{"id":1607,"date":"2026-02-28T15:37:30","date_gmt":"2026-02-28T15:37:30","guid":{"rendered":"https:\/\/www.sheenmaterials.com\/"},"modified":"2026-07-25T08:06:19","modified_gmt":"2026-07-25T08:06:19","slug":"bsf1600","status":"publish","type":"product","link":"https:\/\/www.sheenmaterials.com\/de\/bsf1600\/","title":{"rendered":"BSF1600 Boron Nitride-Filled Electrically Insulating Thermal Interface Pad \u2014 16 W\/m\u00b7K"},"content":{"rendered":"

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SF1600-BN Series<\/p>\n

SF1600 Boron Nitride Thermal Pad Series<\/h2>\n
16 W\/m·K Electrically Insulating Thermal Pads for High-Voltage, High-Frequency, and High-Power Electronics<\/div>\n

The SF1600-BN series consists of flexible thermal interface pads formulated with hexagonal boron nitride (h-BN) as the thermally conductive filler and silicone rubber as the base material. The series combines high thermal conductivity, electrical insulation, low dielectric characteristics, and conformability to transfer heat from MOSFETs, IGBTs, AI chips, optical modules, and other heat-generating components to a heat sink, housing, or cold plate.<\/p>\n

Seven current datasheet models cover nominal thicknesses from 0.3 mm to 3.0 mm. Each model retains 16 W\/m·K thermal conductivity, while thermal resistance, AC breakdown voltage, and rebound rate vary by thickness. This lets engineers select the right balance of gap filling, insulation, and heat-transfer performance for the assembly.<\/p>\n

\n 7 Standard Models<\/span>
\n 0.3-3.0 mm Datasheet Models<\/span>
\n 16 W\/m·K<\/span>
\n Up to ≥12 kV AC<\/span>
\n UL94 V-0<\/span>\n <\/div>\n<\/p><\/div>\n