{"id":4166,"date":"2026-11-10T03:25:50","date_gmt":"2026-11-10T03:25:50","guid":{"rendered":"https:\/\/www.sheenmaterials.com\/?post_type=product&#038;p=4166"},"modified":"2026-11-10T03:28:23","modified_gmt":"2026-11-10T03:28:23","slug":"graphene-thermal-pad-gsf130-030","status":"publish","type":"product","link":"https:\/\/www.sheenmaterials.com\/es\/graphene-thermal-pad-gsf130-030\/","title":{"rendered":"Graphene Thermal Pad GSF130-030"},"content":{"rendered":"<style>\n.sheen-gsf{width:100%;max-width:1200px!important;margin:0 auto!important;font-family:Arial,Helvetica,sans-serif;color:#24313a;font-size:16px;line-height:1.72;--sg-green:#0a5a40;--sg-deep:#084632;--sg-border:#dbe5e0;--sg-soft:#f2f8f5}\n.sheen-gsf *,.sheen-gsf *:before,.sheen-gsf *:after{box-sizing:border-box}.sheen-gsf>*,.sheen-gsf .sg-overview-main,.sheen-gsf .sg-snapshot{min-width:0}.sheen-gsf h2,.sheen-gsf h3,.sheen-gsf h4{color:#084632;line-height:1.3}.sheen-gsf h2{font-size:30px;margin:0 0 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.sg-tag{justify-content:flex-start;font-size:12px}.sheen-gsf .sg-nav-links a{padding:9px 12px;font-size:13px}}\n<\/style>\n<div class=\"sheen-gsf\" id=\"gsf130-030-technical-description\" style=\"width:100%;max-width:1200px;margin:0 auto;font-family:Arial,Helvetica,sans-serif;color:#24313a;line-height:1.72;\">\n<section class=\"sg-lead\">\n<div class=\"sg-overview-grid\">\n<div class=\"sg-overview-main\">\n<div class=\"sg-title-row\">\n<div>\n<h2>Graphene Thermal Pad GSF130-030<\/h2>\n<div class=\"sg-subtitle\">130 W\/m\u00b7K Graphene Thermal Pad for High-Heat-Flux 0.30 mm Interfaces and Low Thermal Resistance<\/div>\n<\/div>\n<\/div>\n<p class=\"sg-intro\">GSF130-030 is a 0.30 mm graphene thermal pad for compact, high-power electronics. Graphene filler, vertically oriented alignment and laminated processing form through-interface heat-transfer pathways. Its soft, conformable structure supports mating-surface contact, with a TDS thermal conductivity of 130 W\/m\u00b7K and thermal resistance \u22640.06 \u00b0C\u00b7cm\u00b2\/W at 50 psi.<\/p>\n<div class=\"sg-tags\"><span class=\"sg-tag\">GSF130-030<\/span><span class=\"sg-tag\">0.30 mm Main Model<\/span><span class=\"sg-tag\">Thermal Conductivity 130 W\/m\u00b7K<\/span><span class=\"sg-tag\">Thermal Resistance \u22640.06 \u00b0C\u00b7cm\u00b2\/W @50 psi<\/span><span class=\"sg-tag\">Rebound Rate \u226590%<\/span><span class=\"sg-tag\">UL94 V-0<\/span><\/div>\n<\/div>\n<aside class=\"sg-snapshot\" aria-label=\"GSF130-030 series snapshot\">\n<div class=\"sg-snapshot-title\">Series Snapshot<\/div>\n<div class=\"sg-snapshot-grid\">\n<div class=\"sg-snapshot-card\"><span class=\"sg-snapshot-label\">Modelo<\/span><span class=\"sg-snapshot-value\">GSF130-030<\/span><\/div>\n<div class=\"sg-snapshot-card\"><span class=\"sg-snapshot-label\">Color<\/span><span class=\"sg-snapshot-value\">Black<\/span><\/div>\n<div class=\"sg-snapshot-card\"><span class=\"sg-snapshot-label\">Espesor<\/span><span class=\"sg-snapshot-value\">0.30 \u00b1 0.03 mm<\/span><\/div>\n<div class=\"sg-snapshot-card\"><span class=\"sg-snapshot-label\">Densidad<\/span><span class=\"sg-snapshot-value\">0.3\u20130.7 g\/cm\u00b3<\/span><\/div>\n<\/div>\n<\/aside>\n<\/div>\n<\/section>\n<section class=\"sg-tech-nav\">\n<div class=\"sg-title-row\">\n<h3>Informaci\u00f3n t\u00e9cnica<\/h3>\n<\/div>\n<div class=\"sg-tech-box\">\n<p>Review the product positioning, core parameters, interface behavior, handling requirements and application fit for GSF130-030 graphene thermal pad.<\/p>\n<nav class=\"sg-nav-links\" aria-label=\"GSF130-030 technical information\"><a href=\"#gsf130-030-q1\">Q1 Product Positioning<\/a><a href=\"#gsf130-030-q2\">Q2 Core Data<\/a><a href=\"#gsf130-030-q3\">Q3 Contact &amp; Reliability<\/a><a href=\"#gsf130-030-q4\">Q4 Handling &amp; Storage<\/a><a href=\"#gsf130-030-q5\">Q5 Applications<\/a><a href=\"#gsf130-030-downloads\">Downloads &amp; FAQ<\/a><\/nav>\n<\/div>\n<\/section>\n<section class=\"sg-section\" id=\"gsf130-030-q1\">\n<div class=\"sg-heading-row\"><span class=\"sg-q\">Q1<\/span><\/p>\n<h3>What is GSF130-030 designed for?