--- title: "Automotive Non-Silicone Thermal Management Solutions | Sheen" id: "2758" type: "page" slug: "non-silicone-thermal-management" published_at: "2026-04-02T07:56:19+00:00" modified_at: "2026-08-14T01:05:40+00:00" url: "https://www.sheenmaterials.com/applications/auto/non-silicone-thermal-management/" markdown_url: "https://www.sheenmaterials.com/applications/auto/non-silicone-thermal-management.md" excerpt: "Overview Benefits Specs Applications Markets Download TDS Why Non-Silicone Thermal Pads Matter Non-Silicone Thermal Management for EV Battery Systems and Sensitive Electronics Non-silicone thermal pads are engineered for applications where heat transfer, cleanliness, and long-term reliability must be balanced. They..." --- # Non-Silicone Thermal Management for EV Battery Systems As the “bridge” in an electronic thermal management system, thermal interface materials directly affect the service life and stability of key components such as chips and batteries. Compared with conventional silicone-based materials, non-silicone thermal products are designed for cleaner and more reliable operation in silicone-sensitive applications. [Get Support](https://www.sheenmaterials.com/support/) Why Non-Silicone Thermal Pads Matter ## Non-Silicone Thermal Management for EV Battery Systems and Sensitive Electronics Non-silicone thermal pads are engineered for applications where heat transfer, cleanliness, and long-term reliability must be balanced. They are especially suitable for EV battery systems, automotive electronics, optical communication modules, SSD storage, monitoring devices, and other assemblies where silicone migration or volatile residue may create performance risk. ### Developed for Silicone-Sensitive Thermal Interfaces Traditional silicone-based thermal interface materials are widely used for gap filling and heat dissipation. However, in contamination-sensitive assemblies such as BDU, BMS, cameras, optical modules, and storage devices, silicone oil bleed or volatile siloxanes may affect long-term system reliability. Non-silicone thermal pads use silicone-free polymer systems to help reduce contamination risk while maintaining stable thermal transfer in compact electronic structures. **01**#### Long-Term Thermal Stability Lower migration risk helps support more stable thermal performance during extended service and aging. **02**#### Optical Fogging Risk Reduced volatile residue helps protect optical surfaces such as lenses, sensors, and transmitter windows. **03**#### Electrical Contact Cleanliness Cleaner interfaces may help reduce contamination risk around relay contacts, terminals, and PCB assemblies. **04**#### Dust Attraction in Storage Devices Less bleeding residue helps lower the chance of dust adhesion in SSD and other precision electronic assemblies. Integrity · Professionalism · Win-Win · User-OrientedSheen Key Benefits of Non-Silicone Thermal Pads ## Key Benefits of Non-Silicone Thermal Pads Sheen AF Series non-silicone thermal pads are designed to support cleaner thermal interfaces in automotive, optical, and precision electronics. The material system combines low bleed behavior, practical thermal conductivity options, and reliable mechanical performance for long-term use. I### No Silicone Oil Bleed Helps avoid silicone oil migration and supports cleaner thermal interfaces in contamination-sensitive assemblies. II### Low Volatile Contamination Risk Suitable for applications where fogging, surface residue, or silicone-sensitive components are a concern. III### 1.5–10 W/m·K Thermal Conductivity Multiple conductivity grades help match different heat loads, gap conditions, and product designs. IV### Reliable Heat Aging Performance Designed for long-term thermal management with good heat aging resistance and stable physical performance. V### Balanced Toughness and Strength Good toughness, tensile strength, and compression behavior help improve handling and assembly reliability. VI### Natural Tack for Easier Assembly Surface tack helps simplify pad placement during installation and supports convenient manual or automated assembly. Feature ImageImage Position 01 **Figure F01. Non-silicone thermal pad feature overview**Representative image