{"id":2902,"date":"2026-04-16T06:08:46","date_gmt":"2026-04-16T06:08:46","guid":{"rendered":"https:\/\/www.sheenmaterials.com\/?post_type=product&#038;p=2902"},"modified":"2026-07-02T07:13:18","modified_gmt":"2026-07-02T07:13:18","slug":"non-silicone-thermal-conductive-pads-series","status":"publish","type":"product","link":"https:\/\/www.sheenmaterials.com\/de\/non-silicone-thermal-conductive-pads-series\/","title":{"rendered":"Non-Silicone Thermal Conductive Pads Series"},"content":{"rendered":"<div class=\"sheen-af1000-final\" id=\"sheen-af1000-final\">\n<style>\n    .sheen-af1000-final{\n      --green:#0a5a40;\n      --green-dark:#084632;\n      --green-soft:#eef7f2;\n      --green-soft-2:#f8fbf9;\n      --page:#f5f7f6;\n      --card:#ffffff;\n      --line:#dbe6df;\n      --line-soft:#edf2ef;\n      --text:#22313a;\n      --muted:#64737c;\n      max-width:1200px;\n      margin:0 auto;\n      font-family:Arial,Helvetica,sans-serif;\n      color:var(--text);\n      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.af-btn.primary:hover{\n      background:var(--green-dark);\n      border-color:var(--green-dark);\n    }<\/p>\n<p>    .sheen-af1000-final details{\n      border:1px solid var(--line);\n      border-radius:18px;\n      background:#fff;\n      padding:0 18px;\n    }\n    .sheen-af1000-final details + details{margin-top:13px}\n    .sheen-af1000-final summary{\n      list-style:none;\n      cursor:pointer;\n      padding:17px 28px 17px 0;\n      position:relative;\n      font-weight:700;\n      color:var(--green-dark);\n    }\n    .sheen-af1000-final summary::-webkit-details-marker{display:none}\n    .sheen-af1000-final summary:after{\n      content:\"+\";\n      position:absolute;\n      right:0;\n      top:50%;\n      transform:translateY(-50%);\n      color:var(--green);\n      font-size:22px;\n      font-weight:400;\n    }\n    .sheen-af1000-final details[open] summary:after{content:\"\u2013\"}\n    .sheen-af1000-final .af-faq-body{\n      padding:14px 0 18px;\n      color:var(--muted);\n      font-size:14px;\n      border-top:1px solid var(--line-soft);\n    }<\/p>\n<p>    @media (max-width:1024px){\n      .sheen-af1000-final .af-hero-inner,\n      .sheen-af1000-final .af-grid-2{\n        grid-template-columns:1fr;\n      }\n      .sheen-af1000-final .af-grid-3,\n      .sheen-af1000-final .af-app-grid{\n        grid-template-columns:repeat(2,1fr);\n      }\n      .sheen-af1000-final .af-grid-4,\n      .sheen-af1000-final .af-spec-grid,\n      .sheen-af1000-final .af-downloads{\n        grid-template-columns:repeat(2,1fr);\n      }\n    }\n    @media (max-width:767px){\n      .sheen-af1000-final h2{font-size:25px}\n      .sheen-af1000-final h3{font-size:22px}\n      .sheen-af1000-final .af-section,\n      .sheen-af1000-final .af-hero-inner{\n        padding:22px 18px;\n      }\n      .sheen-af1000-final .af-grid-3,\n      .sheen-af1000-final .af-grid-4,\n      .sheen-af1000-final .af-spec-grid,\n      .sheen-af1000-final .af-downloads,\n      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The updated series content now includes AF1000, a higher-conductivity non-silicone thermal pad grade for data center, optical communication, server, storage, and other high-density electronic structures.\n          <\/p>\n<div class=\"af-badges\">\n            <span class=\"af-badge\">Silicone-Free \/ Non-Silicone<\/span><br \/>\n            <span class=\"af-badge\">Low Oil Bleeding Direction<\/span><br \/>\n            <span class=\"af-badge\">1.0\u201310.0 W\/m\u00b7K Selection Window<\/span><br \/>\n            <span class=\"af-badge\">AF1000 Available<\/span><br \/>\n            <span class=\"af-badge\">UL94 V-0<\/span><br \/>\n            <span class=\"af-badge\">Sheet or Die-Cut<\/span>\n          <\/div>\n<\/p><\/div>\n<div class=\"af-hero-card\">\n<h3>AF1000 Snapshot<\/h3>\n<p>\n            AF1000 is positioned as the high-conductivity model in the non-silicone thermal pad family for projects that need stronger heat transfer while keeping a silicone-free material direction.