---
title: "Graphene Thermal Pad GSF90-03"
id: "552"
type: "product"
slug: "graphene-thermal-pad-gsf90-03"
published_at: "2026-02-10T16:11:01+00:00"
modified_at: "2026-06-25T08:41:08+00:00"
url: "https://www.sheenmaterials.com/ja/graphene-thermal-pad-gsf90-03/"
markdown_url: "https://www.sheenmaterials.com/ja/graphene-thermal-pad-gsf90-03.md"
excerpt: "Key Benefits Ultra-high thermal conductivity for rapid heat removal from chip-level hot spots Very low interface thermal resistance for faster and more efficient heat transfer High rebound and soft conformability for improved surface contact and gap filling Stable performance in..."
taxonomy_product_brand:
  - "Sheen"
taxonomy_product_cat:
  - "Graphene Thermal Pads"
taxonomy_product_tag:
  - "Graphene Thermal Pads"
---

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# Graphene Thermal Pad GSF90-03

### 主なメリット

- Ultra-high thermal conductivity for rapid heat removal from chip-level hot spots
- Very low interface thermal resistance for faster and more efficient heat transfer
- High rebound and soft conformability for improved surface contact and gap filling
- Stable performance in harsh environments with low bleeding and aging resistance
- No pump-out during use for better long-term interface reliability
- Suitable for compact, high-heat-flux systems with demanding thermal loads

商品コード: GSF90-03カテゴリー: [グラフェン・サーマルパッド](https://www.sheenmaterials.com/ja/graphene-thermal-pads/)
タグ: [グラフェン・サーマルパッド](https://www.sheenmaterials.com/ja/product-tag/graphene-thermal-pads/)
ブランド： [シーン](https://www.sheenmaterials.com/ja/%E3%83%96%E3%83%A9%E3%83%B3%E3%83%89/sheen/)

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- [説明](#tab-description)

## Graphene Thermal Pad GSF90-03

90 W/m·K Graphene Thermal Pad for Ultra-High Heat Flux, Low Thermal Resistance, and Stable Interface Contact

GSF90-03 is a high-conductivity, low-thermal-resistance graphene thermal pad designed for high-power thermal-management applications. With graphene as the primary thermal filler, vertically oriented alignment and laminated composite processing form efficient through-plane heat-transfer channels, helping remove heat rapidly from compact, high-heat-flux systems.

GSF90-03  
0.3 mm Main Model  
Thermal Conductivity 90 W/m·K  
Thermal Resistance ≤0.10 °C·cm²/W @40 psi  
Rebound Rate ≥90%  
UL94 V-0

Series Snapshot

モデル  
GSF90-03

カラー  
Black

Thickness Range  
0.3–2.0 mm

密度  
0.3–0.7 g/cm³

### 技術情報

Review the product positioning, core parameters, interface behavior, long-term stability, and application fit for GSF90-03 graphene thermal pad.

[Q1 Product Positioning](#gsf90-q1)
  
[Q2 Core Data](#gsf90-q2)
  
[Q3 Contact & Reliability](#gsf90-q3)
  
[Q4 Handling & Storage](#gsf90-q4)
  
[Q5 Applications](#gsf90-q5)
  
[ダウンロードとFAQ](#gsf90-downloads)

Q1### What is GSF90-03 designed for?

GSF90-03 is designed for high-power thermal-management applications where very high heat flux, compact structure, and low interface resistance all need to be addressed at the same time. Its vertically oriented graphene alignment is intended to create efficient through-plane heat-transfer channels.

**Ultra-High Heat Flux Direction**Built for systems that generate concentrated chip-level hot spots and need rapid heat evacuation.

**Through-Plane Heat Path**The product uses vertically oriented alignment and laminated composite processing to strengthen heat flow in the thickness direction.

**Soft Conformable Contact**Softness and compressibility help the pad adapt to complex mounting surfaces and improve real contact area.

**長期的な安定性**The datasheet emphasizes dimensional stability, low bleeding, and no pump-out during use.

Q2### What are the core technical data for GSF90-03?