showing the core characteristics of Sheen non-silicone thermal pad materials. Feature ImageImage Position 02 **Figure F02. Material performance and handling display**Visual summary of performance and application characteristics for non-silicone thermal pads. Integrity · Professionalism · Win-Win · User-OrientedSheen AF Series Non-Silicone Thermal Pad Specifications ## AF Series Non-Silicone Thermal Pad Specifications The AF Series covers a practical range of thermal conductivity, hardness, compression, and thickness options for EV battery systems, automotive electronics, optical modules, and other precision electronic assemblies. The table below summarizes the typical thermal and physical parameters. | Model | Thermal ConductivityW/m·K | Thermal Resistance℃·in²/W @ 50 psi, 1 mm | Thicknessmm | Typical HardnessShore 00 | Compression@ 30 psi, 1 mm | Elongation | Working Temperature℃ | | --- | --- | --- | --- | --- | --- | --- | --- | | AF100 | 1.5 | 1.10 | 0.5–5.0 | 55 / 70 | 35% | 100% | -40 ~ 125 | | AF300 | 2.0 | 0.80 | 0.5–5.0 | 55 / 70 | 30% | 70% | -40 ~ 125 | | AF500 | 3.0 | 0.60 | 0.5–5.0 | 55 / 70 | 30% | 70% | -40 ~ 125 | | AF600D | 4.0 | 0.40 | 0.5–5.0 | 55 / 70 | 30% | 50% | -40 ~ 120 | | AF600 | 5.0 | 0.30 | 0.5–5.0 | 70 | 20% | 40% | -40 ~ 120 | | AF600G | 6.0 | 0.25 | 0.5–5.0 | 70 | 20% | 40% | -40 ~ 120 | | AF800 | 8.0 | 0.20 | 1.0–5.0 | 70 | 20% | 30% | -40 ~ 120 | | AF1000 | 10.0 | 0.18 | 1.0–5.0 | 70 | 20% | 30% | -40 ~ 120 | Integrity · Professionalism · Win-Win · User-OrientedSheen Low Bleed Performance and Aging Reliability ## Oil Bleed Comparison and Reliability Validation For silicone-sensitive applications, low bleed behavior is one of the main reasons to select a non-silicone thermal interface material. The comparison below highlights the difference in bleed behavior, while the aging test results show the stability of AF500 after prolonged heat exposure. Oil Bleed Comparison: Silicone vs. Non-Silicone Pads At the same thermal conductivity level, the oil bleed ring diameter of a silicone thermal pad can be several times or even dozens of times larger than that of a non-silicone thermal pad. AF500 Heat Aging Reliability Test After aging at 110°C for 1008 hours, AF500 maintained acceptable thermal conductivity and hardness, with no visible appearance change. Integrity · Professionalism · Win-Win · User-OrientedSheen Application Cases ## Application Cases for EV Battery Systems, Automotive Electronics, and Precision Devices Non-silicone thermal pads are most valuable in contamination-sensitive thermal interfaces. Typical applications include EV battery packs, BDU, BMS, cameras, ADAS, LiDAR, optical transceivers, SSD storage, and other precision electronic modules that require clean and stable heat transfer. ### EV Battery Systems Typical application points include battery packs, BDU, and BMS assemblies. ### Automotive Electronics Used in vehicle cameras, ADAS, LiDAR, LED modules, and related electronics. ### Optical Communication Suitable for optical transceivers, transmitter modules, and high-speed communication hardware. ### Precision Electronics Applicable to SSD, monitoring devices, industrial cameras, and other silicone-sensitive electronics. Application ImageEV Battery / BDU **Figure A01. BDU thermal management in new energy vehicles**Typical non-silicone thermal pad application in a battery disconnect unit for cleaner long-term heat transfer. Application ImageEV Battery / BMS **Figure A02. BMS thermal management in EV battery systems**Application example showing silicone-free thermal materials used in battery management and localized heat control areas. Integrity · Professionalism · Win-Win · User-OrientedSheen EV Battery Systems / BDU Application 01### BDU Thermal Management in EV Battery Packs Non-silicone thermal pads are widely used in EV battery systems where electrical contacts, localized hot spots, and contamination-sensitive assemblies require cleaner long-term thermal management. In the BDU, typical thermal interface positions include **power contactors**, **high-voltage connection bars**, and other concentrated heat sources. **Figure 01. Battery disconnect unit structure**Internal BDU assembly showing the main