---
title: "Aerospace"
id: "102"
type: "page"
slug: "aerospace"
published_at: "2026-02-06T02:19:25+00:00"
modified_at: "2026-08-14T01:06:49+00:00"
url: "https://www.sheenmaterials.com/ja/applications/aerospace/"
markdown_url: "https://www.sheenmaterials.com/ja/applications/aerospace.md"
excerpt: "Aerospace In aerospace electronics, thermal and functional materials are critical for maintaining stable performance under extreme conditions such as wide temperature ranges, vibration, shock, and low-pressure environments. Sheen provides thermal pads, gap fillers, gels/greases, phase change materials, silicone foams, and..."
---

# 航空宇宙

In aerospace electronics, thermal and functional materials are critical for maintaining stable performance under extreme conditions such as wide temperature ranges, vibration, shock, and low-pressure environments. Sheen provides thermal pads, gap fillers, gels/greases, phase change materials, silicone foams, and conductive potting solutions to build low-resistance heat paths from high-power components to heat spreaders, cold plates, or housings.

For avionics, motor controllers, power conversion units, and communication modules, these solutions help reduce hotspots, improve long-term reliability, and support mission-critical durability—while enabling custom thickness, die-cut parts, and engineering support from prototype validation to mass production.

[サポートを受ける](https://www.sheenmaterials.com/ja/support/)

[TDSダウンロード](https://www.sheenmaterials.com/ja/resource/datasheet-download/)

概要

## Aerospace (TIMs) Solutions

Aerospace avionics and power electronics must manage heat under wide temperature swings, vibration, and long mission lifetimes. Hotspots in processors, power modules, and RF components can reduce stability and reliability.

Sheen thermal interface materials (pads, gap fillers, gels/greases, PCM) create low-resistance heat paths to heat spreaders, cold plates, or housings—supporting stable performance through thermal cycling.

メリット

## Aerospace-Grade Thermal Materials, Built for Mission Reliability

**Control Hotspots, Stabilize Performance**

Efficient heat transfer from power devices and control electronics to housings/heatsinks—reducing hotspots and thermal stress.

**Vibration-Ready Fit, Stable Interfaces**

Conformable gap fillers maintain contact under vibration, shock, and tolerance stack-ups for consistent thermal performance.

**Clean Operation, Long-Life Durability**

Low-bleed/low-outgassing options help reduce contamination risk and support reliability through thermal cycling.

**Custom Cutting + Engineering Support**

Custom thickness/hardness/size, die-cut parts, and fast sampling—accelerating qualification and production ramp.

## 関連商品

このアプリケーションで一般的に使用される製品カテゴリを発見する。これらのカードは は、独自の熱材料、TIM、フォーム、テープ、またははんだ付け関連製品に置き換えることができます。.

![Image](https://www.sheenmaterials.com/wp-content/uploads/2026/02/Carbon-Fiber-Thermal-Pad-Series-1.webp)

### サーマルパッド

電子機器の隙間埋めと信頼性の高い熱伝導のための、ソフトでコンフォーマブルなサーマルパッド。.

[ブラウズ ›](#)

### サーマルグリース

CPU、パワーモジュール、産業用アセンブリ向けの高効率サーマルグリースソリューション。.

[ブラウズ ›](#)

### シリコーン・フォーム

シール、クッション、断熱、防火バリア用途の発泡材料。.

[ブラウズ ›](#)

### サーマル・テープ

PSAラミネートサーマルテープは、迅速な組み立てと安定した熱界面接着を実現します。.

[ブラウズ ›](#)

### グラファイトシート

小型デバイスにおける熱拡散のための高平面内導電性グラファイト材料。.

[ブラウズ ›](#)

### EMIアブソーバー

電子機器の干渉を低減し、シグナルインテグリティを改善するEMI吸収材料。.

[ブラウズ ›](#)

←→

## 関連アプリケーション

## Power Electronics & Motor Drives (Aerospace)

Control hotspots in motor drives and power stages—built for vibration and shock.

[エクスペリエンス](#)

## RF/Communication Payloads

Manage heat in RF front-ends and transceivers—reduce hotspots and improve reliability.

[エクスペリエンス](https://www.sheenmaterials.com/ja/applications/power-supply-energy-storage-and-auto/)

## Avionics & Flight Computers

Thermal interfaces for processors and power rails—stable performance through thermal cycling.

[エクスペリエンス](#)

## Related Markets for Aerospace Electronics

Sheen thermal, sealing, and EMI materials support aerospace avionics and payloads—managing hotspots, vibration, and thermal cycling for mission-critical reliability.

4##### RF/マイクロ波

12##### 高性能コンピューティング

3##### 大学と研究

13##### 化合物半導体