\n          <\/p>\n<div class=\"metric\">\n<div class=\"af-metric\">\n              <strong>10\u00b11<\/strong><br \/>\n              <span>W\/m\u00b7K thermal conductivity<\/span>\n            <\/div>\n<div class=\"af-metric\">\n              <strong>\u22640.13<\/strong><br \/>\n              <span>\u2103\u00b7in\u00b2\/W thermal resistance @50 psi<\/span>\n            <\/div>\n<div class=\"af-metric\">\n              <strong>1\u20132 mm<\/strong><br \/>\n              <span>standard AF1000 thickness range<\/span>\n            <\/div>\n<div class=\"af-metric\">\n              <strong>-40~150\u2103<\/strong><br \/>\n              <span>application temperature range<\/span>\n            <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/section>\n<nav class=\"af-section\">\n<div class=\"af-pill-nav\">\n        <a href=\"#af-q1\">Q1 Contamination Risk<\/a><br \/>\n        <a href=\"#af-q2\">Q2 Model Comparison<\/a><br \/>\n        <a href=\"#af1000\">AF1000 Details<\/a><br \/>\n        <a href=\"#af-q3\">Q3 Thickness &#038; Softness<\/a><br \/>\n        <a href=\"#af-q4\">Q4 Integration<\/a><br \/>\n        <a href=\"#af-q5\">Applications<\/a><br \/>\n        <a href=\"#af-downloads\">Downloads &#038; FAQ<\/a>\n      <\/div>\n<\/nav>\n<section class=\"af-section\" id=\"af-q1\">\n<h3>Q1. Will it reduce contamination risk in silicone-sensitive assemblies?<\/h3>\n<p>\n        For optical, sensing, precision electronics, data center, medical, and automotive electronics programs, material selection often starts with contamination risk before comparing thermal conductivity. The AF Series is structured for silicone-sensitive thermal interface assemblies where low oil bleeding, insulation, handling stability, and thermal transfer must be considered together.\n      <\/p>\n<div class=\"af-grid-3\">\n<div class=\"af-card\">\n          <strong>Silicone-Free Material Direction<\/strong><\/p>\n<p>Designed for assemblies where silicone oil migration, lens fogging, contact contamination, or electrical malfunction risk must be reduced.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Low Oil Bleeding Direction<\/strong><\/p>\n<p>Useful for optical modules, sensors, cameras, and precision electronic structures where interface cleanliness is part of qualification.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Optional Low Volatility Direction<\/strong><\/p>\n<p>For stricter projects, low oil leakage or low volatility requirements should be confirmed during sampling and qualification.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<div style=\"height:22px\"><\/div>\n<div class=\"af-grid-2\">\n<div class=\"af-card\">\n<h4>Why this matters<\/h4>\n<ul>\n<li>Silicone-sensitive projects usually screen contamination risk before conductivity ranking.<\/li>\n<li>Oil bleed or volatile residue can affect optics, sensors, camera windows, connectors, and nearby electrical contacts.<\/li>\n<li>AF Series helps engineers evaluate thermal transfer and cleanliness direction in the same material family.<\/li>\n<\/ul><\/div>\n<div class=\"af-card\">\n<h4>What to confirm during sampling<\/h4>\n<ul>\n<li>Whether the project is silicone-sensitive, contamination-sensitive, or both.<\/li>\n<li>Whether low oil leakage or low volatility should be specified from the beginning.<\/li>\n<li>Whether the target structure requires both electrical insulation and high thermal conductivity.<\/li>\n<\/ul><\/div>\n<\/p><\/div>\n<\/section>\n<section class=\"af-section\" id=\"af-q2\">\n<h3>Q2. Does conductivity translate into real thermal performance in the actual structure?<\/h3>\n<p>\n        Model comparison should not rely on W\/m\u00b7K alone. For gap-filling thermal pads, conductivity, thermal resistance, thickness, hardness, compression, contact quality, and actual heat path should be reviewed together.