---
title: "Aerospace"
id: "102"
type: "page"
slug: "aerospace"
published_at: "2026-02-06T02:19:25+00:00"
modified_at: "2026-08-14T01:06:49+00:00"
url: "https://www.sheenmaterials.com/ko/applications/aerospace/"
markdown_url: "https://www.sheenmaterials.com/ko/applications/aerospace.md"
excerpt: "Aerospace In aerospace electronics, thermal and functional materials are critical for maintaining stable performance under extreme conditions such as wide temperature ranges, vibration, shock, and low-pressure environments. Sheen provides thermal pads, gap fillers, gels/greases, phase change materials, silicone foams, and..."
---

# 항공우주

In aerospace electronics, thermal and functional materials are critical for maintaining stable performance under extreme conditions such as wide temperature ranges, vibration, shock, and low-pressure environments. Sheen provides thermal pads, gap fillers, gels/greases, phase change materials, silicone foams, and conductive potting solutions to build low-resistance heat paths from high-power components to heat spreaders, cold plates, or housings.

For avionics, motor controllers, power conversion units, and communication modules, these solutions help reduce hotspots, improve long-term reliability, and support mission-critical durability—while enabling custom thickness, die-cut parts, and engineering support from prototype validation to mass production.

[지원 받기](https://www.sheenmaterials.com/ko/support/)

[TDS 다운로드](https://www.sheenmaterials.com/ko/resource/datasheet-download/)

개요

## Aerospace (TIMs) Solutions

Aerospace avionics and power electronics must manage heat under wide temperature swings, vibration, and long mission lifetimes. Hotspots in processors, power modules, and RF components can reduce stability and reliability.

Sheen thermal interface materials (pads, gap fillers, gels/greases, PCM) create low-resistance heat paths to heat spreaders, cold plates, or housings—supporting stable performance through thermal cycling.

혜택

## Aerospace-Grade Thermal Materials, Built for Mission Reliability

**Control Hotspots, Stabilize Performance**

Efficient heat transfer from power devices and control electronics to housings/heatsinks—reducing hotspots and thermal stress.

**Vibration-Ready Fit, Stable Interfaces**

Conformable gap fillers maintain contact under vibration, shock, and tolerance stack-ups for consistent thermal performance.

**Clean Operation, Long-Life Durability**

Low-bleed/low-outgassing options help reduce contamination risk and support reliability through thermal cycling.

**Custom Cutting + Engineering Support**

Custom thickness/hardness/size, die-cut parts, and fast sampling—accelerating qualification and production ramp.

## 관련 제품

이 애플리케이션에서 일반적으로 사용되는 제품 카테고리를 살펴보세요. 이러한 카드를 자체 열 재료, TIM, 폼, 테이프 또는 납땜 관련 제품으로 대체할 수 있습니다.

![Image](https://www.sheenmaterials.com/wp-content/uploads/2026/02/Carbon-Fiber-Thermal-Pad-Series-1.webp)

### 열 패드

전자제품의 틈새를 메우고 안정적인 열 전달을 위한 부드럽고 밀착력이 뛰어난 열 패드.

[찾아보기 ›](#)

### 열 그리스

CPU, 전원 모듈 및 산업용 어셈블리를 위한 고효율 열 그리스 솔루션입니다.

[찾아보기 ›](#)

### 실리콘 폼

밀봉, 완충, 단열 및 방화벽 용도의 폼 소재입니다.

[찾아보기 ›](#)

### 감열 테이프

빠른 조립과 일관된 열 인터페이스 접착을 위한 PSA 라미네이트 감열 테이프.

[찾아보기 ›](#)

### 흑연 시트

소형 디바이스의 열 확산을 위한 평면 내 전도성이 높은 흑연 소재.

[찾아보기 ›](#)

### EMI 흡수기

전자기 간섭을 줄이고 전자기기의 신호 무결성을 개선하는 EMI 흡수 소재.

[찾아보기 ›](#)

←→

## 관련 애플리케이션

## Power Electronics & Motor Drives (Aerospace)

Control hotspots in motor drives and power stages—built for vibration and shock.

[탐색](#)

## RF/Communication Payloads

Manage heat in RF front-ends and transceivers—reduce hotspots and improve reliability.

[탐색](https://www.sheenmaterials.com/ko/applications/power-supply-energy-storage-and-auto/)

## Avionics & Flight Computers

Thermal interfaces for processors and power rails—stable performance through thermal cycling.

[탐색](#)

## Related Markets for Aerospace Electronics

Sheen thermal, sealing, and EMI materials support aerospace avionics and payloads—managing hotspots, vibration, and thermal cycling for mission-critical reliability.

4##### RF/마이크로파

12##### 고성능 컴퓨팅

3##### 대학 및 연구

13##### 화합물 반도체