---
title: "Server"
id: "120"
type: "page"
slug: "server"
published_at: "2026-02-06T02:31:59+00:00"
modified_at: "2026-08-14T00:59:31+00:00"
url: "https://www.sheenmaterials.com/applications/communication-and-ai-infrastructure/server/"
markdown_url: "https://www.sheenmaterials.com/applications/communication-and-ai-infrastructure/server.md"
excerpt: "Server Servers and AI infrastructure generate concentrated heat from CPUs/GPUs, memory, VRMs, and power modules under 24/7 workloads. Poor heat transfer can cause throttling, reduced efficiency, and higher failure risk. Thermal interface materials (TIMs) create low-resistance heat paths to heat..."
---

# Server

Servers and AI infrastructure generate concentrated heat from CPUs/GPUs, memory, VRMs, and power modules under 24/7 workloads. Poor heat transfer can cause throttling, reduced efficiency, and higher failure risk.

Thermal interface materials (TIMs) create low-resistance heat paths to heat sinks, cold plates, and chassis to: ① reduce hotspots and prevent throttling; ② improve long-term reliability; ③ support higher power density and stable performance.

[Get Support](https://www.sheenmaterials.com/support/)

[Library](#Library)

[TDS Download](https://www.sheenmaterials.com/resource/datasheet-download/)

Overview

## Server (TIMs) Solutions

Modern servers and AI infrastructure run sustained, high-load workloads that generate concentrated heat from CPUs/GPUs, memory, VRMs, and power modules. If heat is not removed efficiently, systems may throttle, lose performance, and experience accelerated component aging.

Thermal interface materials (TIMs) create low-resistance heat paths to heat sinks or cold plates—supporting stable performance and higher power density.

Benefits

## Thermal Materials for Data Center & AI Servers

**Lower Hotspots on CPUs/GPUs**

Efficient heat transfer to heat sinks or cold plates for stable, sustained compute performance.

**Gap Filling for Complex Stack-Ups**

Conformable materials bridge uneven surfaces—lower thermal resistance and consistent contact pressure.

**Long-Term Reliability in 24/7 Operation**

Options designed for thermal cycling help reduce aging and improve uptime.

**Custom Converting + Fast Support**

Custom thickness and die-cut parts for server layouts—rapid sampling for validation and production ramp.

## Related Products

Discover product categories commonly used in this application. You can replace these cards with your own thermal materials, TIMs, foams, tapes, or soldering-related products.

![Image](https://www.sheenmaterials.com/wp-content/uploads/2026/02/Carbon-Fiber-Thermal-Pad-Series-1.webp)

### Thermal Pads

Soft, conformable thermal pads for gap filling and reliable heat transfer in electronics.

[Browse ›](#)

### Thermal Grease

High-efficiency thermal grease solutions for CPUs, power modules, and industrial assemblies.

[Browse ›](#)

### Silicone Foam

Foam materials for sealing, cushioning, insulation, and fire-barrier applications.

[Browse ›](#)

### Thermal Tape

PSA laminated thermal tapes for fast assembly and consistent thermal interface bonding.

[Browse ›](#)

### Graphite Sheet

High in-plane conductivity graphite materials for heat spreading in compact devices.

[Browse ›](#)

### EMI Absorbers

EMI absorbing materials to reduce interference and improve signal integrity in electronics.

[Browse ›](#)

←→

## Related Applications

## AI Server / GPU Acceleration

igh power density on GPUs/accelerators—TIMs support stable performance with efficient heat transfer to cold plates/heatsinks.

[Explore](https://www.sheenmaterials.com/applications/communication-and-ai-infrastructure/ai-server/)

## Data Center Infrastructure

24/7 operation demands thermal stability—reduce hotspots on CPUs/VRMs/memory for better uptime and reliability.

[Explore](https://www.sheenmaterials.com/applications/communication-and-ai-infrastructure/data-center/)

## Telecom & Networking

Manage heat in compact RF and high-speed networking hardware—improve stability and long-term reliability.

[Explore](https://www.sheenmaterials.com/applications/communication-and-ai-infrastructure/telecom/)

## Related Infrastructure Markets

Thermal interface materials for servers are also widely used across high-power computing and communications infrastructure—helping manage heat density and improve 24/7 reliability.

9##### High-Performance Computing

19##### 5G Infrastructure

8##### RF/Microwave

13##### Compound Semiconductor