\n      <\/p>\n<div class=\"af-grid-3\">\n<div class=\"af-card\">\n          <strong>Conductivity Range<\/strong><\/p>\n<p>Updated AF Series content now extends the selection window up to AF1000 at 10 W\/m\u00b7K class.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Thermal Resistance Matters<\/strong><\/p>\n<p>Lower thermal resistance can be more meaningful than conductivity alone when comparing pads at the same thickness and pressure condition.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Test Pressure Matters<\/strong><\/p>\n<p>AF1000 thermal resistance is listed at 50 psi, while several lower AF grades are commonly compared at 30 psi. Keep test condition differences visible.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<div class=\"af-table-wrap\">\n<table>\n<thead>\n<tr>\n<th>Model<\/th>\n<th>Color<\/th>\n<th>Thermal Conductivity<\/th>\n<th>Thermal Resistance<\/th>\n<th>Thickness<\/th>\n<th>Hardness<\/th>\n<th>Selection Note<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>AF100<\/td>\n<td>White \/ project dependent<\/td>\n<td>1.0 W\/m\u00b7K<\/td>\n<td>1.1 \u2103\u00b7in\u00b2\/W @30 psi<\/td>\n<td>0.25\u20135.0 mm<\/td>\n<td>50 \/ 70 \u00b1 5 Shore 00<\/td>\n<td>Entry-grade option for low thermal loading and silicone-sensitive assemblies.<\/td>\n<\/tr>\n<tr>\n<td>AF300<\/td>\n<td>White \/ project dependent<\/td>\n<td>2.0 W\/m\u00b7K<\/td>\n<td>0.8 \u2103\u00b7in\u00b2\/W @30 psi<\/td>\n<td>0.25\u20135.0 mm<\/td>\n<td>50 \/ 70 \u00b1 5 Shore 00<\/td>\n<td>Moderate step-up for insulated gap-filling applications.<\/td>\n<\/tr>\n<tr>\n<td>AF500<\/td>\n<td>White \/ project dependent<\/td>\n<td>3.0 W\/m\u00b7K<\/td>\n<td>0.6 \u2103\u00b7in\u00b2\/W @30 psi<\/td>\n<td>0.25\u20135.0 mm<\/td>\n<td>50 \/ 70 \u00b1 5 Shore 00<\/td>\n<td>Balanced choice for industrial, storage, and communication equipment.<\/td>\n<\/tr>\n<tr>\n<td>AF600<\/td>\n<td>White \/ project dependent<\/td>\n<td>5.0 W\/m\u00b7K<\/td>\n<td>0.3 \u2103\u00b7in\u00b2\/W @30 psi<\/td>\n<td>0.5\u20135.0 mm<\/td>\n<td>50 \/ 70 \u00b1 5 Shore 00<\/td>\n<td>Higher-performance option for tighter thermal targets with insulation requirements.<\/td>\n<\/tr>\n<tr>\n<td>AF600G<\/td>\n<td>White \/ project dependent<\/td>\n<td>6.0 W\/m\u00b7K<\/td>\n<td>0.25 \u2103\u00b7in\u00b2\/W @30 psi<\/td>\n<td>0.5\u20135.0 mm<\/td>\n<td>50 \/ 70 \u00b1 5 Shore 00<\/td>\n<td>High-performance grade for communication, AI, and compact electronics hardware.<\/td>\n<\/tr>\n<tr>\n<td>AF800<\/td>\n<td>White \/ project dependent<\/td>\n<td>8.0 W\/m\u00b7K<\/td>\n<td>0.2 \u2103\u00b7in\u00b2\/W @30 psi<\/td>\n<td>0.5\u20135.0 mm<\/td>\n<td>50 \/ 70 \u00b1 5 Shore 00<\/td>\n<td>Advanced thermal interface option for stronger heat-transfer requirements.<\/td>\n<\/tr>\n<tr class=\"af-highlight-row\">\n<td>AF1000<\/td>\n<td>Gray<\/td>\n<td>10\u00b11 W\/m\u00b7K<\/td>\n<td>\u22640.13 \u2103\u00b7in\u00b2\/W @50 psi<\/td>\n<td>1\u20132 mm<\/td>\n<td>50\u201365 Shore 00<\/td>\n<td>High-conductivity non-silicone grade for data center, network equipment, optical modules, servers, hard drives, and SSDs.<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<p class=\"af-note\">\n        Selection logic: compare model, thickness, thermal resistance, assembly pressure, compression condition, and real interface gap together. AF1000 uses a different thermal-resistance pressure condition, so do not compare it against lower grades by resistance value alone.\n      <\/p>\n<\/section>\n<section class=\"af-section\" id=\"af1000\">\n<div class=\"af-af1000-box\">\n<h3>AF1000 Non-Silicone Thermal Pad<\/h3>\n<p>\n          AF1000 is the high-conductivity model added to this page for applications where a silicone-free thermal pad must handle stronger localized heat transfer. It is naturally tacky, can be die-cut into customized shapes, and is designed to fill contact interfaces while helping exclude air from the thermal path.