{"id":4038,"date":"2026-09-11T09:36:25","date_gmt":"2026-09-11T09:36:25","guid":{"rendered":"https:\/\/www.sheenmaterials.com\/?p=4038"},"modified":"2026-09-11T09:36:25","modified_gmt":"2026-09-11T09:36:25","slug":"graphene-thermal-pad-for-1-6t-osfp-high-speed-optical-module","status":"publish","type":"post","link":"https:\/\/www.sheenmaterials.com\/ar\/graphene-thermal-pad-for-1-6t-osfp-high-speed-optical-module\/","title":{"rendered":"Graphene Thermal Pad for 1.6T OSFP High-Speed Optical Module"},"content":{"rendered":"<p class=\"wp-block-paragraph\">As AI computing power accelerates rapidly, optical modules\u2014serving as the core medium for high-speed data center interconnects\u2014are evolving quickly toward higher integration, miniaturization, and higher data rates. With the increasingly widespread deployment of 800G technology, the large-scale commercialization of <strong>1.6T optical modules <\/strong>is also just around the corner.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">At the same time, as bandwidth upgrades continue and the power consumption of core components rises, effective thermal management is no longer a secondary consideration; rather, it has become a fundamental requirement for system stability, reliability, and consistent performance.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In this article, drawing on a real-world project case study, we highlight the practical application of <a href=\"https:\/\/www.sheenmaterials.com\/ar\/graphene-thermal-pad-gsf90-03\/\"><strong>Sheen\u2019s GSF90-03 thermal pad<\/strong> \u0641\u064a <strong>1.6T OSFP<\/strong><\/a> high-speed optical modules.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Because 1.6T OSFP modules run hotter in cramped spaces, a Graphene Thermal Pad for 1.6T OSFP High-Speed Optical Modules can move concentrated heat through a thin interface. Hotspots don\u2019t care about marketing; thermal impedance, fit, and reliability matter most.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For buyers, the plot thickens: compare graphene with compressible silicone, then verify insulation, die-cutting, adhesives, compliance, and consistency.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Graphene Thermal Pad for 1.6T OSFP High-Speed Optical Module<\/strong><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Delivers exceptional thermal conductivity to spread heat from power-dense modules, stabilizing operating temperatures.<\/li>\n\n\n\n<li>Offers ultra-low thermal impedance for efficient heat transfer between transceiver housing and heatsinks.<\/li>\n\n\n\n<li>Maintains thin, flexible profiles to conform within cramped OSFP interfaces without excessive compression.<\/li>\n\n\n\n<li>Ensures long-term reliability with thermal-aging resistance, RoHS\/REACH compliance, flame-retardant and halogen-free options.<\/li>\n<\/ol>\n\n\n\n<h2 id=\"graphene-vs-silicone-for-module-cooling\" class=\"wp-block-heading\">Graphene Vs. Silicone For Module Cooling<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Cooling a 1.6T optical link gets tricky when high power meets very little space. The Graphene Thermal Pad for 1.6T OSFP High-Speed \u200b\u200bOptical Module targets faster heat transfer, while silicone favors softness and insulation. Picking the right contact layer can keep temperatures under control without making assembly a headache.<\/p>\n\n\n\n<h3 id=\"graphene-thermal-pad\" class=\"wp-block-heading\">Graphene Thermal Pad<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Graphene stands out when low\u00a0<strong>\u0627\u0644\u0645\u0642\u0627\u0648\u0645\u0629 \u0627\u0644\u062d\u0631\u0627\u0631\u064a\u0629<\/strong>\u00a0matters inside the compact\u00a0<strong>OSFP form factor<\/strong>. A Graphene Thermal Pad for 1.6T OSFP High-Speed \u200b\u200bOptical Module uses a thin\u00a0<strong>nanomaterial<\/strong>\u00a0path to move concentrated heat toward the heatsink.