---
title: "Carbon Fiber Thermal Pad CSF30-HC"
id: "3565"
type: "product"
slug: "carbon-fiber-thermal-pad-csf30-hc"
published_at: "2026-06-25T09:16:57+00:00"
modified_at: "2026-10-12T03:41:04+00:00"
url: "https://www.sheenmaterials.com/pt/carbon-fiber-thermal-pad-csf30-hc/"
markdown_url: "https://www.sheenmaterials.com/pt/carbon-fiber-thermal-pad-csf30-hc.md"
excerpt: "Key Benefits High thermal conductivity for fast heat transfer away from chip-level hot spots Low thermal resistance and low loss for efficient heat transfer across the interface High compliance and high compressibility for soft, conformable fitting Flexible fit and easy..."
taxonomy_product_brand:
  - "Sheen"
taxonomy_product_cat:
  - "Carbon Fiber Thermal Pads"
---

[🔍](#)

# Carbon Fiber Thermal Pad CSF30-HC

### Principais benefícios

- High thermal conductivity for fast heat transfer away from chip-level hot spots
- Low thermal resistance and low loss for efficient heat transfer across the interface
- High compliance and high compressibility for soft, conformable fitting
- Flexible fit and easy assembly for complex mating surfaces
- Reduced contact thermal resistance for improved thermal path efficiency
- Helps reduce component damage risk during installation

REF: CSF30-HCCategoria: [Almofadas térmicas de fibra de carbono](https://www.sheenmaterials.com/pt/carbon-fiber-thermal-pads/)
Marca: [Sheen](https://www.sheenmaterials.com/pt/marca/sheen/)

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- [Descrição](#tab-description)

## Carbon Fiber Thermal Pad CSF30-HC

30 W/m·K High-Compliance Carbon Fiber Thermal Pad for Low Thermal Resistance and Efficient Through-Plane Heat Transfer

CSF30-HC is a high-compliance carbon fiber thermal pad engineered with advanced vertically aligned carbon fiber technology. It delivers efficient axial heat transfer between heat-generating components and heat sinks. With thermal conductivity up to 30.0 W/m·K, low interface thermal resistance, and stable thermal performance, it helps high-power devices move heat quickly and reliably.

CSF30-HC  
30 W/m·K  
Thermal Resistance 0.1 °C·in²/W @20 psi  
High-Compliance Carbon Fiber Pad  
0.3–12.0 mm  
UL94 V-0

Series Snapshot

Modelo  
CSF30-HC

Cor  
Black

Thickness Range  
0.3–12.0 mm

Densidade  
2.6 g/cm³

### Informações técnicas

Review the product positioning, core parameters, compression behavior, and application fit for CSF30-HC carbon fiber thermal pad.

[Q1 Product Positioning](#csf30hc-q1)
  
[Q2 Core Data](#csf30hc-q2)
  
[Q3 Compression & Heat Transfer](#csf30hc-q3)
  
[Q4 Handling & Storage](#csf30hc-q4)
  
[Q5 Applications](#csf30hc-q5)
  
[Transferências e FAQ](#csf30hc-downloads)

Q1### What is CSF30-HC designed for?

CSF30-HC is designed for thermal-interface applications that require efficient axial heat transfer, low interface thermal resistance, and soft high-compliance fitting. Its vertically aligned carbon fiber technology is intended to provide a stable thermal path between heat-generating devices and heat sinks.

**High-Compliance Carbon Fiber Direction**Built with advanced vertically aligned carbon fiber technology for efficient axial heat transfer.

**Low Thermal Resistance Interface**Designed to support fast and efficient heat transfer across the interface.

**Soft and Conformable Fit**High compliance makes the material easy to fit across uneven or complex mating surfaces.

**Assembly-Friendly Protection**The cushioning structure helps lower installation risk and reduce component damage during assembly.

Q2### What are the core technical data for CSF30-HC?

