilidade | UL94 V-0 | UL94 |
| Resistência dieléctrica | Até 8 kV/mm | - |
| RoHS | Conformidade | - |
| Sem halogéneo | Conformidade | - |
| REACH | Conformidade | - |
| Embalagem | 30cc / 300cc | - |
| Prazo de validade | 12 meses | - |

### Aplicações

#### Aplicações recomendadas

- CPUs e GPUs
- Unidades de alimentação eléctrica (PSUs)
- Módulos LED
- Unidades de controlo do motor (ECU)
- Consolas de jogos e computadores portáteis
- Complex gap thickness electronic assemblies

#### Não recomendado para

- Aplicações de linhas de colagem ultra-finas que requerem uma capacidade de espalhamento semelhante à da gordura
- Interfaces de formato de folha rígida em que é preferível um material de almofada
- Projectos que requerem adesão estrutural em vez de preenchimento flexível de espaços

### Notas de instalação

- SE80 is suitable for large gap tolerance applications that require soft and compressible thermal filling.
- Pode ser controlado com precisão em termos de espessura e forma utilizando equipamento de distribuição automatizado.
- Utilize uma dosagem controlada para garantir um contacto estanque entre os componentes e os dissipadores de calor.
- The material provides low assembly stress and is suitable for delicate electronic components.
- Armazenar numa área bem ventilada, fresca e seca, longe de chamas abertas.
- Este produto não é tóxico e deve ser armazenado e transportado como um material não perigoso.
- Prazo de validade: 12 meses.

### Transferências e FAQ

[↓ Descarregar Ficha de dados técnicos](https://www.sheenmaterials.com/wp-content/uploads/2026/03/SE80-Thermal-Gel.pdf)

**Q1. What is the main function of SE80?**SE80 is designed to fill gaps between heat-generating components and heat sinks, reducing thermal impedance while maintaining reliable contact and heat dissipation.

**Q2. What is the difference between SE80 and lower-grade thermal gels?**SE80 provides a higher thermal conductivity grade at 8.0 W/m·K while keeping the SE series benefits of softness, low assembly stress, and stable dispensing behavior.

**Q3. Is SE80 suitable for manual application or only automated dispensing?**SE80 supports precise thickness and shape control via automated dispensing, and can also be used in processes that require controlled manual application.

**Q4. What applications is SE80 suitable for?**SE80 is suitable for CPUs, GPUs, PSUs, LED modules, ECUs, gaming consoles, laptops, and other assemblies with complex gap thicknesses.

**Q5. What packaging options are available for SE80?**SE80 is available in 30cc and 300cc packaging, with a shelf life of 12 months under recommended storage conditions.

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