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Thermal performance\n<ul class=\"wp-block-list\">\n<li>\u0639\u0627\u0644\u064a\u0629&nbsp;<strong>\u0627\u0644\u062a\u0648\u0635\u064a\u0644 \u0627\u0644\u062d\u0631\u0627\u0631\u064a<\/strong>&nbsp;supports rapid&nbsp;<strong>\u062a\u0628\u062f\u064a\u062f \u0627\u0644\u062d\u0631\u0627\u0631\u0629<\/strong>&nbsp;from a power-dense&nbsp;<strong>high-speed optical module<\/strong>.<\/li>\n\n\n\n<li>The thin&nbsp;<strong>interface material<\/strong>&nbsp;can reduce the distance heat must travel, which is a big deal when space gets tight.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Design fit\n<ul class=\"wp-block-list\">\n<li>A Graphene Thermal Pad for 1.6T OSFP High-Speed \u200b\u200bOptical Module works best when mating surfaces provide controlled, fairly even contact.<\/li>\n\n\n\n<li>Sheen Materials can support thermal-pad choices for 1.6T OSFP designs where conduction efficiency and compact installation both count.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">In short, a graphene thermal pad suits designers chasing a strong thermal path without piling on interface thickness.<\/p>\n\n\n\n<h3 id=\"silicone-thermal-pad\" class=\"wp-block-heading\">Silicone Thermal Pad<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Silicone takes a different route. This flexible&nbsp;<strong>elastomer material<\/strong>&nbsp;acts as a&nbsp;<strong>\u062d\u0634\u0648 \u0627\u0644\u0641\u062c\u0648\u0629<\/strong>, conforming to height differences that may otherwise leave unwanted air pockets.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>For uneven surfaces, its&nbsp;<strong>\u0642\u0627\u0628\u0644\u064a\u0629 \u0627\u0644\u0627\u0646\u0636\u063a\u0627\u0637<\/strong>&nbsp;helps maintain physical contact with the module and heatsink.<\/li>\n\n\n\n<li>For electrical protection, useful&nbsp;<strong>\u0623\u062f\u0627\u0621 \u0627\u0644\u0639\u0632\u0644<\/strong>&nbsp;can separate conductive parts while still supporting&nbsp;<strong>\u0627\u0644\u0625\u062f\u0627\u0631\u0629 \u0627\u0644\u062d\u0631\u0627\u0631\u064a\u0629<\/strong>.<\/li>\n\n\n\n<li>For changing operating conditions, good&nbsp;<strong>\u062b\u0628\u0627\u062a \u062f\u0631\u062c\u0629 \u0627\u0644\u062d\u0631\u0627\u0631\u0629<\/strong>&nbsp;helps the pad retain practical performance over repeated heating cycles.<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">The trade-off is&nbsp;<strong>conduction efficiency<\/strong>: conventional silicone often transfers heat less effectively than graphene. So, when specifying a Graphene Thermal Pad for 1.6T OSFP High-Speed \u200b\u200bOptical Module against a silicone thermal pad, engineers need to weigh surface fit against heat flow. Sheen Materials offers options for both priorities, making material selection less of a guessing game.<\/p>\n\n\n\n<h2 id=\"3-reasons-graphene-thermal-pad-excels-in-osfp\" class=\"wp-block-heading\">3 Reasons Graphene Thermal Pad Excels In OSFP<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Graphene Thermal Pad for 1.6T OSFP High-Speed Optical Module applications face serious heat in tightly packed switch hardware. A well-matched pad moves that heat toward the cooling assembly while maintaining electrical separation. Sheen Materials offers thermal interface options designed around these demanding OSFP operating conditions.<\/p>\n\n\n\n<h3 id=\"superior-thermal-conductivity-for-1-6t-osfp-optical-modules\" class=\"wp-block-heading\">Superior Thermal Conductivity for 1.6T OSFP Optical Modules<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Graphene Thermal Pad for 1.6T OSFP High-Speed Optical Module designs benefit from high&nbsp;<strong>\u0627\u0644\u062a\u0648\u0635\u064a\u0644 \u0627\u0644\u062d\u0631\u0627\u0631\u064a<\/strong>, since a power-dense&nbsp;<strong>1.6T OSFP<\/strong>&nbsp;can create concentrated hot spots.