\n        <\/p>\n<div class=\"af-spec-grid\">\n<div class=\"af-spec\">\n            <span>Thermal Conductivity<\/span><br \/>\n            <strong>10\u00b11 W\/m\u00b7K<\/strong>\n          <\/div>\n<div class=\"af-spec\">\n            <span>Thermal Resistance<\/span><br \/>\n            <strong>\u22640.13 \u2103\u00b7in\u00b2\/W @50 psi<\/strong>\n          <\/div>\n<div class=\"af-spec\">\n            <span>Thickness<\/span><br \/>\n            <strong>1\u20132 mm<\/strong>\n          <\/div>\n<div class=\"af-spec\">\n            <span>Hardness<\/span><br \/>\n            <strong>50\u201365 Shore 00<\/strong>\n          <\/div>\n<div class=\"af-spec\">\n            <span>Breakdown Voltage<\/span><br \/>\n            <strong>\u22654 kV AC<\/strong>\n          <\/div>\n<div class=\"af-spec\">\n            <span>Volume Resistivity<\/span><br \/>\n            <strong>\u226510\u00b9\u00b2 \u03a9\u00b7cm<\/strong>\n          <\/div>\n<div class=\"af-spec\">\n            <span>Flammability<\/span><br \/>\n            <strong>UL94 V-0<\/strong>\n          <\/div>\n<div class=\"af-spec\">\n            <span>Application Temperature<\/span><br \/>\n            <strong>-40~150\u2103<\/strong>\n          <\/div>\n<\/p><\/div>\n<div style=\"height:22px\"><\/div>\n<div class=\"af-grid-2\">\n<div class=\"af-card\">\n<h4>AF1000 is a better fit when:<\/h4>\n<ul>\n<li>The structure needs higher heat-transfer capacity than AF600G or AF800 class materials.<\/li>\n<li>The assembly is silicone-sensitive or contamination-sensitive.<\/li>\n<li>The interface gap is within the AF1000 1\u20132 mm thickness window.<\/li>\n<li>The design requires insulation, flame resistance, and customized die-cut integration.<\/li>\n<\/ul><\/div>\n<div class=\"af-card\">\n<h4>Engineering checks before approval:<\/h4>\n<ul>\n<li>Confirm actual gap and tolerance stack-up before specifying AF1000 thickness.<\/li>\n<li>Validate compression force against component stress limits.<\/li>\n<li>Check thermal result under the real heat source, enclosure, heat sink, or chassis condition.<\/li>\n<li>Confirm low oil leakage or low volatility requirements during qualification.<\/li>\n<\/ul><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/section>\n<section class=\"af-section\" id=\"af-q3\">\n<h3>Q3. Will softness and thickness work with the assembly instead of increasing stress?<\/h3>\n<p>\n        A thermal pad does not work only because it has a high conductivity rating. It must match the actual gap, compression range, surface flatness, and allowable clamping force. This is especially important for optical modules, SSDs, routers, servers, sensors, BMS boards, and compact electronic modules.\n      <\/p>\n<div class=\"af-grid-3\">\n<div class=\"af-card\">\n          <strong>Thickness Fit<\/strong><\/p>\n<p>Lower AF grades provide broader gap-filling options, while AF1000 should be used where the 1\u20132 mm gap window matches the real structure.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Soft Contact<\/strong><\/p>\n<p>Appropriate softness helps the pad conform to uneven surfaces and reduce trapped air in the contact interface.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Compression Review<\/strong><\/p>\n<p>Thermal validation should include compression force, component stress, screw torque, housing tolerance, and heat-sink contact pressure.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<div style=\"height:22px\"><\/div>\n<div class=\"af-grid-2\">\n<div class=\"af-card\">\n<h4>Suggested selection sequence<\/h4>\n<ul>\n<li>Measure the actual interface gap and tolerance stack-up.<\/li>\n<li>Confirm whether silicone-free or low-volatility material direction is required.<\/li>\n<li>Choose the thickness range that can fill the gap without over-compression.<\/li>\n<li>Compare thermal resistance and conductivity among candidate AF grades.<\/li>\n<li>Run thermal and mechanical validation under the real assembly condition.