<\/h3>\n<\/div>\n<p>GSF130-030 uses oriented lamination with graphene filler to establish vertical heat-transfer pathways between the heat source and cooling surface. Its soft structure supports conformity to mating surfaces, while a specified rebound rate of \u226590% provides an additional mechanical selection parameter.<\/p>\n<p>Compare GSF130-030 with GSF110-030 when a 0.30 mm supplied thickness is required. Its TDS lists higher conductivity and a lower thermal resistance limit at the same stated pressure.<\/p>\n<div class=\"sg-grid\">\n<div class=\"sg-card\">\n<h4>Defined thermal performance<\/h4>\n<p>Use the model-specific thermal resistance at 50 psi alongside conductivity, interface area and compressed thickness to shortlist a candidate.<\/p>\n<\/div>\n<div class=\"sg-card\">\n<h4>Conformable material structure<\/h4>\n<p>Evaluate contact coverage and tolerance accommodation under the allowable package load. Rebound rate alone does not define a recommended compression ratio or reuse life.<\/p>\n<\/div>\n<\/div>\n<\/section>\n<section class=\"sg-section\" id=\"gsf130-030-q2\">\n<div class=\"sg-heading-row\"><span class=\"sg-q\">Q2<\/span><\/p>\n<h3>What are the core technical data for GSF130-030?<\/h3>\n<\/div>\n<div class=\"sg-table-wrap\">\n<table>\n<caption>Model-specific properties listed in the SHEEN TDS<\/caption>\n<thead>\n<tr>\n<th scope=\"col\">Propiedad<\/th>\n<th scope=\"col\">GSF130-030<\/th>\n<th scope=\"col\">Listed test method<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<th scope=\"row\">Conductividad t\u00e9rmica<\/th>\n<td>130 W\/m\u00b7K<\/td>\n<td>ASTM E1461<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Area-normalized thermal resistance at 50 psi<\/th>\n<td>\u22640.06 \u00b0C\u00b7cm\u00b2\/W<\/td>\n<td>ASTM D5470<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Supplied thickness<\/th>\n<td>0.30 \u00b1 0.03 mm<\/td>\n<td>ASTM D374<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Application temperature<\/th>\n<td>\u221240 to 150\u00b0C<\/td>\n<td>Not specified<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Rebound rate<\/th>\n<td>\u226590%<\/td>\n<td>Not specified<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Tensile strength, orientation direction<\/th>\n<td>\u22650.05 MPa<\/td>\n<td>ASTM D412<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Color<\/th>\n<td>Black<\/td>\n<td>Visual<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Densidad<\/th>\n<td>0.3\u20130.7 g\/cm\u00b3<\/td>\n<td>ASTM D792<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Oil bleeding rate<\/th>\n<td>\u22643%<\/td>\n<td>Not specified<\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">Inflamabilidad<\/th>\n<td>V-0<\/td>\n<td>UL94<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p class=\"sg-note\">The thermal resistance value is area-normalized and specified at 50 psi (approximately 345 kPa). It must not be treated as \u00b0C\/W or applied unchanged to other pressures, thicknesses or mating surfaces. ASTM E1461 is listed for the conductivity data; request the underlying measurement details if required for qualification.<\/p>\n<p>The TDS states that the series meets RoHS 2.0, halogen-free and REACH requirements. Request the applicable declarations and supporting reports for your material and order.