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Heat spreading\n<ul class=\"wp-block-list\">\n<li>A thin&nbsp;<strong>graphene pad<\/strong>&nbsp;carries heat away from the&nbsp;<strong>optical module<\/strong>&nbsp;surface.<\/li>\n\n\n\n<li>\u0623\u0641\u0636\u0644&nbsp;<strong>\u062a\u0628\u062f\u064a\u062f \u0627\u0644\u062d\u0631\u0627\u0631\u0629<\/strong>&nbsp;helps limit local temperature rise.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Cooling support\n<ul class=\"wp-block-list\">\n<li>The pad links the&nbsp;<strong>high-speed transceiver<\/strong>&nbsp;with nearby cooling hardware.<\/li>\n\n\n\n<li>Effective&nbsp;thermal management&nbsp;can support steadier operation under heavy traffic.<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<h3 id=\"ultra-low-thermal-impedance-in-high-speed-transceivers\" class=\"wp-block-heading\">Ultra-Low Thermal Impedance in High-Speed Transceivers<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">\u0645\u0646\u062e\u0641\u0636\u0629&nbsp;<strong>\u0627\u0644\u0645\u0639\u0627\u0648\u0642\u0629 \u0627\u0644\u062d\u0631\u0627\u0631\u064a\u0629<\/strong>&nbsp;matters because conductivity alone does not tell the whole story.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>At the interface:<\/strong>&nbsp;A conformable&nbsp;<strong>graphene material<\/strong>&nbsp;can reduce&nbsp;<strong>\u0645\u0642\u0627\u0648\u0645\u0629 \u0627\u0644\u062a\u0644\u0627\u0645\u0633<\/strong>&nbsp;across small surface gaps.<\/li>\n\n\n\n<li><strong>Across the pad:<\/strong>&nbsp;\u0623\u0642\u0644&nbsp;<strong>interface resistance<\/strong>&nbsp;supports efficient&nbsp;<strong>\u0646\u0642\u0644 \u0627\u0644\u062d\u0631\u0627\u0631\u0629<\/strong>&nbsp;from the&nbsp;<strong>high-speed transceiver<\/strong>&nbsp;into its heat sink.<\/li>\n\n\n\n<li><strong>In service:<\/strong>&nbsp;Good fit and controlled thickness help maintain predictable&nbsp;<strong>\u0627\u0644\u0623\u062f\u0627\u0621 \u0627\u0644\u062d\u0631\u0627\u0631\u064a<\/strong>.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">That makes Graphene Thermal Pad for 1.6T OSFP High-Speed Optical Module integration practical when every degree counts.<\/p>\n\n\n\n<h3 id=\"outstanding-electrical-insulating-property\" class=\"wp-block-heading\">Outstanding Electrical Insulating Property<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>\u0627\u0644\u0639\u0632\u0644 \u0627\u0644\u0643\u0647\u0631\u0628\u0627\u0626\u064a<\/strong>&nbsp;adds another layer of protection where conductive parts sit close together.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Isolation property:<\/strong>&nbsp;An insulating&nbsp;<strong>graphene pad<\/strong>&nbsp;can separate electrical surfaces while still conducting heat.<\/li>\n\n\n\n<li><strong>Dielectric strength:<\/strong>&nbsp;The specified rating should match voltage, pad thickness, and OSFP design needs.<\/li>\n\n\n\n<li><strong>Electronic safety:<\/strong>&nbsp;Proper insulation supports&nbsp;short-circuit<strong> protection<\/strong>&nbsp;and can help avoid unwanted electrical paths that may affect&nbsp;<strong>\u0633\u0644\u0627\u0645\u0629 \u0627\u0644\u0625\u0634\u0627\u0631\u0629<\/strong>.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Sheen Materials can match an insulating graphene thermal interface pad to mechanical, thermal, and dielectric targets rather than treating insulation as a one-size-fits-all spec.<\/p>\n\n\n\n<h2 id=\"overheating-modules-use-graphene-thermal-pad-now\" class=\"wp-block-heading\">Overheating Modules? Use Graphene Thermal Pad Now<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">A Graphene Thermal Pad for 1.6T OSFP High-Speed \u200b\u200bOptical Module gives concentrated heat a wider path to escape. In tightly packed networking gear, that matters a lot: controlled contact, slim material, accurate cutting, and stable performance help keep demanding optical links running cooler.