<\/li>\n<\/ul><\/div>\n<div class=\"af-card\">\n<h4>AF1000 thickness note<\/h4>\n<p>\n            AF1000 should not be selected only because it is the highest-conductivity model. It is strongest when the thermal demand is high and the interface design matches the 1\u20132 mm AF1000 thickness window.\n          <\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/section>\n<section class=\"af-section\" id=\"af-q4\">\n<h3>Q4. Is it suitable for long-term use and production integration?<\/h3>\n<p>\n        Before moving from samples to qualification, buyers should confirm handling, supply form, cutting format, packaging, shelf life by model, compliance statements, storage condition, and the final assembly method.\n      <\/p>\n<div class=\"af-grid-4\">\n<div class=\"af-card\">\n          <strong>Sheet Supply<\/strong><\/p>\n<p>Standard sheet products can support engineering sampling and early-stage process evaluation.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Custom Die-Cut<\/strong><\/p>\n<p>Die-cut parts help align the pad with chip, module, heat sink, chassis, or housing geometry.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Self-Adhesive Handling<\/strong><\/p>\n<p>Natural tack helps positioning and assembly during prototype and production use.<\/p>\n<\/p><\/div>\n<div class=\"af-card\">\n          <strong>Compliance Direction<\/strong><\/p>\n<p>AF1000 lists RoHS, Halogen, and REACH pass statements, with UL94 V-0 flame resistance.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<div style=\"height:22px\"><\/div>\n<div class=\"af-card\">\n<h4>Production approval checklist<\/h4>\n<ul>\n<li>Target model, thickness, and part drawing.<\/li>\n<li>Assembly pressure, compression condition, and allowable component stress.<\/li>\n<li>Electrical insulation requirements, creepage and clearance considerations.<\/li>\n<li>Cleanliness requirement: silicone-free, low oil bleeding, low oil leakage, or low volatility.<\/li>\n<li>Packaging format, release liner direction, and installation workflow.<\/li>\n<li>Shelf life and storage condition based on the selected model\u2019s datasheet.<\/li>\n<\/ul><\/div>\n<\/section>\n<section class=\"af-section\" id=\"af-q5\">\n<h3>Recommended Application Fit<\/h3>\n<p>\n        The AF Series is suitable for silicone-sensitive thermal interface structures. AF1000 should be highlighted for high-density equipment where non-silicone material direction and stronger thermal performance are required together.\n      <\/p>\n<div class=\"af-app-grid\">\n<div class=\"af-app-card\">\n          <span class=\"label\">Data Center<\/span><\/p>\n<h4>Network Equipment<\/h4>\n<p>AF1000 is aligned with thermal interfaces in switches, routers, and optical modules where higher power density and contamination control must be considered together.<\/p>\n<div class=\"af-chip-wrap\">\n            <span class=\"af-chip\">Switches<\/span><br \/>\n            <span class=\"af-chip\">Routers<\/span><br \/>\n            <span class=\"af-chip\">Optical Modules<\/span>\n          <\/div>\n<\/p><\/div>\n<div class=\"af-app-card\">\n          <span class=\"label\">Computing<\/span><\/p>\n<h4>Servers &#038; AI Hardware<\/h4>\n<p>Use AF Series when insulated gap filling is needed around server boards, accelerator-adjacent structures, heat sinks, housings, or localized thermal paths.<\/p>\n<div class=\"af-chip-wrap\">\n            <span class=\"af-chip\">Servers<\/span><br \/>\n            <span class=\"af-chip\">AI Devices<\/span><br \/>\n            <span class=\"af-chip\">Thermal Interfaces<\/span>\n          <\/div>\n<\/p><\/div>\n<div class=\"af-app-card\">\n          <span class=\"label\">Storage<\/span><\/p>\n<h4>Hard Drives &#038; SSDs<\/h4>\n<p>AF1000 is useful when compact storage equipment needs improved heat transfer while avoiding silicone-sensitive contamination concerns.