The table below reflects the currently published updated datasheet values for the GSF90-03 graphene thermal pad.

| プロパティ | 試験方法 | GSF90-03 |
| --- | --- | --- |
| 熱伝導率 | ASTM E1461 | 90 W/m·K |
| Thermal Resistance (@40 psi) | ASTM D5470 | ≤0.10 °C·cm²/W |
| 適用温度 | / | -40 to 150°C |
| Rebound Rate | / | ≥90% |
| Tensile Strength (Oriented Direction) | ASTM D412 | ≥0.05 MPa |
| カラー | ビジュアル | Black |
| 厚さ | ASTM D374 | 0.3–2.0 mm |
| 密度 | ASTM D792 | 0.3–0.7 g/cm³ |
| Oil Bleeding Rate | / | ≤3% |
| 引火性 | UL94 | V-0 |
| Compliance | / | RoHS 2.0 / Halogen-Free / REACH |

Q3### What interface-contact and reliability strengths does GSF90-03 emphasize?

The datasheet positions GSF90-03 as a low-resistance, soft, and stable interface material for harsh environments and long-term high-load operation.

**Low Interface Resistance**Extremely low interface resistance helps support fast and efficient heat transfer under compression.

**Soft and Conformable Fit**The material adapts to complex mounting surfaces and helps reduce contact thermal resistance.

**High Rebound Stability**High rebound supports more stable interface fitting and helps maintain contact under service pressure.

**Harsh-Environment Reliability**Low bleeding and aging resistance help maintain performance under long-term full-load operation and thermal cycling.

Q4### How should GSF90-03 be stored and supplied?

The current datasheet provides simple storage and packaging guidance for samples and production preparation.

**パッケージング**Customized packaging is available according to customer requirements.

**Storage Conditions**Store in a cool, dry place.  
Storage temperature: ≤30°C  
Storage humidity: ≤75% RH

**賞味期限**12 months from date of manufacture under recommended storage conditions.

**Production Note**Users should verify material suitability and process compatibility before production use.

Q5### Which applications fit GSF90-03 best?

The updated datasheet focuses this product on compact, high-heat-flux electronic systems where thermal efficiency and interface stability are both critical.

#### Artificial Intelligence Chips

Suitable for AI chip thermal interfaces that need fast heat dissipation from concentrated hot spots.

#### Intelligent Driving Chips / Communication Equipment

A good fit for compact electronics requiring stable contact and efficient heat flow under long-term load.

#### Optical Modules

Applicable to optical-module assemblies that benefit from low bleeding and stable dimensional behavior.

#### Aerial Drones / Humanoid Robots / Semiconductor Testing

Suitable for compact, high-performance electronic structures with demanding thermal-management requirements.

### ダウンロードとFAQ

Technical Resources

[Download GSF90-03 Datasheet](https://www.sheenmaterials.com/wp-content/uploads/2026/06/GSF90-03-Datasheet-EN-20260526-update.pdf)
  
[View Datasheet Center](https://www.sheenmaterials.com/ja/resource/datasheet-download/)
  
[Contact Sales for Sample Support](/cdn-cgi/l/email-protection#6310020f06105023164e100b06060d4d000c0e)

Frequently Asked Questions

 Q1. What is the main reason to choose GSF90-03?The main reason is to combine 90 W/m·K thermal conductivity with very low interface resistance and strong rebound in one soft graphene thermal pad.

  Q2. Is GSF90-03 suitable only for AI chips?No. The updated datasheet also lists intelligent driving chips, optical modules, communication equipment, aerial drones, humanoid robots, and semiconductor testing among the typical applications.

  Q3. What long-term reliability characteristics are emphasized?The datasheet emphasizes low bleeding, no pump-out, aging resistance, and stable performance under long-term full-load operation and thermal cycling.

  Q4. What storage conditions are recommended?Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75% RH.

  Q5. What is the shelf life of GSF90-03?The current datasheet lists a shelf life of 12 months under recommended storage conditions.

## 関連商品

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  - [グラフェン・サーマルパッド](https://www.sheenmaterials.com/ja/graphene-thermal-pads/)