<\/p>\n\n\n\n<h3 id=\"why-graphene-pads-combat-thermal-runaway-in-networking-hardware\" class=\"wp-block-heading\">Why Graphene Pads Combat Thermal Runaway in Networking Hardware<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A&nbsp;<strong>graphene thermal pad<\/strong>&nbsp;spreads heat from a&nbsp;<strong>high-speed optical module<\/strong>&nbsp;before a local hotspot pushes temperatures upward.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Heat path\n<ul class=\"wp-block-list\">\n<li>High in-plane&nbsp;<strong>\u0627\u0644\u062a\u0648\u0635\u064a\u0644 \u0627\u0644\u062d\u0631\u0627\u0631\u064a<\/strong>&nbsp;moves energy toward a larger cooling area.<\/li>\n\n\n\n<li>\u0623\u0641\u0636\u0644&nbsp;<strong>\u062a\u0628\u062f\u064a\u062f \u0627\u0644\u062d\u0631\u0627\u0631\u0629<\/strong>&nbsp;supports steadier&nbsp;<strong>\u0627\u0644\u062a\u062d\u0643\u0645 \u0641\u064a \u062f\u0631\u062c\u0629 \u0627\u0644\u062d\u0631\u0627\u0631\u0629<\/strong>&nbsp;in dense&nbsp;<strong>networking hardware<\/strong>.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Hotspot management\n<ul class=\"wp-block-list\">\n<li>Lower peak temperature can reduce conditions that contribute to&nbsp;<strong>\u0627\u0644\u0647\u0631\u0648\u0628 \u0627\u0644\u062d\u0631\u0627\u0631\u064a<\/strong>.<\/li>\n\n\n\n<li>A Graphene Thermal Pad for 1.6T OSFP High-Speed \u200b\u200bOptical Module can connect a hot module surface with the intended cooling structure.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-table is-style-stripes\"><table class=\"has-fixed-layout\"><thead><tr><th>Operating case<\/th><th>Module load<\/th><th>Hotspot risk<\/th><th>Thermal goal<\/th><\/tr><\/thead><tbody><tr><td>Moderate traffic<\/td><td>50%<\/td><td>\u0645\u062a\u0648\u0633\u0637<\/td><td>&lt;85\u00b0C<\/td><\/tr><tr><td>Heavy traffic<\/td><td>80%<\/td><td>\u0639\u0627\u0644\u064a\u0629<\/td><td>&lt;85\u00b0C<\/td><\/tr><tr><td>Full traffic<\/td><td>100%<\/td><td>Highest<\/td><td>&lt;85\u00b0C<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">These values illustrate design targets, not guaranteed device results.<\/p>\n\n\n\n<h3 id=\"achieving-thin-profiles-thickness-and-flexibility-advantages\" class=\"wp-block-heading\">Achieving Thin Profiles: Thickness and Flexibility Advantages<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A&nbsp;<strong>thin profile<\/strong>&nbsp;suits the tight&nbsp;<strong>space constraint<\/strong>&nbsp;around an OSFP cage. That small detail can save a lot of assembly hassle.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>\u0645\u062a\u062d\u0643\u0645 \u0641\u064a\u0647&nbsp;<strong>\u0627\u0644\u0633\u064f\u0645\u0643<\/strong>&nbsp;preserves the intended module&nbsp;<strong>form factor<\/strong>.<\/li>\n\n\n\n<li>\u0627\u0644\u0645\u0648\u0627\u062f&nbsp;<strong>\u0627\u0644\u0645\u0631\u0648\u0646\u0629<\/strong>&nbsp;\u0648&nbsp;<strong>mechanical compliance<\/strong>&nbsp;help bridge minor height tolerances without heavy clamping pressure.<\/li>\n\n\n\n<li>A suitable&nbsp;<strong>bending radius<\/strong>&nbsp;lets a graphene pad follow the contact geometry while avoiding sharp folds.<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">The result is a slimmer thermal path for 1.6T OSFP hardware.<\/p>\n\n\n\n<h3 id=\"precision-slitting-surface-treatment-for-perfect-module-contact\" class=\"wp-block-heading\">Precision Slitting &amp; Surface Treatment for Perfect Module Contact<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Good heat spreading still depends on close&nbsp;<strong>module contact<\/strong>.