<\/p>\n<div class=\"af-chip-wrap\">\n            <span class=\"af-chip\">Hard Drives<\/span><br \/>\n            <span class=\"af-chip\">SSDs<\/span><br \/>\n            <span class=\"af-chip\">Compact Modules<\/span>\n          <\/div>\n<\/p><\/div>\n<div class=\"af-app-card\">\n          <span class=\"label\">Optical<\/span><\/p>\n<h4>Optical Communication<\/h4>\n<p>Non-silicone thermal pads are a strong material direction where optical windows, lenses, fiber optic assemblies, or precision optical paths are sensitive to residue.<\/p>\n<div class=\"af-chip-wrap\">\n            <span class=\"af-chip\">Optical Modules<\/span><br \/>\n            <span class=\"af-chip\">Fiber Systems<\/span><br \/>\n            <span class=\"af-chip\">Low Contamination<\/span>\n          <\/div>\n<\/p><\/div>\n<div class=\"af-app-card\">\n          <span class=\"label\">Automotive<\/span><\/p>\n<h4>BDU \/ BMS Thermal Points<\/h4>\n<p>AF Series can be used for localized thermal control around battery disconnect units, BMS boards, control modules, contactors, and other silicone-sensitive automotive electronics.<\/p>\n<div class=\"af-chip-wrap\">\n            <span class=\"af-chip\">BDU<\/span><br \/>\n            <span class=\"af-chip\">BMS<\/span><br \/>\n            <span class=\"af-chip\">Automotive Sensors<\/span>\n          <\/div>\n<\/p><\/div>\n<div class=\"af-app-card\">\n          <span class=\"label\">Precision Electronics<\/span><\/p>\n<h4>Sensors, Cameras &#038; Medical Devices<\/h4>\n<p>For contamination-sensitive precision equipment, AF Series helps engineers evaluate thermal transfer and silicone-free material direction in the same selection path.<\/p>\n<div class=\"af-chip-wrap\">\n            <span class=\"af-chip\">Sensors<\/span><br \/>\n            <span class=\"af-chip\">Security Cameras<\/span><br \/>\n            <span class=\"af-chip\">Medical Devices<\/span>\n          <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/section>\n<section class=\"af-section\" id=\"af-downloads\">\n<h3>Downloads &#038; FAQ<\/h3>\n<p>\n        Download the available AF Series datasheets or contact SHEEN for model-specific thickness, die-cut, low oil leakage, low volatility, and qualification requirements.\n      <\/p>\n<div class=\"af-downloads\">\n        <a class=\"af-btn\" href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/04\/AF100-20260402V0-%EF%BC%88EN%EF%BC%89-Non-Silicone-Thermal-Pad.pdf\" target=\"_blank\" rel=\"noopener\">AF100 Datasheet<\/a><br \/>\n        <a class=\"af-btn\" href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/04\/AF300-20260402V0-%EF%BC%88EN%EF%BC%89-Non-Silicone-Thermal-Pad.pdf\" target=\"_blank\" rel=\"noopener\">AF300 Datasheet<\/a><br \/>\n        <a class=\"af-btn\" href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/04\/AF500-20260402V0-%EF%BC%88EN%EF%BC%89-Non-Silicone-Thermal-Pad.pdf\" target=\"_blank\" rel=\"noopener\">AF500 Datasheet<\/a><br \/>\n        <a class=\"af-btn\" href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/04\/AF600-20260402V0-%EF%BC%88EN%EF%BC%89-Non-Silicone-Thermal-Pad.pdf\" target=\"_blank\" rel=\"noopener\">AF600 Datasheet<\/a><br \/>\n        <a class=\"af-btn\" href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/04\/AF600G-20260402V0-%EF%BC%88EN%EF%BC%89Non-Silicone-Thermal-Pad.pdf\" target=\"_blank\" rel=\"noopener\">AF600G Datasheet<\/a><br \/>\n        <a class=\"af-btn primary\" href=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/04\/AF1000-20260304V0-%EF%BC%88EN%EF%BC%89Non-Silicone-Thermal-Pad.pdf\" target=\"_blank\" rel=\"noopener\">AF1000 Datasheet<\/a><br \/>\n        <a class=\"af-btn\" href=\"https:\/\/www.sheenmaterials.com\/resource\/datasheet-download\/\" target=\"_blank\" rel=\"noopener\">View All Datasheets<\/a><br \/>\n        <a class=\"af-btn\" href=\"https:\/\/www.sheenmaterials.com\/support\/technical-support\/\" target=\"_blank\" rel=\"noopener\">Technical Support<\/a>\n      <\/div>\n<details open>\n<summary>Q1. Why should this page include AF1000?<\/summary>\n<div class=\"af-faq-body\">\n          Because AF1000 extends the non-silicone thermal pad family into a higher-conductivity class. It gives engineers a clearer option when AF600G or AF800 class materials are not enough for the target thermal path.