<\/p>\n<h4>Choose between the three graphene models<\/h4>\n<div class=\"sg-table-wrap\">\n<table>\n<caption>TDS comparison \u2014 thermal resistance values at 50 psi<\/caption>\n<thead>\n<tr>\n<th scope=\"col\">Modelo<\/th>\n<th scope=\"col\">Espesor<\/th>\n<th scope=\"col\">Conductivity<\/th>\n<th scope=\"col\">Resistencia t\u00e9rmica<\/th>\n<th scope=\"col\">Recursos<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<th scope=\"row\">GSF110-020<\/th>\n<td>0.20 \u00b1 0.02 mm<\/td>\n<td>110 W\/m\u00b7K<\/td>\n<td>\u22640.06 \u00b0C\u00b7cm\u00b2\/W<\/td>\n<td><a href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/11\/GSF110-020-Graphene-Thermal-Pad-TDS.pdf\" target=\"_blank\" rel=\"noopener\">TDS (PDF)<\/a><\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">GSF110-030<\/th>\n<td>0.30 \u00b1 0.03 mm<\/td>\n<td>110 W\/m\u00b7K<\/td>\n<td>\u22640.08 \u00b0C\u00b7cm\u00b2\/W<\/td>\n<td><a href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/11\/GSF110-030-Graphene-Thermal-Pad-TDS.pdf\" target=\"_blank\" rel=\"noopener\">TDS (PDF)<\/a><\/td>\n<\/tr>\n<tr>\n<th scope=\"row\">GSF130-030<\/th>\n<td>0.30 \u00b1 0.03 mm<\/td>\n<td>130 W\/m\u00b7K<\/td>\n<td>\u22640.06 \u00b0C\u00b7cm\u00b2\/W<\/td>\n<td><a href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/11\/GSF130-030-Graphene-Thermal-Pad-TDS.pdf\" target=\"_blank\" rel=\"noopener\">TDS (PDF)<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Choose supplied thickness from the mechanical stack-up first, then compare performance under equivalent pressure and contact conditions. A higher conductivity number alone does not predict the final device temperature.<\/p>\n<p>Browse the <a href=\"https:\/\/www.sheenmaterials.com\/es\/graphene-thermal-pads\/\">graphene thermal pad range<\/a>. Where electrical isolation is essential, discuss <a href=\"https:\/\/www.sheenmaterials.com\/es\/bn-thermal-pads\/\">boron nitride insulating thermal pads<\/a> with SHEEN.<\/p>\n<\/section>\n<section class=\"sg-section\" id=\"gsf130-030-q3\">\n<div class=\"sg-heading-row\"><span class=\"sg-q\">Q3<\/span><\/p>\n<h3>How should interface contact and reliability be evaluated?<\/h3>\n<\/div>\n<ol>\n<li><strong>Define the interface:<\/strong> provide the actual gap, contact area, surface materials, flatness and dimensional tolerances.<\/li>\n<li><strong>Check mechanical loading:<\/strong> relate pressure to contact area and allowable device force. The 50 psi test point is not a universal assembly recommendation.<\/li>\n<li><strong>Validate thermal contact:<\/strong> compare samples under the same pressure, surface preparation, heat load and operating conditions.<\/li>\n<li><strong>Review electrical and cleanliness requirements:<\/strong> the TDS provides no dielectric-strength or volume-resistivity specification. It also does not establish zero bleeding or zero outgassing.<\/li>\n<li><strong>Qualify the duty cycle:<\/strong> verify cycling, vibration, retention and any repeated-contact requirement before production use.<\/li>\n<\/ol>\n<p>The TDS describes no pump-out and specifies oil bleeding \u22643%. Request the relevant test conditions when evaluating a grease-replacement or contamination-sensitive application.<\/p>\n<\/section>\n<section class=\"sg-section\" id=\"gsf130-030-q4\">\n<div class=\"sg-heading-row\"><span class=\"sg-q\">Q4<\/span><\/p>\n<h3>How should GSF130-030 be stored and supplied?<\/h3>\n<\/div>\n<ul>\n<li><strong>Storage:<\/strong> temperature \u226430\u00b0C; relative humidity \u226475%.<\/li>\n<li><strong>Shelf life:<\/strong> 12 months from the production date.<\/li>\n<li><strong>Packaging:<\/strong> customizable according to customer requirements.<\/li>\n<li><strong>Sample request:<\/strong> confirm the model, dimensions, quantity and handling requirements with SHEEN.<\/li>\n<\/ul>\n<\/section>\n<section class=\"sg-section\" id=\"gsf130-030-q5\">\n<div class=\"sg-heading-row\"><span class=\"sg-q\">Q5<\/span><\/p>\n<h3>Which applications should be evaluated for GSF130-030?<\/h3>\n<\/div>\n<p>Candidate interfaces include High-heat-flux AI chips, accelerator cooling and compact processor-to-heatsink or cold-plate interfaces. The application areas below are selection starting points; component and assembly tests establish suitability.<\/p>\n<div class=\"sg-grid\">\n<div class=\"sg-card\">\n<h4>AI chips and server cooling<\/h4>\n<p>Screen package-lid-to-heatsink or cold-plate contact against heat load, flatness, warpage and permitted mounting force. Review <a href=\"https:\/\/www.sheenmaterials.com\/es\/applications\/communication-and-ai-infrastructure\/server\/\">SHEEN server thermal management applications<\/a>.