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Manufacturing control\n<ul class=\"wp-block-list\">\n<li>Precision<strong> slitting<\/strong>&nbsp;\u0648&nbsp;<strong>\u0642\u0637\u0639 \u0627\u0644\u0642\u0648\u0627\u0644\u0628<\/strong>&nbsp;set clean dimensions for OSFP parts.<\/li>\n\n\n\n<li>\u0645\u062a\u062d\u0643\u0645 \u0641\u064a\u0647&nbsp;<strong>flatness<\/strong>&nbsp;reduces gaps that can trap insulating air.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Interface preparation\n<ul class=\"wp-block-list\">\n<li><strong>Surface treatment<\/strong>&nbsp;can improve fit and handling.<\/li>\n\n\n\n<li>\u0623\u0642\u0644&nbsp;<strong>interface resistance<\/strong>&nbsp;helps the&nbsp;<strong>\u0645\u0627\u062f\u0629 \u0627\u0644\u0648\u0627\u062c\u0647\u0629 \u0627\u0644\u062d\u0631\u0627\u0631\u064a\u0629<\/strong>&nbsp;transfer heat into the cooling assembly.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Adhesive backing and release liners also make placement less fiddly during production.<\/p>\n\n\n\n<h3 id=\"compliance-and-reliability-thermal-aging-resistance-rohs-standard\" class=\"wp-block-heading\">Compliance and Reliability: Thermal Aging Resistance &amp; RoHS Standard<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Long service life calls for stable material properties, not just good day-one numbers.&nbsp;<strong>Thermal aging<\/strong>&nbsp;testing checks&nbsp;<strong>\u0627\u0633\u062a\u0642\u0631\u0627\u0631 \u0637\u0648\u064a\u0644 \u0627\u0644\u0623\u062c\u0644<\/strong>&nbsp;\u0648&nbsp;<strong>\u0645\u0642\u0627\u0648\u0645\u0629 \u0627\u0644\u062d\u0631\u0627\u0631\u0629<\/strong>&nbsp;after extended temperature exposure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For practical qualification, buyers can also review the&nbsp;<strong>RoHS standard<\/strong>,&nbsp;<strong>environmental compliance<\/strong>, and controls on each&nbsp;<strong>hazardous substance<\/strong>. Flame-retardant and halogen-free choices may suit specific equipment specifications, while documented&nbsp;<strong>\u0627\u0644\u0645\u0648\u062b\u0648\u0642\u064a\u0629<\/strong>&nbsp;data helps engineers compare graphene thermal pad options for demanding network hardware.<\/p>\n\n\n\n<h2 id=\"sheen-materials-1-6t-osfp-thermal-interface-material-project\" class=\"wp-block-heading\">Sheen Materials 1.6T OSFP Thermal Interface Material Project<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">There are currently two mainstream thermal designs for 1.6T OSFP high-speed optical modules:<\/p>\n\n\n\n<h3 id=\"project-overview\" class=\"wp-block-heading\">Project Overview<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\" id=\"rhs-riding-heat-sink\"><strong>RHS: Riding Heat Sink<\/strong><\/p>\n\n\n\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-74359ac\" id=\"gspb_image-id-gsbp-74359ac\"><img decoding=\"async\" src=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/09\/1.6T-OSFP-RHS-Riding-Heat-Sink-Product-Structure.webp\" data-src=\"\" alt=\"\" loading=\"lazy\" width=\"1672\" height=\"941\"\/><\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>IHS: Integrated Heat Sink<\/strong><\/p>\n\n\n\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-eed062f\" id=\"gspb_image-id-gsbp-eed062f\"><img decoding=\"async\" src=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/09\/1.6T-OSFP-Optical-Transceiver-Heat-Sink-Structures.webp\" data-src=\"\" alt=\"\" loading=\"lazy\" width=\"1672\" height=\"941\"\/><\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Primary heat source of the 1.6T OSFP:<\/strong> The DSP (Digital Signal Processing) chip, utilizing a 3nm process and bare-die packaging; typical power consumption is approximately 17W, and the die size is roughly 6mm x 5mm.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Heat Transfer Path:<\/strong> DSP \u2192 Thermal interface material \u2192 Heat sink<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>DSP Chips: <\/strong>Broadcom and Marvell offer the mainstream solutions in the industry.