{"id":2654,"date":"2026-03-27T03:03:39","date_gmt":"2026-03-27T03:03:39","guid":{"rendered":"https:\/\/www.sheenmaterials.com\/"},"modified":"2026-03-28T08:01:43","modified_gmt":"2026-03-28T08:01:43","slug":"se800ab-two-component-thermal-gel-8-w-mk","status":"publish","type":"product","link":"https:\/\/www.sheenmaterials.com\/it\/se800ab-two-component-thermal-gel-8-w-mk\/","title":{"rendered":"SE800AB Gel termico bicomponente 8,0 W\/mK"},"content":{"rendered":"<section class=\"sheen-tech-section\" id=\"sheen-tech-info\">\n<div class=\"sheen-tech-header\">\n<h2>Technical Information<\/h2>\n<p class=\"sheen-tech-intro\">\n      Review the key specifications, recommended applications, installation notes, and downloadable files for SE800AB.\n    <\/p>\n<div class=\"sheen-tech-nav\">\n      <a href=\"#sp-specs\">Specifications<\/a><br \/>\n      <a href=\"#sp-apps\">Applications<\/a><br \/>\n      <a href=\"#sp-install\">Installation Notes<\/a><br \/>\n      <a href=\"#sp-faq\">Downloads &#038; FAQ<\/a>\n    <\/div>\n<\/p><\/div>\n<div class=\"sheen-tech-card\" id=\"sp-specs\">\n<h3>Specifications<\/h3>\n<table class=\"sheen-spec-table\">\n<tr>\n<th>Property<\/th>\n<th>SE800AB<\/th>\n<th>Test Method<\/th>\n<\/tr>\n<tr>\n<td>Product Type<\/td>\n<td>Two-part Thermal Gel \/ Thermal Putty<\/td>\n<td>\/<\/td>\n<\/tr>\n<tr>\n<td>Thermal Conductivity<\/td>\n<td>8.0 \u00b1 0.8 W\/m\u00b7K<\/td>\n<td>ASTM D5470<\/td>\n<\/tr>\n<tr>\n<td>Flow Rate (@50cc, 90psi)<\/td>\n<td>10 \u00b1 5 g\/min<\/td>\n<td>\/<\/td>\n<\/tr>\n<tr>\n<td>Mix Ratio<\/td>\n<td>1:1<\/td>\n<td>\/<\/td>\n<\/tr>\n<tr>\n<td>Color Before Curing<\/td>\n<td>Part A: White \/ Part B: Gray<\/td>\n<td>Visual<\/td>\n<\/tr>\n<tr>\n<td>Density<\/td>\n<td>3.2 \u00b1 0.2 g\/cc<\/td>\n<td>Helium Pycnometry<\/td>\n<\/tr>\n<tr>\n<td>Color After Curing<\/td>\n<td>Gray<\/td>\n<td>Visual<\/td>\n<\/tr>\n<tr>\n<td>Hardness After Curing<\/td>\n<td>Shore 00 45 ~ 65<\/td>\n<td>ASTM D2240<\/td>\n<\/tr>\n<tr>\n<td>Tack-Free Time (@25\u2103)<\/td>\n<td>\u2265 60 min<\/td>\n<td>\/<\/td>\n<\/tr>\n<tr>\n<td>Full Cure Time (@25\u2103)<\/td>\n<td>\u2265 2 h<\/td>\n<td>\/<\/td>\n<\/tr>\n<tr>\n<td>Full Cure Time (@100\u2103)<\/td>\n<td>\u2265 10 min<\/td>\n<td>\/<\/td>\n<\/tr>\n<tr>\n<td>Minimum Interface Thickness<\/td>\n<td>0.18 mm<\/td>\n<td>\/<\/td>\n<\/tr>\n<tr>\n<td>Operating Temperature<\/td>\n<td>-40 ~ 150\u2103<\/td>\n<td>\/<\/td>\n<\/tr>\n<tr>\n<td>Dielectric Strength (@AC)<\/td>\n<td>&gt; 6 kV\/mm<\/td>\n<td>ASTM D149<\/td>\n<\/tr>\n<tr>\n<td>Dielectric Constant (@1MHz)<\/td>\n<td>7.5<\/td>\n<td>ASTM D150<\/td>\n<\/tr>\n<tr>\n<td>Volume Resistivity<\/td>\n<td>\u2265 10<sup>12<\/sup> \u03a9\u00b7cm<\/td>\n<td>ASTM D257<\/td>\n<\/tr>\n<tr>\n<td>Coefficient of Thermal Expansion<\/td>\n<td>175 ppm\/K<\/td>\n<td>ASTM E831<\/td>\n<\/tr>\n<tr>\n<td>Flame Rating<\/td>\n<td>V-0<\/td>\n<td>UL94<\/td>\n<\/tr>\n<tr>\n<td>RoHS<\/td>\n<td>PASS<\/td>\n<td>IEC 62321<\/td>\n<\/tr>\n<tr>\n<td>Halogen<\/td>\n<td>PASS<\/td>\n<td>EN 14582<\/td>\n<\/tr>\n<tr>\n<td>REACH<\/td>\n<td>PASS<\/td>\n<td>EN 14372<\/td>\n<\/tr>\n<tr>\n<td>Shelf Life (@25\u2103)<\/td>\n<td>6 months<\/td>\n<td>\/<\/td>\n<\/tr>\n<\/table><\/div>\n<div class=\"sheen-tech-card\" id=\"sp-apps\">\n<h3>Applications<\/h3>\n<div class=\"sheen-two-col\">\n<div>\n<h4>Recommended Applications<\/h4>\n<ul>\n<li>CPUs