<\/p>\n<\/div>\n<div class=\"sg-card\">\n<h4>High-speed optical modules<\/h4>\n<p>Evaluate fixed thermal interfaces for dimensional fit and controlled compression. Repeated sliding or insertion requires separate wear, particle and contact-retention testing. Explore <a href=\"https:\/\/www.sheenmaterials.com\/es\/applications\/communication-and-ai-infrastructure\/optical\/\">optical-module thermal solutions<\/a>.<\/p>\n<\/div>\n<div class=\"sg-card\">\n<h4>Automotive domain controllers<\/h4>\n<p>Consider processor cooling in autonomous-driving electronics. Confirm vibration, thermal cycling and project qualification requirements; the TDS is not a vehicle-level approval. See <a href=\"https:\/\/www.sheenmaterials.com\/es\/applications\/auto\/auto-electronics\/\">automotive electronics applications<\/a>.<\/p>\n<\/div>\n<div class=\"sg-card\">\n<h4>Equipos de telecomunicaciones<\/h4>\n<p>Assess compact power-dense interfaces using the available contact pressure and actual operating temperature. View <a href=\"https:\/\/www.sheenmaterials.com\/es\/applications\/communication-and-ai-infrastructure\/communication-base-station\/\">communication base-station applications<\/a>.<\/p>\n<\/div>\n<div class=\"sg-card\">\n<h4>Semiconductor and thermal-module testing<\/h4>\n<p>Evaluate fixture contact, surface cleanliness, indentation and thermal stability. If repeated use is required, establish cycle life and thermal drift experimentally.<\/p>\n<\/div>\n<div class=\"sg-card\">\n<h4>UAVs and humanoid robots<\/h4>\n<p>Screen compact computing and control electronics for pad retention, vibration, electrical clearance and the full operating-temperature envelope.<\/p>\n<\/div>\n<\/div>\n<\/section>\n<section class=\"sg-section\" id=\"gsf130-030-downloads\">\n<div class=\"sg-heading-row\"><span class=\"sg-q\">PDF<\/span><\/p>\n<h3>Downloads &amp; FAQ<\/h3>\n<\/div>\n<h4>Download the TDS or request evaluation samples<\/h4>\n<p>Send your contact dimensions, interface gap, heat load, allowable pressure, operating temperature and electrical requirements. SHEEN can help shortlist a model for sample evaluation.<\/p>\n<div class=\"sg-actions\"><a class=\"sg-button\" href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/11\/GSF130-030-Graphene-Thermal-Pad-TDS.pdf\" target=\"_blank\" rel=\"noopener\">Download GSF130-030 TDS (PDF)<\/a><a class=\"sg-button sg-button-secondary\" href=\"https:\/\/www.sheenmaterials.com\/es\/online-inquiry\/\">Request GSF130-030 samples \/ quote<\/a><\/div>\n<p><a href=\"https:\/\/www.sheenmaterials.com\/es\/support\/technical-support\/\">Discuss your application with technical support<\/a> \u00b7 <a href=\"https:\/\/www.sheenmaterials.com\/es\/resource\/datasheet-download\/\">Browse all SHEEN datasheets<\/a><\/p>\n<h4>Test-method references<\/h4>\n<ul class=\"sg-resource-list\">\n<li><a href=\"https:\/\/store.astm.org\/d5470-17r24.html\" target=\"_blank\" rel=\"noopener nofollow\">ASTM D5470 \u2014 thermal transmission test method<\/a><\/li>\n<li><a href=\"https:\/\/store.astm.org\/standards\/e1461\" target=\"_blank\" rel=\"noopener nofollow\">ASTM E1461 \u2014 flash-method thermal diffusivity<\/a><\/li>\n<\/ul>\n<p class=\"sg-note\">These links explain the referenced methods; they do not represent third-party product certification. Confirm material fitness in the intended assembly before production.<\/p>\n<h4>Frequently asked questions<\/h4>\n<details>\n<summary>What are the thickness and thermal resistance of GSF130-030?<\/summary>\n<p>The TDS specifies 0.30 \u00b1 0.03 mm thickness and area-normalized thermal resistance \u22640.06 \u00b0C\u00b7cm\u00b2\/W at 50 psi, with ASTM D5470 listed as the thermal resistance method.<\/p>\n<\/details>\n<details>\n<summary>Is this a through-interface material or a lateral heat spreader?<\/summary>\n<p>The TDS describes oriented, laminated graphene with vertical heat-transfer pathways. Evaluate the pad across the source-to-cooling-surface interface, and request directional measurement details for your design.