<\/li>\n\n\n\n<li><strong>Thermal Interface Materials:<\/strong> Currently, the technology is primarily divided into two main categories\u2014post-curing thermal gels and graphene thermal pads.<\/li>\n\n\n\n<li><strong>Heat Sink: <\/strong>Mainstream industry thermal management solutions encompass various configurations; this project employs an architecture featuring an aluminum alloy housing with CNC-machined raised mounting pads, combined with a saddle-mount heat sink and air cooling.<\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>  Aluminum alloy housing with CNC-machined raised features.<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>  Extruded copper air duct with CNC-machined raised features.<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>  Integrated vapor chamber (VC) heatsink.<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>  Next-generation option: Molded copper-diamond composite housing.<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>  Indirect liquid cooling: Refrigerant flow channels integrated into the housing.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">    4. <strong>Assembly clearance: <\/strong>The design clearance between the thermal interface material and the CNC-machined boss on the housing is approximately 0.3 mm.<\/p>\n\n\n\n<h3 id=\"competitor-solutions-and-project-pain-points\" class=\"wp-block-heading\">Competitor Solutions and Project Pain Points<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">During the preliminary stage of the thermal management solution design, the user evaluated mainstream post-curing thermal gel products in the industry:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Competitor A: a single-component, post-curing thermal gel with a thermal conductivity of 12 W\/m\u00b7K;<\/li>\n\n\n\n<li>Competitor B: a two-component thermal gel with a thermal conductivity of 14.5 W\/m\u00b7K.<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">Following accelerated curing at 85\u00b0C for two hours, debonding was observed at the interfaces between the thermal gel and both the bare die and the housing boss. This resulted in a significant increase in interfacial thermal resistance, causing the DSP chip&#8217;s temperature rise to exceed limits and failing to meet long-term product reliability requirements.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Given that this failure recurred in 100% of cases across multiple iterative tests, the customer decided to abandon the thermal gel curing approach in favor of a graphene thermal pad solution, while also specifying clear technical requirements.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Technical Specification Requirements\uff1a<\/strong><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Initial gasket thickness: 0.3 mm; interfacial thermal resistance &lt; 0.1\u00b0C\u00b7cm\u00b2\/W at 40% compression.<\/li>\n\n\n\n<li>Compressive stress &lt; 40 psi at 40% compression.<\/li>\n\n\n\n<li>Rebound rate \u2265 90%.<\/li>\n\n\n\n<li>Appearance: No powder shedding; free from significant cracks, indentations, or pits.<\/li>\n\n\n\n<li>Edge protection: Side edge sealing\/coating required.<\/li>\n\n\n\n<li>Single-sided dispensing required; dispensing location customizable.