and GPUs<\/li>\n<li>Power Supply Units (PSUs)<\/li>\n<li>LED Modules<\/li>\n<li>Engine Control Units (ECUs)<\/li>\n<li>Gaming Consoles and Laptops<\/li>\n<li>Electronic assemblies with small-gap tolerances<\/li>\n<\/ul><\/div>\n<div>\n<h4>Not Recommended For<\/h4>\n<ul>\n<li>Ultra-thin bond line interfaces that require grease-like spreadability<\/li>\n<li>Large-gap tolerance designs where 1K thermal gel is more suitable<\/li>\n<li>Applications requiring non-curing interface materials<\/li>\n<li>Structures that need sheet-format pads instead of dispensed gel<\/li>\n<\/ul><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<div class=\"sheen-tech-card\" id=\"sp-install\">\n<h3>Installation Notes<\/h3>\n<div class=\"sheen-note-box\">\n<ul>\n<li>SE800AB is suitable for small-gap tolerance thermal interface applications that require controlled curing and elastomeric support after mixing.<\/li>\n<li>Part A and Part B should be mixed at a 1:1 ratio before application.<\/li>\n<li>The material can be precisely controlled for thickness and shape using automated dispensing equipment.<\/li>\n<li>After curing, it forms a soft elastomer that maintains interface thickness and provides reliable shock absorption.<\/li>\n<li>Store in a well-ventilated, cool, and dry area away from open flames.<\/li>\n<li>This product is non-toxic and should be stored and transported as a non-hazardous material.<\/li>\n<li>Available packaging includes 50cc and 400cc cartridges.<\/li>\n<li>Shelf life: 6 months.<\/li>\n<\/ul><\/div>\n<\/p><\/div>\n<div class=\"sheen-tech-card\" id=\"sp-faq\">\n<h3>Downloads &#038; FAQ<\/h3>\n<div class=\"sheen-download-wrap\">\n      <a class=\"sheen-download-btn\" href=\"[DATASHEET LINK]\" target=\"_blank\" rel=\"noopener\"><br \/>\n        <span class=\"sheen-download-icon\">\u2193<\/span><br \/>\n        <span class=\"sheen-download-text\"><br \/>\n          <span class=\"sheen-download-label\">Download<\/span><br \/>\n          <span class=\"sheen-download-title\">Technical Datasheet<\/span><br \/>\n        <\/span><br \/>\n      <\/a>\n    <\/div>\n<div class=\"sheen-faq-list\">\n<div class=\"sheen-faq-item\">\n        <strong>Q1. What is the main function of SE800AB?<\/strong><\/p>\n<p>SE800AB is designed to fill small gaps between heat-generating components and heat sinks or housings, reducing interfacial thermal resistance while providing reliable electrical insulation and post-cure elastomeric shock absorption.<\/p>\n<\/p><\/div>\n<div class=\"sheen-faq-item\">\n        <strong>Q2. What is the difference between SE800AB and the 1K SE thermal gel series?<\/strong><\/p>\n<p>SE800AB is a two-component thermal gel that requires mixing before application and cures to form a soft elastomer. Compared with the 1K SE series, it is more suitable for applications that require controlled curing, stable interface thickness, and post-cure shock absorption.<\/p>\n<\/p><\/div>\n<div class=\"sheen-faq-item\">\n        <strong>Q3. What is the mix ratio of SE800AB?<\/strong><\/p>\n<p>The recommended mix ratio is 1:1 for Component A and Component B.<\/p>\n<\/p><\/div>\n<div class=\"sheen-faq-item\">\n        <strong>Q4. What applications is SE800AB suitable for?<\/strong><\/p>\n<p>SE800AB is suitable for CPUs, GPUs, PSUs, LED modules, ECUs, gaming consoles, laptops, and other electronic assemblies with small-gap tolerances.