The table below reflects the currently published updated datasheet values for the CSF30-HC carbon fiber thermal pad.

| Imóveis | Método de ensaio | CSF30-HC |
| --- | --- | --- |
| Condutividade térmica | ASTM D5470 | 30 W/m·K |
| Thermal Resistance (@20 psi, 1 mm) | ASTM D5470 | 0.1 °C·in²/W |
| Temperatura de aplicação | / | -40 to 150°C |
| Compression Stress (@1 mm, 30%) | ASTM D3574 | 30 psi |
| Hardness (Shore 00) | ASTM D2240 | 50–60 |
| Resistência à tração | ASTM D412 | 30 psi |
| Cor | Visual | Black |
| Available Thickness | ASTM D374 | 0.3–12.0 mm |
| Densidade | ASTM D792 | 2.6 g/cm³ |
| Inflamabilidade | UL94 | V-0 |
| Compliance | / | RoHS 2.0 / Halogen / REACH |

Q3### What compression and heat-transfer strengths does CSF30-HC emphasize?

CSF30-HC is positioned as a high-compliance, soft, cushioning, and compressible thermal pad that lowers contact thermal resistance while supporting efficient axial heat transfer.

**Fast Efficient Heat Transfer**30 W/m·K conductivity helps high-power devices move heat quickly and reliably.

**High Compliance and Cushioning**The soft, cushioning, and compressible structure adapts to complex mating surfaces more effectively.

**Lower Contact Thermal Resistance**Low interface resistance supports more efficient thermal transfer across the contact area.

**Installation Protection**The flexible fit helps prevent component damage during installation while improving contact efficiency.

Q4### How should CSF30-HC be stored and supplied?

The updated datasheet provides simple storage, packaging, and shelf-life guidance for customer projects and sample use.

**Embalagem**Customized packaging is available upon request.

**Storage Conditions**Store in a cool place.  
Storage temperature: ≤30°C  
Storage humidity: ≤75%

**Prazo de validade**12 meses

**Production Note**Users should verify material suitability and compatibility in their own production process before use.

Q5### Which applications fit CSF30-HC best?

The updated datasheet focuses this product on electronics and test applications that need efficient thermal transfer with soft contact and easy installation.

#### Chip Testing

Suitable for chip-testing structures that need efficient heat transfer and stable interface contact.

#### Capacitors

Applicable to capacitor thermal-management structures requiring low interface resistance and conformable fitting.

#### Optical Modules

A good fit for optical-module assemblies where soft contact and reliable heat dissipation are both important.

#### 5G Remote Radio Units (RRU) / Thermal Module Testing

Suitable for communication hardware and thermal-module testing structures with demanding thermal-management requirements.

### Transferências e FAQ

Technical Resources

[Download CSF30-HC Datasheet](https://www.sheenmaterials.com/wp-content/uploads/2026/09/CSF30-HC-DataSheet-EN.pdf)
  
[View Datasheet Center](https://www.sheenmaterials.com/pt/resource/datasheet-download/)
  
[Contact Sales for Sample Support](/cdn-cgi/l/email-protection#0d7e6c61687e3e4d78207e65686863236e6260)

Frequently Asked Questions

 Q1. What is the main reason to choose CSF30-HC?The main reason is to combine 30 W/m·K thermal conductivity with low interface thermal resistance, high compliance, soft conformable contact, and easy assembly in one carbon fiber thermal pad.

  Q2. Is CSF30-HC suitable only for chip testing?No. The updated datasheet also lists capacitors, optical modules, 5G Remote Radio Units, and thermal module testing among the typical applications.

  Q3. What thermal-resistance level is listed?The current datasheet lists thermal resistance of 0.1 °C·in²/W at 20 psi for 1 mm thickness.

  Q4. What storage conditions are recommended?Store the product in a cool place with storage temperature ≤30°C and storage humidity ≤75%.

  Q5. What is the shelf life of CSF30-HC?The current datasheet lists a shelf life of 12 months.

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