components inside an EV battery system. **Figure 02. Typical thermal pad placement in BDU**Representative thermal interface locations for heat transfer and contamination control inside the BDU. **BDU (Battery Disconnect Unit)** is one of the core assemblies inside the battery pack. It integrates relays, fuses, current sensing elements, external high-voltage copper bars, signal terminals, and motion connectors. In long-term service, conventional silicone thermal pads may release low-molecular siloxanes that can migrate onto relay contacts or PCB surfaces. Non-silicone thermal pads help reduce that risk while supporting stable heat transfer. **Typical application points:** power contactors, high-voltage connection bars, and nearby hot spots. EV Battery Systems / BMS Application 02### BMS Thermal Management for Control Boards and Chips Non-silicone thermal materials are widely used in **battery management systems (BMS)**, where control boards, local power devices, and compact chips require stable heat transfer in a contamination-sensitive environment. Typical thermal points include **BMS chips**, control modules, and nearby heat-generating components. **Figure 03. Battery management system overview**Typical battery system architecture showing the broader BMS structure inside a new energy vehicle battery pack. **Figure 04. BMS control module detail**Example of compact thermal control layout in a BMS module where stable heat transfer is required. **Figure 05. BMS chip thermal interface detail**Typical non-silicone thermal material application near BMS chips and adjacent localized heat sources. **BMS (Battery Management System)** is responsible for battery monitoring, protection, balancing, and maintenance. In compact electrical structures, reliable thermal management is essential to long-term stability. Compared with conventional silicone-based materials, non-silicone thermal pads help reduce contamination risk in silicone-sensitive battery control assemblies. **Typical application points:** BMS chips, control boards, and nearby localized heat sources. EV Battery Systems / BMS Chip-Level Design Application 02B### BMS Chip and Localized Hot Spot Thermal Management This case further illustrates how non-silicone thermal materials are used around **BMS chip-level thermal interfaces**. In compact battery control assemblies, local chips and control circuits require clean and stable thermal transfer to support safe, efficient, and reliable battery operation. **Figure 06. Pack-level battery management system overview**Representative battery pack structure showing the broader BMS-related assembly. **Figure 07. BMS chip thermal application detail**Typical application point highlighting non-silicone thermal material placement around the BMS chip area. **BMS (Battery Management System)** is used for intelligent monitoring, management, and maintenance of battery units. In chip-level thermal interfaces, non-silicone thermal pads help provide cleaner heat transfer while reducing the contamination risk associated with silicone-sensitive control assemblies. **Typical application point:** BMS chips and adjacent localized hot spots. Automotive Electronics Application 03### Non-Silicone Thermal Pads for Cameras, ADAS, LiDAR, and LED Modules Non-silicone thermal materials are widely used in **automotive electronics**, especially in contamination-sensitive modules such as vehicle cameras, ADAS sensors, LiDAR, and LED lamp assemblies. Compared with conventional silicone-based materials, they help provide cleaner heat transfer and improved long-term reliability in optical and electronic vehicle systems. **Figure 08. Automotive electronics application overview**Representative application showing non-silicone thermal materials used in vehicle electronic modules. **Figure 09. Optical and sensing module detail**Typical thermal interface application in vehicle camera, ADAS, LiDAR, or related optical electronic hardware. **Automotive electronics** include vehicle cameras, ADAS sensors, LiDAR, audio and video systems, and LED lamps. These modules require efficient heat transfer and lower contamination risk to help preserve optical clarity and electrical reliability. **Typical application points:** camera modules, ADAS / LiDAR sensing areas, optical regions, and nearby thermal interface positions. Optical Communication Application 04### Non-Silicone Thermal Management for Optical Modules and Transceivers Non-silicone thermal materials are widely used in **optical communication** equipment, especially in high-speed transceivers and optical modules where low contamination risk and stable heat transfer are both critical. In optical module transmitter and IC chip positions, silicone-free thermal pads help support cleaner and more reliable thermal management. **Figure 10. 