\n        <\/div>\n<\/details>\n<details>\n<summary>Q2. Is AF1000 always the best model?<\/summary>\n<div class=\"af-faq-body\">\n          No. AF1000 should be selected when the thermal demand, interface gap, compression condition, and 1\u20132 mm thickness window match the structure. For broader gaps, softer assembly requirements, or lower heat loads, other AF models may be more suitable.\n        <\/div>\n<\/details>\n<details>\n<summary>Q3. Why does AF1000 use a different pressure condition in the thermal resistance value?<\/summary>\n<div class=\"af-faq-body\">\n          AF1000 thermal resistance is listed at 50 psi. Several lower AF models are commonly compared at 30 psi. Engineers should avoid direct comparison by thermal resistance alone unless the test condition is aligned.\n        <\/div>\n<\/details>\n<details>\n<summary>Q4. Which applications should mention AF1000 most clearly?<\/summary>\n<div class=\"af-faq-body\">\n          AF1000 should be emphasized for data center network equipment, switches, routers, optical modules, servers, hard drives, SSDs, and other compact electronics where stronger heat transfer and non-silicone material direction are both needed.\n        <\/div>\n<\/details>\n<details>\n<summary>Q5. What should buyers confirm before requesting AF1000 samples?<\/summary>\n<div class=\"af-faq-body\">\n          Buyers should confirm target thickness, actual gap, compression force, operating temperature, insulation requirement, die-cut drawing, packaging format, and whether low oil leakage or low volatility needs to be specified.\n        <\/div>\n<\/details>\n<details>\n<summary>Q6. What should be updated in the page summary after adding AF1000?<\/summary>\n<div class=\"af-faq-body\">\n          Update the summary range from \u201c1.0\u20138.0 W\/m\u00b7K\u201d to a range that includes AF1000, such as \u201c1.0\u201310.0 W\/m\u00b7K selection window,\u201d and add AF1000 to the model table, AF1000 details section, application section, and download area.\n        <\/div>\n<\/details>\n<\/section><\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<section class=\"af-section\" id=\"af-benefits\">\n<ul class=\"af-benefits\">\n<li>Free of siloxane, helping eliminate the risk of silicone oil bleed<\/li>\n<li>Suitable for contamination-sensitive thermal interface applications<\/li>\n<li>Helps reduce risks such as optical lens fogging and electrical malfunction<\/li>\n<li>Current public AF Series covers 1.0 to 8.0 W\/m\u00b7K<\/li>\n<li>Hervorragende elektrische Isolationsleistung<\/li>\n<li>UL94 V-0 flame resistance<\/li>\n<li>Self-adhesive design for easier installation and rework<\/li>\n<li>Available in standard sheets and customized die-cut parts<\/li>\n<\/ul>\n<\/section>","protected":false},"featured_media":2772,"template":"","meta":{"_gspb_post_css":""},"product_brand":[],"product_cat":[17,19,15],"product_tag":[],"class_list":["post-2902","product","type-product","status-publish","has-post-thumbnail","product_cat-thermal-pads","product_cat-non-silicone-thermal-conductive-pads","product_cat-tim","first","instock","shipping-taxable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/www.sheenmaterials.com\/de\/wp-json\/wp\/v2\/product\/2902","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sheenmaterials.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.sheenmaterials.com\/de\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/de\/wp-json\/wp\/v2\/media\/2772"}],"wp:attachment":[{"href":"https:\/\/www.sheenmaterials.com\/de\/wp-json\/wp\/v2\/media?parent=2902"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/de\/wp-json\/wp\/v2\/product_brand?post=2902"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/de\/wp-json\/wp\/v2\/product_cat?post=2902"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/de\/wp-json\/wp\/v2\/product_tag?post=2902"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}