<\/p>\n<\/p><\/div>\n<div class=\"sheen-faq-item\">\n        <strong>Q5. What packaging options are available for SE800AB?<\/strong><\/p>\n<p>SE800AB is available in 50cc and 400cc packaging, with a shelf life of 6 months under recommended storage conditions.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/section>\n","protected":false},"excerpt":{"rendered":"<p>\nSE800AB \u00e8 un riempitivo flessibile bicomponente a base di resina siliconica, sviluppato per applicazioni con tolleranze ridotte tra componenti che generano calore e dissipatori di calore o alloggiamenti. Dopo la miscelazione e l'indurimento, forma un elastomero morbido che mantiene lo spessore dell'interfaccia, fornisce un affidabile assorbimento degli urti e migliora il contatto termico tra le superfici di accoppiamento.\n<\/p>\n<p>\nCon una conducibilit\u00e0 termica di 8,0 \u00b1 0,8 W\/m-K, una bassa impedenza termica e propriet\u00e0 di estrusione superiori, SE800AB contribuisce a ridurre la resistenza termica di contatto e a migliorare l'efficienza di dissipazione del calore negli assemblaggi elettronici. \u00c8 adatto per progetti che richiedono un dosaggio controllato, una buona flessibilit\u00e0 dopo l'indurimento e prestazioni di isolamento affidabili.\n<\/p>\n<div class=\"sheen-note-box\">\n<h3>Vantaggi principali<\/h3>\n<ul>\n<li>Gel termico bicomponente a base di resina siliconica per applicazioni a polimerizzazione controllata<\/li>\n<li>Conduttivit\u00e0 termica: 8,0 \u00b1 0,8 W\/m-K<\/li>\n<li>Bassa impedenza termica per un efficiente trasferimento di calore<\/li>\n<li>Morbido ed elastico dopo l'indurimento, con un affidabile assorbimento degli urti<\/li>\n<li>Adatto per progetti di interfacce termiche con tolleranza ridotta<\/li>\n<li>Controllo preciso dello spessore e della forma grazie a un'apparecchiatura di dosaggio automatizzata<\/li>\n<li>Elevato isolamento elettrico, con rigidit\u00e0 dielettrica superiore a 6 kV\/mm<\/li>\n<li>Eccellente resistenza alla fiamma, UL94 V-0<\/li>\n<li>Conforme ai requisiti RoHS, Halogen-Free e REACH<\/li>\n<\/ul>\n<\/div>","protected":false},"featured_media":2689,"template":"","meta":{"_gspb_post_css":"","_llm_markdown_disabled":false},"product_brand":[],"product_cat":[15,21,23],"product_tag":[],"class_list":["post-2654","product","type-product","status-publish","has-post-thumbnail","product_cat-tim","product_cat-paste-liquid","product_cat-two-component-thermal-conductive-gel","first","instock","shipping-taxable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/www.sheenmaterials.com\/it\/wp-json\/wp\/v2\/product\/2654","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sheenmaterials.com\/it\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.sheenmaterials.com\/it\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/it\/wp-json\/wp\/v2\/media\/2689"}],"wp:attachment":[{"href":"https:\/\/www.sheenmaterials.com\/it\/wp-json\/wp\/v2\/media?parent=2654"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/it\/wp-json\/wp\/v2\/product_brand?post=2654"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/it\/wp-json\/wp\/v2\/product_cat?post=2654"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/it\/wp-json\/wp\/v2\/product_tag?post=2654"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}