10 W/m·K non-silicone thermal pad for optical transmitters and IC chips**Typical thermal interface application in optical module transmitter and IC chip areas. **Figure 11. 800G / 1.6T high-speed OSFP transceiver**Representative high-speed optical communication module requiring efficient, clean, and stable heat dissipation. **Optical communication applications:** optical transmission equipment, optical transceivers, transmitters, and related high-speed communication modules. Monitoring Devices / SSD Storage Application 05### Monitoring Devices, Camera Systems, and SSD Storage Non-silicone thermal materials are suitable for **monitoring devices, camera equipment, SSD storage systems,** and other precision electronics where optical cleanliness and dust control are important to long-term performance. Monitoring and camera equipment: volatile residue generated during heating may condense on optical surfaces, contaminate lenses, and reduce image clarity. SSD storage devices: bleeding silicone oil may attract dust and contaminate critical components, increasing the risk of read/write instability and storage failure. Target Markets ## Target Markets for Non-Silicone Thermal Management Sheen non-silicone thermal pads are suitable for industries where both thermal performance and cleanliness matter. The strongest opportunities are in EV battery systems, automotive electronics, optical communication, and precision electronic devices that are sensitive to contamination. Market 01### EV Battery Systems Suitable for battery packs, BDU, and BMS modules where silicone-sensitive structures require stable thermal transfer and lower contamination risk. - Battery pack electronics - Power contactor areas - BMS control boards and chips Market 02### Automotive Electronics Supports cleaner thermal interfaces in cameras, ADAS, LiDAR, LED lighting, and other compact vehicle electronics. - Vehicle cameras - ADAS and LiDAR modules - Automotive LED systems Market 03### Optical Communication Fits optical transmission equipment and transceiver modules that require low bleed behavior, high cleanliness, and reliable heat dissipation. - 800G / 1.6T transceivers - OSFP optical modules - High-speed communication hardware Market 04### Industrial and Precision Electronics Applicable to SSD, monitoring devices, industrial cameras, and 3D printers where optical clarity or dust control is important. - Monitoring devices - SSD and storage systems - Industrial cameras and printers Integrity · Professionalism · Win-Win · User-OrientedSheen AE Series Non-Silicone Thermal Gel ## AE Series Non-Silicone Thermal Gel Product Introduction In addition to pad materials, Sheen also provides AE Series non-silicone thermal gel for applications that require a dispensable, gap-filling, silicone-free thermal interface solution. ### Dispensable Silicone-Free Thermal Interface Option Sheen also provides AE Series non-silicone thermal gel for silicone-sensitive electronic assemblies. Available grades include AE10-LT, AE20-LT, AE30-LT, AE40-LT, and AE60-LT. Thermal conductivity range: 1.0 W/m·K to 6.0 W/m·K. Suitable for applications where dispensable materials are preferred over pad structures for complex surfaces or controlled dispensing processes. | Model | Color | Thermal ConductivityW/m·K | Extrusion Rateg/min, 30cc, 90 psi | Densityg/cc | | --- | --- | --- | --- | --- | | AE10-LT | Gray | 1.0 | 40 ± 10 | 2.0 | | AE20-LT | Gray | 2.0 | 40 ± 10 | 2.9 | | AE30-LT | Gray | 3.0 | 20 ± 10 | 3.0 | | AE40-LT | Gray | 4.0 | 20 ± 10 | 3.1 | | AE60-LT | Gray | 6.0 | 14 ± 2 | 3.3 | Integrity · Professionalism · Win-Win · User-OrientedSheen