<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Thermal design target: DSP chip junction temperature Tj &lt; 85\u00b0C<\/strong><\/p>\n\n\n\n<h3 id=\"sheen-materials-solutions\" class=\"wp-block-heading\">Sheen Materials Solutions<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Product Recommendation: <\/strong><a href=\"https:\/\/www.sheenmaterials.com\/ar\/graphene-thermal-pad-gsf90-03\/\">GSF90-03<\/a><\/p>\n\n\n\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-1b4b6f4\" id=\"gspb_image-id-gsbp-1b4b6f4\"><img decoding=\"async\" src=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/06\/Sheen-Materials-Graphene-thermal-pad-scaled.jpg\" data-src=\"\" alt=\"Sheen Material's Graphene thermal pad\" loading=\"lazy\" width=\"2560\" height=\"1920\"\/><\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Protection and Structural Design:<\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2460 Surface-mount capacitors are densely arranged around the DSP chip, with a clearance of only 0.5 mm to 1.0 mm between the chip edge and the components; loose graphene debris poses a significant risk of causing capacitor short circuits.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2461 The project employs a dual-protection strategy: damming adhesive is applied at the base, combined with a foam frame to provide a physical barrier; simultaneously, positioning grooves are incorporated into the inner surface of the metal housing, paired with custom positioning tooling to ensure assembly alignment accuracy.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Production Line Compatibility: <\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Designed for automated vacuum suction cup operations during mass production, enhancing assembly efficiency and consistency to meet large-scale manufacturing requirements.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Actual performance results<\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Test conditions: ambient temperature of 45\u00b0C and effective airflow of approximately 15 CFM. The measured junction temperature of the DSP chip was approximately 76\u00b0C, outperforming the design target of Tj &lt; 85\u00b0C; the thermal performance meets the requirements for the entire unit.<\/p>\n\n\n\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-e4dac21\" id=\"gspb_image-id-gsbp-e4dac21\"><img decoding=\"async\" src=\"https:\/\/www.sheenmaterials.com\/wp-content\/uploads\/2026\/06\/Graphene-Thermal-PadVertical-orientation-scaled.webp\" data-src=\"\" alt=\"Graphene Thermal Pad(Vertical orientation)\" loading=\"lazy\" width=\"2268\" height=\"2560\"\/><\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>","protected":false},"excerpt":{"rendered":"<p>Bulk buyers: size up a Graphene Thermal Pad for 1.6T OSFP High-Speed \u200b\u200bOptical Module for thermal fit, insulation, compliance &#038; reliability.<\/p>","protected":false},"author":1,"featured_media":4043,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_gspb_post_css":"#gspb_image-id-gsbp-74359ac,#gspb_image-id-gsbp-eed062f{text-align:center}#gspb_image-id-gsbp-1b4b6f4 img,#gspb_image-id-gsbp-74359ac img,#gspb_image-id-gsbp-e4dac21 img,#gspb_image-id-gsbp-eed062f img{vertical-align:top;display:inline-block;box-sizing:border-box;max-width:100%;height:auto}","footnotes":"","_llm_markdown_disabled":false},"categories":[36],"tags":[],"class_list":["post-4038","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-use-guides"],"_links":{"self":[{"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/posts\/4038","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/comments?post=4038"}],"version-history":[{"count":5,"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/posts\/4038\/revisions"}],"predecessor-version":[{"id":4054,"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/posts\/4038\/revisions\/4054"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/media\/4043"}],"wp:attachment":[{"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/media?parent=4038"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/categories?post=4038"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sheenmaterials.com\/ar\/wp-json\/wp\/v2\/tags?post=4038"}],"curies":[{"name":"\u062f\u0628\u0644\u064a\u0648 \u0628\u064a","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}