<\/p>\n<\/details>\n<details>\n<summary>Can it replace thermal grease?<\/summary>\n<p>It is a candidate for evaluation where the gap, supplied thickness and mounting pressure are compatible. Compare thermal resistance, assembly process, contact coverage and reliability against the current grease in the actual structure.<\/p>\n<\/details>\n<details>\n<summary>Is it electrically insulating or silicone-free?<\/summary>\n<p>The available TDS does not establish either property. Ask SHEEN to confirm material composition and electrical requirements, or request an alternative with the relevant specifications.<\/p>\n<\/details>\n<details>\n<summary>Does \u226590% rebound mean it can be reused indefinitely?<\/summary>\n<p>No reuse-cycle rating is established by that value. Any repeated-use process needs validation of wear, debris, thickness change and thermal performance across the intended number of cycles.<\/p>\n<\/details>\n<\/section>\n<\/div>","protected":false},"excerpt":{"rendered":"<style>.sheen-gsf-short{color:inherit;font-family:inherit;line-height:1.7}.sheen-gsf-short p{margin:0 0 14px}.sheen-gsf-short ul{padding-left:20px;margin:12px 0 18px}.sheen-gsf-short li{margin-bottom:6px}.sheen-gsf-short a.sg-short-download{display:inline-block;padding:11px 16px;background:#0b8f67;color:#fff;border:1px solid #0b8f67;border-radius:7px;text-decoration:none;font-weight:600}.sheen-gsf-short a.sg-short-download:focus-visible{outline:3px solid #05684d;outline-offset:3px}.sheen-gsf-short .sg-short-note{font-size:13px;color:inherit;opacity:.85}<\/style>\n<div class=\"sheen-gsf-short\" aria-label=\"GSF130-030 product summary\">\n<p><strong>SHEEN GSF130-030<\/strong> is a 0.30 mm graphene thermal pad with oriented, laminated heat-transfer pathways for compact, high-power electronics.<\/p>\n<ul>\n<li><strong>Thermal conductivity:<\/strong> 130 W\/m\u00b7K; ASTM E1461 listed in the TDS.<\/li>\n<li><strong>Thermal resistance:<\/strong> \u22640.06 \u00b0C\u00b7cm\u00b2\/W at 50 psi; ASTM D5470.<\/li>\n<li><strong>Supplied thickness:<\/strong> 0.30 \u00b1 0.03 mm.<\/li>\n<li><strong>Rebound rate:<\/strong> \u226590%; soft, conformable structure.<\/li>\n<li><strong>Application temperature:<\/strong> \u221240 to 150\u00b0C; UL94 V-0 rating listed.<\/li>\n<li><strong>Evaluation areas:<\/strong> AI chips, optical modules, automotive domain controllers and semiconductor testing.<\/li>\n<\/ul>\n<p><a class=\"sg-short-download\" href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/11\/GSF130-030-Graphene-Thermal-Pad-TDS.pdf\" target=\"_blank\" rel=\"noopener\">Download GSF130-030 TDS (PDF)<\/a><\/p>\n<p class=\"sg-short-note\">Thermal resistance is pressure-dependent. Confirm interface fit, allowable load and electrical requirements before selection.<\/p>\n<\/div>","protected":false},"featured_media":2053,"template":"","meta":{"_gspb_post_css":"","_llm_markdown_disabled":false},"product_brand":[53],"product_cat":[31],"product_tag":[],"class_list":["post-4166","product","type-product","status-publish","has-post-thumbnail","product_brand-sheen","product_cat-graphene-thermal-pads","first","instock","shipping-taxable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/www.sheenmaterials.com\/es\/wp-json\/wp\/v2\/product\/4166","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sheenmaterials.com\/es\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.sheenmaterials.com\/es\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/es\/wp-json\/wp\/v2\/media\/2053"}],"wp:attachment":[{"href":"https:\/\/www.sheenmaterials.com\/es\/wp-json\/wp\/v2\/media?parent=4166"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/es\/wp-json\/wp\/v2\/product_brand?post=4166"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/es\/wp-json\/wp\/v2\/product_cat?post=4166"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/es\/wp-json\/wp\/v2\/product_tag?post=4166"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}